JP6445099B2 - パージモジュールジグ及びそれを含むパージモジュール - Google Patents
パージモジュールジグ及びそれを含むパージモジュール Download PDFInfo
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- JP6445099B2 JP6445099B2 JP2017127332A JP2017127332A JP6445099B2 JP 6445099 B2 JP6445099 B2 JP 6445099B2 JP 2017127332 A JP2017127332 A JP 2017127332A JP 2017127332 A JP2017127332 A JP 2017127332A JP 6445099 B2 JP6445099 B2 JP 6445099B2
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- transfer pipe
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- 238000010926 purge Methods 0.000 title claims description 100
- 238000012856 packing Methods 0.000 claims description 19
- 230000002265 prevention Effects 0.000 claims description 7
- 239000013013 elastic material Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 117
- 235000012431 wafers Nutrition 0.000 description 51
- 239000000126 substance Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
- H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
- H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
- H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure
- H01L2021/60187—Isostatic pressure, e.g. degassing using vacuum or pressurised liquid
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本出願において、「含む」または「有する」などの用語は明細書に記載された特徴、数字、ステップ、段階、動作、構成要素、部品またはこれらを組み合わせたものが存在することを意味し、一つまたはそれ以上の他の特徴や数字、ステップ、段階、動作、構成要素、部品またはこれらを組み合わせたものの存在または付加可能性を予め排除しないこととして理解されるべきである。また、AとBが‘連結される’、‘結合される’という意味はAとBが直接的に連結されるか結合する外に他の構成要素CがAとBとの間に含まれてAとBが連結されるか結合されることを含む。
一般的に使用される辞書に定義されているのと同じ用語は関連技術の文脈上有する意味と一致する意味を有すると解釈されるべきであり、本出願において明白に定義されない限り、理想的か過度に形式的な意味で解釈されない。
130 凹溝
150 開口部
170 干渉防止開口部
200 ガス移送パイプ
230 カセット接触部
235 パッキング部
250 連結部材
300 固定部
1000 パージモジュールジグ
2000 パイプ
3000 ガス制御部
Claims (8)
- 外部と連結される第1端部及び前記第1端部と反対側に形成されウエハーカセットにガスを排出するか注入するためにカセットと接触するカセット接触部が形成された第2端部を含むガス移送パイプと、
前記ガス移送パイプの少なくともいずれか一つの領域が配置される凹溝又は開口部を含むプレートと、
前記ガス移送パイプを前記プレートに固定させる固定部と、を含み、
前記ガス移送パイプの断面は楕円形であり、
前記凹溝又は開口部の深さはガス移送パイプの直径高さと同じであるか、又は大きい寸法関係にあり、
前記ガス移送パイプは前記凹溝又は開口部に挿入されていると共に、
前記ガス移送パイプの第2端部が弾性振動をするように、ガス移送パイプの周面が凹溝又は開口部から外部に露出されていることを特徴とする、
パージモジュールジグ。 - 前記カセット接触部は、前記カセット接触部の上部面に位置し、ガスの漏出を防止するパッキング部をさらに含むことを特徴とする請求項1に記載のパージモジュールジグ。
- 前記プレートは前記ウエハーカセットとの干渉を防止する干渉防止開口部をさらに含むことを特徴とする請求項1に記載のパージモジュールジグ。
- 前記ガス移送パイプは弾性を有する材質であることを特徴とする請求項1に記載のパージモジュールジグ。
- 前記ガス移送パイプは少なくとも一つ以上であることを特徴とする請求項1に記載のパージモジュールジグ。
- 前記固定部は前記凹溝又は開口部が形成された付近に少なくとも一つ以上付着されることを特徴とする請求項1に記載のパージモジュールジグ。
- 外部と連結される第1端部及びカセット接触部が形成された第2端部を含むガス移送パイプ、前記ガス移送パイプの少なくともいずれか一つの領域が配置される開口部を含むプレート及び前記ガス移送パイプを前記プレートに固定させる固定部を含む請求項1乃至6の何れか一項に記載のパージモジュールジグと、
ウエハーカセットに注入されるかウエハーカセットから排出されるガスを制御するガス制御部と、
一端が前記ガス移送パイプの前記第1端部が連結され、他端が前記ガス制御部に連結されるパイプと、を含むことを特徴とする、
パージモジュール。 - 前記ガス移送パイプの第1端部及び前記パイプの連結を容易にする連結部材をさらに含むことを特徴とする請求項7に記載のパージモジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160084538A KR101852323B1 (ko) | 2016-07-05 | 2016-07-05 | 퍼지 모듈 지그 및 이를 포함한 퍼지 모듈 |
KR10-2016-0084538 | 2016-07-05 |
Publications (2)
Publication Number | Publication Date |
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JP2018006751A JP2018006751A (ja) | 2018-01-11 |
JP6445099B2 true JP6445099B2 (ja) | 2018-12-26 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017127332A Active JP6445099B2 (ja) | 2016-07-05 | 2017-06-29 | パージモジュールジグ及びそれを含むパージモジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US10395948B2 (ja) |
JP (1) | JP6445099B2 (ja) |
