JP6456131B2 - 基板の加工方法及び液体吐出ヘッドの製造方法 - Google Patents

基板の加工方法及び液体吐出ヘッドの製造方法 Download PDF

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Publication number
JP6456131B2
JP6456131B2 JP2014256176A JP2014256176A JP6456131B2 JP 6456131 B2 JP6456131 B2 JP 6456131B2 JP 2014256176 A JP2014256176 A JP 2014256176A JP 2014256176 A JP2014256176 A JP 2014256176A JP 6456131 B2 JP6456131 B2 JP 6456131B2
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JP
Japan
Prior art keywords
trench
protective layer
substrate
cycle
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014256176A
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English (en)
Japanese (ja)
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JP2016117155A (ja
JP2016117155A5 (enExample
Inventor
篤司 平本
篤司 平本
敦則 寺崎
敦則 寺崎
亮二 柬理
亮二 柬理
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014256176A priority Critical patent/JP6456131B2/ja
Priority to US14/963,493 priority patent/US9552984B2/en
Publication of JP2016117155A publication Critical patent/JP2016117155A/ja
Publication of JP2016117155A5 publication Critical patent/JP2016117155A5/ja
Application granted granted Critical
Publication of JP6456131B2 publication Critical patent/JP6456131B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • H10P14/6532—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14145—Structure of the manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • H10P14/687—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
JP2014256176A 2014-12-18 2014-12-18 基板の加工方法及び液体吐出ヘッドの製造方法 Expired - Fee Related JP6456131B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014256176A JP6456131B2 (ja) 2014-12-18 2014-12-18 基板の加工方法及び液体吐出ヘッドの製造方法
US14/963,493 US9552984B2 (en) 2014-12-18 2015-12-09 Processing method of substrate and manufacturing method of liquid ejection head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014256176A JP6456131B2 (ja) 2014-12-18 2014-12-18 基板の加工方法及び液体吐出ヘッドの製造方法

Publications (3)

Publication Number Publication Date
JP2016117155A JP2016117155A (ja) 2016-06-30
JP2016117155A5 JP2016117155A5 (enExample) 2018-02-01
JP6456131B2 true JP6456131B2 (ja) 2019-01-23

Family

ID=56128477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014256176A Expired - Fee Related JP6456131B2 (ja) 2014-12-18 2014-12-18 基板の加工方法及び液体吐出ヘッドの製造方法

Country Status (2)

Country Link
US (1) US9552984B2 (enExample)
JP (1) JP6456131B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6829569B2 (ja) * 2016-09-27 2021-02-10 ローム株式会社 ノズル基板、インクジェットプリントヘッドおよびノズル基板の製造方法
JP7209567B2 (ja) * 2018-07-30 2023-01-20 東京エレクトロン株式会社 エッチング方法およびエッチング装置
US20200135898A1 (en) * 2018-10-30 2020-04-30 International Business Machines Corporation Hard mask replenishment for etching processes
US11666918B2 (en) * 2020-03-06 2023-06-06 Funai Electric Co., Ltd. Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic component
US11361971B2 (en) * 2020-09-25 2022-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. High aspect ratio Bosch deep etch
CN113200511B (zh) * 2021-04-06 2024-08-16 杭州士兰集昕微电子有限公司 一种微机电传感器的背腔的制造方法
CN115084014B (zh) * 2022-06-29 2024-09-06 北京量子信息科学研究院 超导量子芯片集成电路的硅通孔制造方法及集成电路

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4221859B2 (ja) 1999-02-12 2009-02-12 株式会社デンソー 半導体装置の製造方法
FR2834382B1 (fr) * 2002-01-03 2005-03-18 Cit Alcatel Procede et dispositif de gravure anisotrope du silicium a haut facteur d'aspect
JP4665455B2 (ja) * 2004-08-09 2011-04-06 富士ゼロックス株式会社 シリコン構造体製造方法、モールド金型製造方法、成形部材製造方法、シリコン構造体、インクジェット記録ヘッド、及び、画像形成装置
JP2007136875A (ja) * 2005-11-18 2007-06-07 Canon Inc インクジェット記録ヘッド用基体
JP2008068499A (ja) * 2006-09-13 2008-03-27 Fujifilm Corp ノズルプレートの製造方法
JPWO2008155986A1 (ja) * 2007-06-20 2010-08-26 コニカミノルタホールディングス株式会社 液体吐出ヘッド用ノズルプレートの製造方法、液体吐出ヘッド用ノズルプレート及び液体吐出ヘッド
JP5814654B2 (ja) * 2010-07-27 2015-11-17 キヤノン株式会社 シリコン基板の加工方法及び液体吐出ヘッドの製造方法
JP5413331B2 (ja) * 2010-08-19 2014-02-12 株式会社デンソー 半導体装置の製造方法
US20130052826A1 (en) * 2011-08-30 2013-02-28 Fujifilm Corporation High Aspect Ratio Grid for Phase Contrast X-ray Imaging and Method of Making the Same
FR2979478A1 (fr) * 2011-08-31 2013-03-01 St Microelectronics Crolles 2 Procede de realisation d'une tranchee profonde dans un substrat de composant microelectronique
JP6095320B2 (ja) * 2011-12-02 2017-03-15 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
US8859430B2 (en) * 2012-06-22 2014-10-14 Tokyo Electron Limited Sidewall protection of low-K material during etching and ashing
JP5725052B2 (ja) * 2013-02-01 2015-05-27 セイコーエプソン株式会社 ノズルプレートの製造方法及び流体噴射ヘッドの製造方法

Also Published As

Publication number Publication date
JP2016117155A (ja) 2016-06-30
US9552984B2 (en) 2017-01-24
US20160176193A1 (en) 2016-06-23

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