JP6461896B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- JP6461896B2 JP6461896B2 JP2016251389A JP2016251389A JP6461896B2 JP 6461896 B2 JP6461896 B2 JP 6461896B2 JP 2016251389 A JP2016251389 A JP 2016251389A JP 2016251389 A JP2016251389 A JP 2016251389A JP 6461896 B2 JP6461896 B2 JP 6461896B2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 101100033865 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) RFA1 gene Proteins 0.000 description 4
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- 229910052779 Neodymium Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical class C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
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- 229910052721 tungsten Inorganic materials 0.000 description 1
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/822—Cathodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80521—Cathodes characterised by their shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
Description
Claims (12)
- 表示部と前記表示部の他の非表示部を含むプラスチック基板と、
前記非表示部の一側に配置され、軟性回路基板が付着されるデータパッド部と、を含み、
前記表示部は、前記表示部上に位置し、第1電極、有機膜層及び第2電極を含む有機発光ダイオードが各々備えられた複数のサブピクセルを含み、
前記有機膜層は、前記表示部の一側から他側まで連続してなり、かつ互いに離隔した複数の行に配列され、前記複数の行は前記データパッド部と並んでおり、
前記複数の行の間に前記複数の行が離隔した離隔領域が位置し、
前記第2電極は前記有機膜層及び前記離隔領域を覆う、表示装置。 - 前記複数のサブピクセルは各々発光部及び駆動部を含み、
前記有機膜層は前記発光部の全体に重畳する、請求項1に記載の表示装置。 - 前記離隔領域は、前記駆動部と重畳し、かつ前記発光部と重畳しない、請求項2に記載の表示装置。
- 前記離隔領域は、前記有機膜層の複数の行の長軸方向と垂直な方向に少なくとも1つ以上位置する、請求項3に記載の表示装置。
- 前記有機膜層の複数の行のうち、隣接した2つの間に位置する少なくとも1つの有機膜パターンをさらに含み、
前記有機膜パターンは、前記有機膜層の複数の行と並んで配置される、請求項1に記載の表示装置。 - 前記有機膜パターンは隣接した前記有機膜層の複数の行と離隔した、請求項5に記載の表示装置。
- 前記表示装置は、前記データパッド部の長軸方向と垂直の方向に曲がる、請求項1に記載の表示装置。
- 前記有機膜層の複数の行の長軸方向は前記データパッド部の長軸方向と並んでいる、請求項1に記載の表示装置。
- 前記有機膜層の行は前記有機膜層の行の長軸方向と垂直な方向に配置された前記少なくとも1つ以上のサブピクセルを周期で離隔した、請求項1に記載の表示装置。
- 前記有機発光ダイオードは白色を発光する、請求項1に記載の表示装置。
- 表示部と前記表示部の他の非表示部を含むプラスチック基板と、
前記非表示部の一側に配置され、軟性回路基板が付着されるデータパッド部と、を含み、
前記表示部は、前記表示部上に位置し、第1電極、有機膜層及び第2電極を含む有機発光ダイオードが各々備えられた複数のサブピクセルを含み、
前記有機膜層は、前記表示部の一側から他側まで連続してなり、かつ互いに離隔した複数の行に配列され、前記複数の行は前記データパッド部と並んでおり、
前記複数の行の間に前記複数の行が離隔した離隔領域が位置し、
前記第2電極は前記有機膜層及び前記離隔領域を覆い、
前記有機発光ダイオードは白色を発光する、表示装置。 - 前記表示部に位置して前記有機発光ダイオードで発光された白色を他の色に変換するカラーフィルタをさらに含む、請求項11に記載の表示装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2016-0109133 | 2016-08-26 | ||
KR1020160109133A KR101857868B1 (ko) | 2016-08-26 | 2016-08-26 | 표시장치 |
Publications (2)
Publication Number | Publication Date |
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JP2018032840A JP2018032840A (ja) | 2018-03-01 |
JP6461896B2 true JP6461896B2 (ja) | 2019-01-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016251389A Active JP6461896B2 (ja) | 2016-08-26 | 2016-12-26 | 表示装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US10403684B2 (ja) |
JP (1) | JP6461896B2 (ja) |
KR (1) | KR101857868B1 (ja) |
CN (1) | CN107785392B (ja) |
DE (1) | DE102016125867B4 (ja) |
TW (1) | TWI660499B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101857868B1 (ko) * | 2016-08-26 | 2018-06-21 | 엘지디스플레이 주식회사 | 표시장치 |
CN109411619B (zh) * | 2017-08-17 | 2020-05-26 | 京东方科技集团股份有限公司 | Oled阵列基板及其制备方法、显示面板及显示装置 |
JP7086582B2 (ja) * | 2017-12-11 | 2022-06-20 | 株式会社ジャパンディスプレイ | 表示装置 |
CN110034148A (zh) * | 2018-01-12 | 2019-07-19 | 超微晶科技(深圳)有限公司 | 显示面板及显示面板制作方法 |
CN108519706B (zh) * | 2018-03-29 | 2021-05-07 | 武汉华星光电技术有限公司 | 显示面板 |
US10748957B1 (en) * | 2018-06-21 | 2020-08-18 | Hrl Laboratories, Llc | Method of manufacturing a curved semiconductor die |
CN110212001B (zh) * | 2018-06-22 | 2021-09-07 | 友达光电股份有限公司 | 显示面板及其制造方法 |
KR102623973B1 (ko) * | 2018-09-11 | 2024-01-10 | 엘지디스플레이 주식회사 | 표시장치 |
KR102652324B1 (ko) * | 2019-07-25 | 2024-03-27 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