KR (1) | KR101852323B1 (ja) |
CN (1) | CN107570505A (ja) |
TW (1) | TWI650190B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022211185A1 (ko) * | 2021-03-29 | 2022-10-06 | 주식회사 저스템 | 스테이지 장치 및 이를 구비한 로드포트모듈 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016205597B4 (de) * | 2016-04-05 | 2022-06-23 | Fabmatics Gmbh | Purge-Messsystem für FOUPs |
JP6984748B2 (ja) * | 2018-06-15 | 2021-12-22 | 村田機械株式会社 | 保管棚 |
JP7234527B2 (ja) * | 2018-07-30 | 2023-03-08 | Tdk株式会社 | センサー内蔵フィルタ構造体及びウエハ収容容器 |
KR20180003272U (ko) | 2018-11-02 | 2018-11-21 | 구강영 | 차량용 소화기 |
KR200493651Y1 (ko) * | 2018-11-27 | 2021-05-13 | 브릴리언 네트워크 앤드 오토메이션 인티그레이티드 시스템 씨오 엘티디 | 웨이퍼 카세트 반송 장치 및 웨이퍼 카세트 반송 기기 |
CN109633220B (zh) * | 2019-01-29 | 2021-08-24 | 江阴佳泰电子科技有限公司 | 一种预吹洗式晶圆探针台 |
KR102353302B1 (ko) | 2021-07-13 | 2022-01-21 | 주식회사 올소비트 | 퍼지 가스 충전과 가압을 이용한 3d 프린팅에 의한 치과용 의료물품의 제조방법 및 그 제조장치 |
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US5988233A (en) * | 1998-03-27 | 1999-11-23 | Asyst Technologies, Inc. | Evacuation-driven SMIF pod purge system |
JP4211240B2 (ja) * | 2000-05-26 | 2009-01-21 | パナソニック電工株式会社 | 高周波信号切換装置 |
JP3697478B2 (ja) * | 2001-08-20 | 2005-09-21 | ソニー株式会社 | 基板の移送方法及びロードポート装置並びに基板移送システム |
US7100340B2 (en) * | 2001-08-31 | 2006-09-05 | Asyst Technologies, Inc. | Unified frame for semiconductor material handling system |
US20040237244A1 (en) * | 2003-05-26 | 2004-12-02 | Tdk Corporation | Purge system for product container and interface seal used in the system |
JP4534876B2 (ja) * | 2005-06-13 | 2010-09-01 | シンフォニアテクノロジー株式会社 | 被処理物供給装置及び被処理物供給方法 |
JP5887719B2 (ja) * | 2011-05-31 | 2016-03-16 | シンフォニアテクノロジー株式会社 | パージ装置、ロードポート、ボトムパージノズル本体、ボトムパージユニット |
US9257320B2 (en) * | 2013-06-05 | 2016-02-09 | GlobalFoundries, Inc. | Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication |
KR101802418B1 (ko) | 2013-08-20 | 2017-11-28 | 무라다기카이가부시끼가이샤 | 가스 퍼지 장치와 가스 퍼지 방법 |
US9411332B2 (en) * | 2014-02-14 | 2016-08-09 | GlobalFoundries, Inc. | Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port |
KR101593386B1 (ko) * | 2014-09-01 | 2016-02-15 | 로체 시스템즈(주) | 퍼지 모듈 및 이를 포함하는 로드 포트 |
US10325797B2 (en) * | 2014-09-25 | 2019-06-18 | Murata Machinery, Ltd. | Purging device and purging method |
JP6459682B2 (ja) * | 2015-03-20 | 2019-01-30 | Tdk株式会社 | ガスパージ装置、ロードポート装置およびガスパージ方法 |
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2016
- 2016-07-05 KR KR1020160084538A patent/KR101852323B1/ko active IP Right Grant
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2017
- 2017-06-19 TW TW106120377A patent/TWI650190B/zh active
- 2017-06-21 US US15/628,820 patent/US10395948B2/en active Active
- 2017-06-28 CN CN201710511591.2A patent/CN107570505A/zh active Pending
- 2017-06-29 JP JP2017127332A patent/JP6445099B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2022211185A1 (ko) * | 2021-03-29 | 2022-10-06 | 주식회사 저스템 | 스테이지 장치 및 이를 구비한 로드포트모듈 |
Also Published As
Publication number | Publication date |
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TWI650190B (zh) | 2019-02-11 |
KR101852323B1 (ko) | 2018-04-26 |
JP2018006751A (ja) | 2018-01-11 |
TW201805077A (zh) | 2018-02-16 |
KR20180004889A (ko) | 2018-01-15 |
CN107570505A (zh) | 2018-01-12 |
US10395948B2 (en) | 2019-08-27 |
US20180012779A1 (en) | 2018-01-11 |
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