JP6427337B2 - 表示装置およびその製造方法 - Google Patents

表示装置およびその製造方法 Download PDF

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Publication number
JP6427337B2
JP6427337B2 JP2014102333A JP2014102333A JP6427337B2 JP 6427337 B2 JP6427337 B2 JP 6427337B2 JP 2014102333 A JP2014102333 A JP 2014102333A JP 2014102333 A JP2014102333 A JP 2014102333A JP 6427337 B2 JP6427337 B2 JP 6427337B2
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JP
Japan
Prior art keywords
display device
manufacturing
film
layer
metal layer
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JP2014102333A
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English (en)
Japanese (ja)
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JP2015219350A5 (enExample
JP2015219350A (ja
Inventor
雅博 寺本
雅博 寺本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
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Japan Display Inc
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Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2014102333A priority Critical patent/JP6427337B2/ja
Priority to US14/712,678 priority patent/US9977525B2/en
Publication of JP2015219350A publication Critical patent/JP2015219350A/ja
Publication of JP2015219350A5 publication Critical patent/JP2015219350A5/ja
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Publication of JP6427337B2 publication Critical patent/JP6427337B2/ja
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04166Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Surface Treatment Of Optical Elements (AREA)
JP2014102333A 2014-05-16 2014-05-16 表示装置およびその製造方法 Active JP6427337B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014102333A JP6427337B2 (ja) 2014-05-16 2014-05-16 表示装置およびその製造方法
US14/712,678 US9977525B2 (en) 2014-05-16 2015-05-14 Display device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014102333A JP6427337B2 (ja) 2014-05-16 2014-05-16 表示装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2015219350A JP2015219350A (ja) 2015-12-07
JP2015219350A5 JP2015219350A5 (enExample) 2017-06-29
JP6427337B2 true JP6427337B2 (ja) 2018-11-21

Family

ID=54539126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014102333A Active JP6427337B2 (ja) 2014-05-16 2014-05-16 表示装置およびその製造方法

Country Status (2)

Country Link
US (1) US9977525B2 (enExample)
JP (1) JP6427337B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205721704U (zh) * 2016-05-23 2016-11-23 成都京东方光电科技有限公司 触控基板及触摸屏显示器
CN106990871A (zh) * 2017-04-13 2017-07-28 京东方科技集团股份有限公司 一种触控面板及其制备方法、显示面板和显示装置
CN107357455A (zh) * 2017-06-21 2017-11-17 维沃移动通信有限公司 一种显示屏的驱动方法、显示屏以及移动终端
CN107861656B (zh) * 2017-11-08 2025-08-26 合肥鑫晟光电科技有限公司 触摸屏的制造方法、显示装置
JP7051446B2 (ja) * 2018-01-10 2022-04-11 株式会社ジャパンディスプレイ 表示装置の製造方法
CN113772963B (zh) * 2021-09-13 2023-07-07 芜湖长信科技股份有限公司 一种双面线路触摸屏结构及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH095784A (ja) * 1995-06-21 1997-01-10 Toshiba Corp 液晶表示装置、その製造方法および表示電極基板
JPH10142628A (ja) * 1996-11-07 1998-05-29 Matsushita Electric Ind Co Ltd アクティブマトリクス基板およびその製造方法
JP2001222017A (ja) * 1999-05-24 2001-08-17 Fujitsu Ltd 液晶表示装置及びその製造方法
JP5183584B2 (ja) * 2009-06-29 2013-04-17 株式会社ジャパンディスプレイウェスト タッチセンサ、表示装置および電子機器
JP5653686B2 (ja) * 2010-08-24 2015-01-14 株式会社ジャパンディスプレイ タッチ検出機能付き表示装置
KR20130039556A (ko) * 2011-10-12 2013-04-22 삼성전기주식회사 전극 형성방법
JP6022164B2 (ja) 2012-01-24 2016-11-09 株式会社ジャパンディスプレイ 液晶表示装置
US8994891B2 (en) * 2012-05-16 2015-03-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and touch panel
JP2013238794A (ja) * 2012-05-17 2013-11-28 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP5224203B1 (ja) 2012-07-11 2013-07-03 大日本印刷株式会社 タッチパネルセンサ、タッチパネル装置および表示装置
JP2015180979A (ja) * 2012-07-31 2015-10-15 シャープ株式会社 タッチパネルおよびタッチパネルの製造方法
US9304636B2 (en) * 2013-09-20 2016-04-05 Eastman Kodak Company Micro-wire touch screen with unpatterned conductive layer
JP5673782B1 (ja) * 2013-11-11 2015-02-18 凸版印刷株式会社 液晶表示装置

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Publication number Publication date
US20150332965A1 (en) 2015-11-19
US9977525B2 (en) 2018-05-22
JP2015219350A (ja) 2015-12-07

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