TW201523724A - 基板處理裝置及基板處理方法 - Google Patents
基板處理裝置及基板處理方法 Download PDFInfo
- Publication number
- TW201523724A TW201523724A TW103133985A TW103133985A TW201523724A TW 201523724 A TW201523724 A TW 201523724A TW 103133985 A TW103133985 A TW 103133985A TW 103133985 A TW103133985 A TW 103133985A TW 201523724 A TW201523724 A TW 201523724A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- volatile solvent
- magnetic field
- cleaning liquid
- solvent
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 387
- 238000012545 processing Methods 0.000 title claims abstract description 60
- 238000003672 processing method Methods 0.000 title claims description 9
- 239000002904 solvent Substances 0.000 claims abstract description 153
- 238000004140 cleaning Methods 0.000 claims abstract description 125
- 239000007788 liquid Substances 0.000 claims abstract description 122
- 230000005291 magnetic effect Effects 0.000 claims abstract description 80
- 238000010438 heat treatment Methods 0.000 claims description 44
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 230000001737 promoting effect Effects 0.000 claims description 2
- 238000003756 stirring Methods 0.000 abstract description 5
- 238000001035 drying Methods 0.000 description 51
- 239000007789 gas Substances 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 239000000126 substance Substances 0.000 description 19
- 239000000872 buffer Substances 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 14
- 238000012546 transfer Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 239000012536 storage buffer Substances 0.000 description 9
- 229910021642 ultra pure water Inorganic materials 0.000 description 9
- 239000012498 ultrapure water Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000010981 drying operation Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000002889 diamagnetic material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
- B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
- Extraction Or Liquid Replacement (AREA)
- Mixers With Rotating Receptacles And Mixers With Vibration Mechanisms (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013205126 | 2013-09-30 | ||
| JP2014139197A JP6426924B2 (ja) | 2013-09-30 | 2014-07-04 | 基板処理装置及び基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201523724A true TW201523724A (zh) | 2015-06-16 |
Family
ID=51730317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103133985A TW201523724A (zh) | 2013-09-30 | 2014-09-30 | 基板處理裝置及基板處理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20150090298A1 (enExample) |
| EP (1) | EP2854165A1 (enExample) |
| JP (1) | JP6426924B2 (enExample) |
| KR (1) | KR101624038B1 (enExample) |
| CN (1) | CN104517875A (enExample) |
| TW (1) | TW201523724A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI613707B (zh) * | 2015-12-24 | 2018-02-01 | 斯庫林集團股份有限公司 | 基板處理裝置及基板處理方法 |
| TWI781678B (zh) * | 2020-07-30 | 2022-10-21 | 日商芝浦機械電子裝置股份有限公司 | 基板處理方法及基板處理裝置 |
| TWI897318B (zh) * | 2023-03-31 | 2025-09-11 | 日商芝浦機械電子裝置股份有限公司 | 基板處理裝置以及基板處理方法 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6543534B2 (ja) | 2015-08-26 | 2019-07-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP7045867B2 (ja) * | 2018-01-26 | 2022-04-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法 |
| JP7064339B2 (ja) | 2018-01-31 | 2022-05-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| TWI702373B (zh) * | 2019-03-22 | 2020-08-21 | 由田新技股份有限公司 | 翻面式多軸機械手臂裝置及其光學檢測設備 |
| GB201905138D0 (en) | 2019-04-11 | 2019-05-29 | Spts Technologies Ltd | Apparatus and method for processing a substrate |
| CN111842283A (zh) * | 2020-06-29 | 2020-10-30 | 北京信和洁能新能源技术服务有限公司 | 具有内置水箱的离子瀑空气净化机的自动清洗系统及方法 |
| JP7072623B1 (ja) * | 2020-11-11 | 2022-05-20 | 芝浦機械株式会社 | 抽出乾燥装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003205273A (ja) * | 2002-01-16 | 2003-07-22 | Mgchemical Kk | 洗浄及び乾燥方法 |
| WO2004107426A1 (ja) * | 2003-05-27 | 2004-12-09 | Personal Creation Ltd. | 磁石を備えた基板の処理装置及び処理方法 |
| JP2008034779A (ja) | 2006-06-27 | 2008-02-14 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
| JP4886544B2 (ja) * | 2007-02-09 | 2012-02-29 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
| JP5448536B2 (ja) * | 2009-04-08 | 2014-03-19 | 東京エレクトロン株式会社 | レジスト塗布現像装置およびレジスト塗布現像方法、並びにレジスト膜処理装置およびレジスト膜処理方法 |
| JP2011135009A (ja) * | 2009-12-25 | 2011-07-07 | Tokyo Electron Ltd | 基板乾燥装置及び基板乾燥方法 |
| JP2012200679A (ja) * | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | 基板洗浄装置及び基板洗浄方法 |
| US8715518B2 (en) * | 2011-10-12 | 2014-05-06 | Intermolecular, Inc. | Gas barrier with vent ring for protecting a surface region from liquid |
-
2014
- 2014-07-04 JP JP2014139197A patent/JP6426924B2/ja active Active
- 2014-08-20 KR KR1020140108213A patent/KR101624038B1/ko not_active Expired - Fee Related
- 2014-09-24 US US14/495,724 patent/US20150090298A1/en not_active Abandoned
- 2014-09-29 CN CN201410515122.4A patent/CN104517875A/zh active Pending
- 2014-09-30 TW TW103133985A patent/TW201523724A/zh unknown
- 2014-09-30 EP EP14187008.9A patent/EP2854165A1/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI613707B (zh) * | 2015-12-24 | 2018-02-01 | 斯庫林集團股份有限公司 | 基板處理裝置及基板處理方法 |
| US10651029B2 (en) | 2015-12-24 | 2020-05-12 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
| TWI781678B (zh) * | 2020-07-30 | 2022-10-21 | 日商芝浦機械電子裝置股份有限公司 | 基板處理方法及基板處理裝置 |
| TWI897318B (zh) * | 2023-03-31 | 2025-09-11 | 日商芝浦機械電子裝置股份有限公司 | 基板處理裝置以及基板處理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150090298A1 (en) | 2015-04-02 |
| EP2854165A1 (en) | 2015-04-01 |
| JP2015092537A (ja) | 2015-05-14 |
| KR101624038B1 (ko) | 2016-05-24 |
| KR20150037509A (ko) | 2015-04-08 |
| CN104517875A (zh) | 2015-04-15 |
| JP6426924B2 (ja) | 2018-11-21 |
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