JP6426924B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

Info

Publication number
JP6426924B2
JP6426924B2 JP2014139197A JP2014139197A JP6426924B2 JP 6426924 B2 JP6426924 B2 JP 6426924B2 JP 2014139197 A JP2014139197 A JP 2014139197A JP 2014139197 A JP2014139197 A JP 2014139197A JP 6426924 B2 JP6426924 B2 JP 6426924B2
Authority
JP
Japan
Prior art keywords
substrate
volatile solvent
magnet
solvent
cleaning solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014139197A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015092537A5 (enExample
JP2015092537A (ja
Inventor
裕次 長嶋
裕次 長嶋
松下　淳
淳 松下
裕樹 齊藤
裕樹 齊藤
林　航之介
航之介 林
邦浩 宮崎
邦浩 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2014139197A priority Critical patent/JP6426924B2/ja
Priority to KR1020140108213A priority patent/KR101624038B1/ko
Priority to US14/495,724 priority patent/US20150090298A1/en
Priority to CN201410515122.4A priority patent/CN104517875A/zh
Priority to EP14187008.9A priority patent/EP2854165A1/en
Priority to TW103133985A priority patent/TW201523724A/zh
Publication of JP2015092537A publication Critical patent/JP2015092537A/ja
Publication of JP2015092537A5 publication Critical patent/JP2015092537A5/ja
Application granted granted Critical
Publication of JP6426924B2 publication Critical patent/JP6426924B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Extraction Or Liquid Replacement (AREA)
  • Mixers With Rotating Receptacles And Mixers With Vibration Mechanisms (AREA)
JP2014139197A 2013-09-30 2014-07-04 基板処理装置及び基板処理方法 Active JP6426924B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014139197A JP6426924B2 (ja) 2013-09-30 2014-07-04 基板処理装置及び基板処理方法
KR1020140108213A KR101624038B1 (ko) 2013-09-30 2014-08-20 기판 처리 장치 및 기판 처리 방법
US14/495,724 US20150090298A1 (en) 2013-09-30 2014-09-24 Substrate processing device and substrate processing method
CN201410515122.4A CN104517875A (zh) 2013-09-30 2014-09-29 基板处理装置和基板处理方法
EP14187008.9A EP2854165A1 (en) 2013-09-30 2014-09-30 Substrate processing device and substrate processing method
TW103133985A TW201523724A (zh) 2013-09-30 2014-09-30 基板處理裝置及基板處理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013205126 2013-09-30
JP2013205126 2013-09-30
JP2014139197A JP6426924B2 (ja) 2013-09-30 2014-07-04 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2015092537A JP2015092537A (ja) 2015-05-14
JP2015092537A5 JP2015092537A5 (enExample) 2017-08-17
JP6426924B2 true JP6426924B2 (ja) 2018-11-21

Family

ID=51730317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014139197A Active JP6426924B2 (ja) 2013-09-30 2014-07-04 基板処理装置及び基板処理方法

Country Status (6)

Country Link
US (1) US20150090298A1 (enExample)
EP (1) EP2854165A1 (enExample)
JP (1) JP6426924B2 (enExample)
KR (1) KR101624038B1 (enExample)
CN (1) CN104517875A (enExample)
TW (1) TW201523724A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6543534B2 (ja) 2015-08-26 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7045867B2 (ja) * 2018-01-26 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7064339B2 (ja) 2018-01-31 2022-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI702373B (zh) * 2019-03-22 2020-08-21 由田新技股份有限公司 翻面式多軸機械手臂裝置及其光學檢測設備
GB201905138D0 (en) 2019-04-11 2019-05-29 Spts Technologies Ltd Apparatus and method for processing a substrate
CN111842283A (zh) * 2020-06-29 2020-10-30 北京信和洁能新能源技术服务有限公司 具有内置水箱的离子瀑空气净化机的自动清洗系统及方法
JP7453874B2 (ja) * 2020-07-30 2024-03-21 芝浦メカトロニクス株式会社 基板処理方法、および基板処理装置
JP7072623B1 (ja) * 2020-11-11 2022-05-20 芝浦機械株式会社 抽出乾燥装置
JP2024145228A (ja) * 2023-03-31 2024-10-15 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205273A (ja) * 2002-01-16 2003-07-22 Mgchemical Kk 洗浄及び乾燥方法
WO2004107426A1 (ja) * 2003-05-27 2004-12-09 Personal Creation Ltd. 磁石を備えた基板の処理装置及び処理方法
JP2008034779A (ja) 2006-06-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4886544B2 (ja) * 2007-02-09 2012-02-29 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP5448536B2 (ja) * 2009-04-08 2014-03-19 東京エレクトロン株式会社 レジスト塗布現像装置およびレジスト塗布現像方法、並びにレジスト膜処理装置およびレジスト膜処理方法
JP2011135009A (ja) * 2009-12-25 2011-07-07 Tokyo Electron Ltd 基板乾燥装置及び基板乾燥方法
JP2012200679A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
US8715518B2 (en) * 2011-10-12 2014-05-06 Intermolecular, Inc. Gas barrier with vent ring for protecting a surface region from liquid

Also Published As

Publication number Publication date
US20150090298A1 (en) 2015-04-02
EP2854165A1 (en) 2015-04-01
JP2015092537A (ja) 2015-05-14
KR101624038B1 (ko) 2016-05-24
TW201523724A (zh) 2015-06-16
KR20150037509A (ko) 2015-04-08
CN104517875A (zh) 2015-04-15

Similar Documents

Publication Publication Date Title
JP6426924B2 (ja) 基板処理装置及び基板処理方法
JP6426927B2 (ja) 基板処理装置及び基板処理方法
CN104064445B (zh) 基板处理装置和基板处理方法
JP6400919B2 (ja) 基板処理装置及び基板処理方法
JP6351993B2 (ja) 基板処理装置及び基板処理方法
KR102584337B1 (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP2015092539A (ja) 基板処理装置及び基板処理方法
JP6276924B2 (ja) 基板処理装置
JP7126468B2 (ja) 基板処理方法および基板処理装置
JP6585243B2 (ja) 基板処理装置及び基板処理方法
KR101634428B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2015070208A (ja) 基板処理装置及び基板処理方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170704

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170704

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180723

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180807

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180822

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20181023

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20181026

R150 Certificate of patent or registration of utility model

Ref document number: 6426924

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150