JP6430790B2 - レーザー加工装置 - Google Patents

レーザー加工装置 Download PDF

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Publication number
JP6430790B2
JP6430790B2 JP2014238025A JP2014238025A JP6430790B2 JP 6430790 B2 JP6430790 B2 JP 6430790B2 JP 2014238025 A JP2014238025 A JP 2014238025A JP 2014238025 A JP2014238025 A JP 2014238025A JP 6430790 B2 JP6430790 B2 JP 6430790B2
Authority
JP
Japan
Prior art keywords
laser beam
path
optical axis
resonant scanner
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014238025A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016097432A (ja
Inventor
圭司 能丸
圭司 能丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2014238025A priority Critical patent/JP6430790B2/ja
Priority to CN201510817988.5A priority patent/CN105618928B/zh
Priority to DE102015223172.0A priority patent/DE102015223172A1/de
Publication of JP2016097432A publication Critical patent/JP2016097432A/ja
Application granted granted Critical
Publication of JP6430790B2 publication Critical patent/JP6430790B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2014238025A 2014-11-25 2014-11-25 レーザー加工装置 Active JP6430790B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014238025A JP6430790B2 (ja) 2014-11-25 2014-11-25 レーザー加工装置
CN201510817988.5A CN105618928B (zh) 2014-11-25 2015-11-23 激光加工装置
DE102015223172.0A DE102015223172A1 (de) 2014-11-25 2015-11-24 Laserbearbeitungsvorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014238025A JP6430790B2 (ja) 2014-11-25 2014-11-25 レーザー加工装置

Publications (2)

Publication Number Publication Date
JP2016097432A JP2016097432A (ja) 2016-05-30
JP6430790B2 true JP6430790B2 (ja) 2018-11-28

Family

ID=55914485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014238025A Active JP6430790B2 (ja) 2014-11-25 2014-11-25 レーザー加工装置

Country Status (3)

Country Link
JP (1) JP6430790B2 (de)
CN (1) CN105618928B (de)
DE (1) DE102015223172A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6721439B2 (ja) * 2016-07-11 2020-07-15 株式会社ディスコ レーザー加工装置
JP6802011B2 (ja) * 2016-09-02 2020-12-16 株式会社ディスコ 厚み計測装置
JP7190808B2 (ja) * 2017-11-08 2022-12-16 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
CN109991614B (zh) * 2019-03-27 2021-02-05 深圳市速腾聚创科技有限公司 激光雷达测距装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1147965A (ja) * 1997-05-28 1999-02-23 Komatsu Ltd レーザ加工装置
JP3463281B2 (ja) * 2000-06-28 2003-11-05 住友重機械工業株式会社 多軸レーザ加工装置及びレーザ加工方法
JP3490414B2 (ja) * 2001-08-16 2004-01-26 住友重機械工業株式会社 レーザ加工方法及び装置
JP4549620B2 (ja) * 2001-11-30 2010-09-22 株式会社半導体エネルギー研究所 レーザ照射装置
JP3604014B2 (ja) * 2001-12-19 2004-12-22 住友重機械工業株式会社 レーザ加工装置及び加工方法
CN1232380C (zh) * 2002-03-28 2005-12-21 三菱电机株式会社 激光加工装置
JP4456881B2 (ja) * 2004-01-28 2010-04-28 株式会社リコー レーザ加工装置
JP4354376B2 (ja) 2004-09-28 2009-10-28 株式会社ディスコ レーザ加工装置
JP2006281268A (ja) * 2005-03-31 2006-10-19 Hitachi Via Mechanics Ltd レーザ加工機
JP2008068270A (ja) * 2006-09-12 2008-03-27 Disco Abrasive Syst Ltd レーザー加工装置
JP5029036B2 (ja) * 2007-01-25 2012-09-19 住友電気工業株式会社 光源装置およびスペクトル分析装置
JP5010978B2 (ja) 2007-05-22 2012-08-29 株式会社ディスコ レーザー加工装置
US8388609B2 (en) * 2008-12-01 2013-03-05 Amo Development, Llc. System and method for multibeam scanning
CN102139484B (zh) * 2010-01-29 2015-05-20 西进商事股份有限公司 激光划线方法以及装置
JP5813959B2 (ja) * 2011-02-07 2015-11-17 株式会社ディスコ レーザー光線照射機構およびレーザー加工装置

Also Published As

Publication number Publication date
DE102015223172A1 (de) 2016-05-25
JP2016097432A (ja) 2016-05-30
CN105618928A (zh) 2016-06-01
CN105618928B (zh) 2019-04-26

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