JPS5040941Y1 - - Google Patents
Info
- Publication number
- JPS5040941Y1 JPS5040941Y1 JP1970055723U JP5572370U JPS5040941Y1 JP S5040941 Y1 JPS5040941 Y1 JP S5040941Y1 JP 1970055723 U JP1970055723 U JP 1970055723U JP 5572370 U JP5572370 U JP 5572370U JP S5040941 Y1 JPS5040941 Y1 JP S5040941Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1970055723U JPS5040941Y1 (enExample) | 1970-06-08 | 1970-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1970055723U JPS5040941Y1 (enExample) | 1970-06-08 | 1970-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5040941Y1 true JPS5040941Y1 (enExample) | 1975-11-21 |
Family
ID=33059603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1970055723U Expired JPS5040941Y1 (enExample) | 1970-06-08 | 1970-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5040941Y1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013080923A (ja) * | 2011-09-30 | 2013-05-02 | General Electric Co <Ge> | 向上した熱散逸能力を有する３ｄ集積電子デバイス構造 |
-
1970
- 1970-06-08 JP JP1970055723U patent/JPS5040941Y1/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013080923A (ja) * | 2011-09-30 | 2013-05-02 | General Electric Co <Ge> | 向上した熱散逸能力を有する３ｄ集積電子デバイス構造 |