KR102429258B1 (ko) * | 2020-08-31 | 2022-08-04 | 엘지전자 주식회사 | 디스플레이 장치 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3813217B2 (ja) | 1995-03-13 | 2006-08-23 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネルの製造方法 |
JP2004139892A (ja) * | 2002-10-18 | 2004-05-13 | Matsushita Electric Ind Co Ltd | 有機エレクトロルミネッセンス素子を用いた画像形成装置およびこれを用いた携帯端末並びに照明装置 |
JP2006073222A (ja) * | 2004-08-31 | 2006-03-16 | Asahi Glass Co Ltd | 有機el表示装置及び有機el表示装置の製造方法 |
US7714501B2 (en) | 2004-12-01 | 2010-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting element, light emitting device and electronic equipment |
EP1770676B1 (en) * | 2005-09-30 | 2017-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
US7832595B2 (en) * | 2007-07-23 | 2010-11-16 | Conopco, Inc. | Household liquid dispenser with keyed spout fitment and refill |
US8076838B2 (en) * | 2007-10-31 | 2011-12-13 | Seiko Epson Corporation | Light emitting device |
JP4737221B2 (ja) * | 2008-04-16 | 2011-07-27 | ソニー株式会社 | 表示装置 |
KR20100093221A (ko) * | 2009-02-16 | 2010-08-25 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시 장치 |
JP5545970B2 (ja) * | 2009-03-26 | 2014-07-09 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
KR101651521B1 (ko) * | 2009-09-25 | 2016-08-29 | 엘지디스플레이 주식회사 | 의료용 유기전계발광소자 |
JP5356532B2 (ja) * | 2009-10-08 | 2013-12-04 | シャープ株式会社 | 発光部を有する複数のパネルを繋げてなる発光パネル装置、それを備えた画像表示装置および照明装置 |
US9024936B2 (en) * | 2009-12-03 | 2015-05-05 | Sharp Kabushiki Kaisha | Image display device, panel and panel manufacturing method |
WO2012001728A1 (ja) | 2010-06-28 | 2012-01-05 | パナソニック株式会社 | 有機el表示パネル、有機el表示パネルを備えた表示装置、および有機el表示パネルの製造方法 |
JP5858367B2 (ja) * | 2010-12-28 | 2016-02-10 | シャープ株式会社 | 有機el表示ユニット、有機el表示装置、及び有機el表示ユニットの製造方法 |
KR101484642B1 (ko) * | 2012-10-24 | 2015-01-20 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102014885B1 (ko) * | 2012-12-26 | 2019-08-28 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
JP6164982B2 (ja) * | 2013-08-27 | 2017-07-19 | パイオニア株式会社 | 発光装置 |
JP6087251B2 (ja) * | 2013-09-25 | 2017-03-01 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネッセンス表示装置 |
KR102235703B1 (ko) | 2014-02-12 | 2021-04-05 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
CN103887261B (zh) * | 2014-03-03 | 2016-08-31 | 京东方科技集团股份有限公司 | 一种柔性显示器及其制备方法 |
KR20160000567A (ko) * | 2014-06-24 | 2016-01-05 | 삼성디스플레이 주식회사 | 표시 장치 |
US10141383B2 (en) * | 2014-07-29 | 2018-11-27 | Lg Display Co., Ltd. | Organic light emitting display device and method for manufacturing the same |
CN104157792A (zh) * | 2014-08-08 | 2014-11-19 | 上海和辉光电有限公司 | Oled封装结构及封装方法 |
KR102280162B1 (ko) * | 2014-08-31 | 2021-07-20 | 엘지디스플레이 주식회사 | 유기 발광 디스플레이 패널 |
KR102254582B1 (ko) * | 2014-10-02 | 2021-05-24 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
US10347702B2 (en) * | 2014-10-22 | 2019-07-09 | Lg Display Co., Ltd. | Flexible thin film transistor substrate and flexible organic light emitting display device |
KR102239895B1 (ko) * | 2014-10-23 | 2021-04-13 | 엘지디스플레이 주식회사 | 입력 영상의 업 스케일링을 위한 데이터 변환부와 데이터 변환 방법 |
CN104538566A (zh) * | 2015-01-22 | 2015-04-22 | 深圳市华星光电技术有限公司 | Oled的封装方法及oled封装结构 |
CN104617230A (zh) * | 2015-01-29 | 2015-05-13 | 合肥鑫晟光电科技有限公司 | 封装胶结构及其制造方法和显示基板的封装方法 |
KR102512713B1 (ko) * | 2015-04-20 | 2023-03-23 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그의 제조 방법 |
CN105070743B (zh) * | 2015-09-10 | 2018-05-11 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示面板、显示装置 |
CN105789262A (zh) * | 2016-04-29 | 2016-07-20 | 京东方科技集团股份有限公司 | 一种柔性显示基板及其制备方法、柔性显示器件 |
KR101857868B1 (ko) * | 2016-08-26 | 2018-06-21 | 엘지디스플레이 주식회사 | 표시장치 |
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JP2018032840A (ja) | 2018-03-01 |
US10403684B2 (en) | 2019-09-03 |
TW201807816A (zh) | 2018-03-01 |
US20190341432A1 (en) | 2019-11-07 |
US20180061906A1 (en) | 2018-03-01 |
TWI660499B (zh) | 2019-05-21 |
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