TW201523724A - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TW201523724A
TW201523724A TW103133985A TW103133985A TW201523724A TW 201523724 A TW201523724 A TW 201523724A TW 103133985 A TW103133985 A TW 103133985A TW 103133985 A TW103133985 A TW 103133985A TW 201523724 A TW201523724 A TW 201523724A
Authority
TW
Taiwan
Prior art keywords
substrate
volatile solvent
magnetic field
cleaning liquid
solvent
Prior art date
Application number
TW103133985A
Other languages
English (en)
Chinese (zh)
Inventor
長嶋裕次
松下淳
齋藤裕樹
林航之介
宮崎邦浩
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201523724A publication Critical patent/TW201523724A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Extraction Or Liquid Replacement (AREA)
  • Mixers With Rotating Receptacles And Mixers With Vibration Mechanisms (AREA)
TW103133985A 2013-09-30 2014-09-30 基板處理裝置及基板處理方法 TW201523724A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013205126 2013-09-30
JP2014139197A JP6426924B2 (ja) 2013-09-30 2014-07-04 基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
TW201523724A true TW201523724A (zh) 2015-06-16

Family

ID=51730317

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103133985A TW201523724A (zh) 2013-09-30 2014-09-30 基板處理裝置及基板處理方法

Country Status (6)

Country Link
US (1) US20150090298A1 (enExample)
EP (1) EP2854165A1 (enExample)
JP (1) JP6426924B2 (enExample)
KR (1) KR101624038B1 (enExample)
CN (1) CN104517875A (enExample)
TW (1) TW201523724A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613707B (zh) * 2015-12-24 2018-02-01 斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TWI781678B (zh) * 2020-07-30 2022-10-21 日商芝浦機械電子裝置股份有限公司 基板處理方法及基板處理裝置
TWI897318B (zh) * 2023-03-31 2025-09-11 日商芝浦機械電子裝置股份有限公司 基板處理裝置以及基板處理方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6543534B2 (ja) 2015-08-26 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7045867B2 (ja) * 2018-01-26 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7064339B2 (ja) * 2018-01-31 2022-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI702373B (zh) * 2019-03-22 2020-08-21 由田新技股份有限公司 翻面式多軸機械手臂裝置及其光學檢測設備
GB201905138D0 (en) 2019-04-11 2019-05-29 Spts Technologies Ltd Apparatus and method for processing a substrate
CN113053728B (zh) * 2019-12-27 2024-08-27 株式会社斯库林集团 基板处理方法以及基板处理装置
CN111842283A (zh) * 2020-06-29 2020-10-30 北京信和洁能新能源技术服务有限公司 具有内置水箱的离子瀑空气净化机的自动清洗系统及方法
JP7072623B1 (ja) * 2020-11-11 2022-05-20 芝浦機械株式会社 抽出乾燥装置
JP7653481B2 (ja) * 2023-08-28 2025-03-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205273A (ja) * 2002-01-16 2003-07-22 Mgchemical Kk 洗浄及び乾燥方法
JPWO2004107426A1 (ja) * 2003-05-27 2006-07-20 有限会社パーソナルクリエイション 磁石を備えた基板の処理装置及び処理方法
JP2008034779A (ja) 2006-06-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4886544B2 (ja) * 2007-02-09 2012-02-29 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP5448536B2 (ja) * 2009-04-08 2014-03-19 東京エレクトロン株式会社 レジスト塗布現像装置およびレジスト塗布現像方法、並びにレジスト膜処理装置およびレジスト膜処理方法
JP2011135009A (ja) * 2009-12-25 2011-07-07 Tokyo Electron Ltd 基板乾燥装置及び基板乾燥方法
JP2012200679A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
US8715518B2 (en) * 2011-10-12 2014-05-06 Intermolecular, Inc. Gas barrier with vent ring for protecting a surface region from liquid

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613707B (zh) * 2015-12-24 2018-02-01 斯庫林集團股份有限公司 基板處理裝置及基板處理方法
US10651029B2 (en) 2015-12-24 2020-05-12 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
TWI781678B (zh) * 2020-07-30 2022-10-21 日商芝浦機械電子裝置股份有限公司 基板處理方法及基板處理裝置
TWI897318B (zh) * 2023-03-31 2025-09-11 日商芝浦機械電子裝置股份有限公司 基板處理裝置以及基板處理方法

Also Published As

Publication number Publication date
KR20150037509A (ko) 2015-04-08
CN104517875A (zh) 2015-04-15
JP2015092537A (ja) 2015-05-14
US20150090298A1 (en) 2015-04-02
EP2854165A1 (en) 2015-04-01
KR101624038B1 (ko) 2016-05-24
JP6426924B2 (ja) 2018-11-21

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