KR101624038B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR101624038B1
KR101624038B1 KR1020140108213A KR20140108213A KR101624038B1 KR 101624038 B1 KR101624038 B1 KR 101624038B1 KR 1020140108213 A KR1020140108213 A KR 1020140108213A KR 20140108213 A KR20140108213 A KR 20140108213A KR 101624038 B1 KR101624038 B1 KR 101624038B1
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KR
South Korea
Prior art keywords
substrate
volatile solvent
cleaning liquid
magnetic field
solvent
Prior art date
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Expired - Fee Related
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KR1020140108213A
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English (en)
Korean (ko)
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KR20150037509A (ko
Inventor
유지 나가시마
준 마츠시타
유키 사이토
고노스케 하야시
구니히로 미야자키
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20150037509A publication Critical patent/KR20150037509A/ko
Application granted granted Critical
Publication of KR101624038B1 publication Critical patent/KR101624038B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mixers With Rotating Receptacles And Mixers With Vibration Mechanisms (AREA)
  • Drying Of Solid Materials (AREA)
  • Extraction Or Liquid Replacement (AREA)
KR1020140108213A 2013-09-30 2014-08-20 기판 처리 장치 및 기판 처리 방법 Expired - Fee Related KR101624038B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013205126 2013-09-30
JPJP-P-2013-205126 2013-09-30
JP2014139197A JP6426924B2 (ja) 2013-09-30 2014-07-04 基板処理装置及び基板処理方法
JPJP-P-2014-139197 2014-07-04

Publications (2)

Publication Number Publication Date
KR20150037509A KR20150037509A (ko) 2015-04-08
KR101624038B1 true KR101624038B1 (ko) 2016-05-24

Family

ID=51730317

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140108213A Expired - Fee Related KR101624038B1 (ko) 2013-09-30 2014-08-20 기판 처리 장치 및 기판 처리 방법

Country Status (6)

Country Link
US (1) US20150090298A1 (enExample)
EP (1) EP2854165A1 (enExample)
JP (1) JP6426924B2 (enExample)
KR (1) KR101624038B1 (enExample)
CN (1) CN104517875A (enExample)
TW (1) TW201523724A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6543534B2 (ja) * 2015-08-26 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7045867B2 (ja) * 2018-01-26 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7064339B2 (ja) * 2018-01-31 2022-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI702373B (zh) * 2019-03-22 2020-08-21 由田新技股份有限公司 翻面式多軸機械手臂裝置及其光學檢測設備
GB201905138D0 (en) 2019-04-11 2019-05-29 Spts Technologies Ltd Apparatus and method for processing a substrate
CN111842283A (zh) * 2020-06-29 2020-10-30 北京信和洁能新能源技术服务有限公司 具有内置水箱的离子瀑空气净化机的自动清洗系统及方法
JP7453874B2 (ja) * 2020-07-30 2024-03-21 芝浦メカトロニクス株式会社 基板処理方法、および基板処理装置
JP7072623B1 (ja) * 2020-11-11 2022-05-20 芝浦機械株式会社 抽出乾燥装置
JP2024145228A (ja) * 2023-03-31 2024-10-15 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004107426A1 (ja) * 2003-05-27 2004-12-09 Personal Creation Ltd. 磁石を備えた基板の処理装置及び処理方法
US20080190454A1 (en) 2007-02-09 2008-08-14 Atsuro Eitoku Substrate treatment method and substrate treatment apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205273A (ja) * 2002-01-16 2003-07-22 Mgchemical Kk 洗浄及び乾燥方法
JP2008034779A (ja) 2006-06-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP5448536B2 (ja) * 2009-04-08 2014-03-19 東京エレクトロン株式会社 レジスト塗布現像装置およびレジスト塗布現像方法、並びにレジスト膜処理装置およびレジスト膜処理方法
JP2011135009A (ja) * 2009-12-25 2011-07-07 Tokyo Electron Ltd 基板乾燥装置及び基板乾燥方法
JP2012200679A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
US8715518B2 (en) * 2011-10-12 2014-05-06 Intermolecular, Inc. Gas barrier with vent ring for protecting a surface region from liquid

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004107426A1 (ja) * 2003-05-27 2004-12-09 Personal Creation Ltd. 磁石を備えた基板の処理装置及び処理方法
US20080190454A1 (en) 2007-02-09 2008-08-14 Atsuro Eitoku Substrate treatment method and substrate treatment apparatus

Also Published As

Publication number Publication date
CN104517875A (zh) 2015-04-15
EP2854165A1 (en) 2015-04-01
JP6426924B2 (ja) 2018-11-21
US20150090298A1 (en) 2015-04-02
KR20150037509A (ko) 2015-04-08
TW201523724A (zh) 2015-06-16
JP2015092537A (ja) 2015-05-14

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