JP6416454B2 - 向上した熱散逸能力を有する３ｄ集積電子デバイス構造 - Google Patents

向上した熱散逸能力を有する３ｄ集積電子デバイス構造 Download PDF

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Publication number
JP6416454B2
JP6416454B2 JP2012210260A JP2012210260A JP6416454B2 JP 6416454 B2 JP6416454 B2 JP 6416454B2 JP 2012210260 A JP2012210260 A JP 2012210260A JP 2012210260 A JP2012210260 A JP 2012210260A JP 6416454 B2 JP6416454 B2 JP 6416454B2
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Japan
Prior art keywords
cap layer
device substrate
substrate
chip assembly
integrated chip
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Japanese (ja)
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JP2013080923A (ja
JP2013080923A5 (enExample
Inventor
カウスタブー・ラヴィンドラ・ナガールカール
クリストファー・フレッド・カイメル
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General Electric Co
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General Electric Co
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Publication of JP2013080923A5 publication Critical patent/JP2013080923A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0081—Thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0083—Temperature control
    • B81B7/009—Maintaining a constant temperature by heating or cooling
    • B81B7/0093—Maintaining a constant temperature by heating or cooling by cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Micromachines (AREA)
JP2012210260A 2011-09-30 2012-09-25 向上した熱散逸能力を有する３ｄ集積電子デバイス構造 Active JP6416454B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/249,492 2011-09-30
US13/249,492 US8698258B2 (en) 2011-09-30 2011-09-30 3D integrated electronic device structure including increased thermal dissipation capabilities

Publications (3)

Publication Number Publication Date
JP2013080923A JP2013080923A (ja) 2013-05-02
JP2013080923A5 JP2013080923A5 (enExample) 2015-11-05
JP6416454B2 true JP6416454B2 (ja) 2018-10-31

Family

ID=47221939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012210260A Active JP6416454B2 (ja) 2011-09-30 2012-09-25 向上した熱散逸能力を有する３ｄ集積電子デバイス構造

Country Status (4)

Country Link
US (2) US8698258B2 (enExample)
EP (1) EP2575164A3 (enExample)
JP (1) JP6416454B2 (enExample)
CN (1) CN103030093B (enExample)

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CN113044802A (zh) * 2021-04-13 2021-06-29 北京航空航天大学 Mems器件真空封装结构及其制造工艺
CN116675175B (zh) * 2023-08-04 2023-12-08 青岛泰睿思微电子有限公司 一种多功能影像光感封装结构

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Also Published As

Publication number Publication date
JP2013080923A (ja) 2013-05-02
US20140170811A1 (en) 2014-06-19
EP2575164A2 (en) 2013-04-03
US8698258B2 (en) 2014-04-15
CN103030093B (zh) 2018-02-02
CN103030093A (zh) 2013-04-10
EP2575164A3 (en) 2016-01-13
US8802475B2 (en) 2014-08-12
US20130082376A1 (en) 2013-04-04

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