JP6416442B1 - 表面実装リレー用液晶性樹脂組成物及びそれを用いた表面実装リレー - Google Patents
表面実装リレー用液晶性樹脂組成物及びそれを用いた表面実装リレー Download PDFInfo
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- JP6416442B1 JP6416442B1 JP2018520208A JP2018520208A JP6416442B1 JP 6416442 B1 JP6416442 B1 JP 6416442B1 JP 2018520208 A JP2018520208 A JP 2018520208A JP 2018520208 A JP2018520208 A JP 2018520208A JP 6416442 B1 JP6416442 B1 JP 6416442B1
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- 239000011342 resin composition Substances 0.000 title claims abstract description 85
- 229920006038 crystalline resin Polymers 0.000 title claims abstract description 82
- 239000000835 fiber Substances 0.000 claims abstract description 54
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 45
- 229920006149 polyester-amide block copolymer Polymers 0.000 claims abstract description 43
- 239000012765 fibrous filler Substances 0.000 claims abstract description 41
- 125000003118 aryl group Chemical group 0.000 claims abstract description 39
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 20
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 18
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical class CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
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- 239000002841 Lewis acid Substances 0.000 description 1
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- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
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- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
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- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H45/00—Details of relays
- H01H45/02—Bases; Casings; Covers
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016248302 | 2016-12-21 | ||
JP2016248302 | 2016-12-21 | ||
PCT/JP2017/044424 WO2018116888A1 (ja) | 2016-12-21 | 2017-12-11 | 表面実装リレー用液晶性樹脂組成物及びそれを用いた表面実装リレー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6416442B1 true JP6416442B1 (ja) | 2018-10-31 |
JPWO2018116888A1 JPWO2018116888A1 (ja) | 2018-12-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018520208A Active JP6416442B1 (ja) | 2016-12-21 | 2017-12-11 | 表面実装リレー用液晶性樹脂組成物及びそれを用いた表面実装リレー |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6416442B1 (zh) |
KR (1) | KR102020634B1 (zh) |
CN (1) | CN109844028B (zh) |
TW (1) | TWI716655B (zh) |
WO (1) | WO2018116888A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230074570A (ko) | 2020-10-28 | 2023-05-30 | 에네오스 가부시키가이샤 | 수지 성형품의 접착제에 대한 접착 강도의 향상 방법 및 접착 강도를 향상시킨 복합체 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2021229931A1 (ja) * | 2020-05-13 | 2021-11-18 | ポリプラスチックス株式会社 | 表面実装リレー用液晶性樹脂組成物及びそれを用いた表面実装リレー |
CN116806239A (zh) * | 2021-02-05 | 2023-09-26 | 宝理塑料株式会社 | 风扇叶轮用液晶性树脂组合物及使用其的风扇叶轮 |
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JPS6357634A (ja) * | 1986-08-28 | 1988-03-12 | バスフ アクチェンゲゼルシャフト | 全芳香族熱互変性ポリエステル |
JPH06263857A (ja) * | 1993-03-17 | 1994-09-20 | Dainippon Ink & Chem Inc | 共重合ポリエステル類およびその製造法 |
WO1998056578A1 (fr) * | 1997-06-13 | 1998-12-17 | Nippon Petrochemicals Company, Limited | Composite lie et composition adhesive pour ledit composite |
JP2005060455A (ja) * | 2003-08-20 | 2005-03-10 | Toray Ind Inc | 液晶性ポリエステルアミドおよびその製造方法 |
JP2010138228A (ja) * | 2008-12-09 | 2010-06-24 | Nippon Oil Corp | 液晶ポリエステル樹脂組成物 |
JP2013098313A (ja) * | 2011-10-31 | 2013-05-20 | Sumitomo Chemical Co Ltd | 高電圧コイル |
WO2013115168A1 (ja) * | 2012-01-31 | 2013-08-08 | Jx日鉱日石エネルギー株式会社 | 液晶ポリエステルアミド、液晶ポリエステルアミド樹脂組成物及び成形体 |
JP2016014137A (ja) * | 2014-06-09 | 2016-01-28 | 住友化学株式会社 | 液晶ポリエステル樹脂組成物、コネクターおよび液晶ポリエステル樹脂組成物の製造方法 |
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ES2010297A6 (es) * | 1988-07-27 | 1989-11-01 | Cables Comunicaciones | Un procedimiento para la preparacion de nuevas copoliesteramidas termotropas aromaticas. |
JP3463310B2 (ja) | 1993-03-12 | 2003-11-05 | オムロン株式会社 | 表面実装リレー |
US5798432A (en) * | 1996-03-22 | 1998-08-25 | Hoechst Celanese Corp. | Method of making thermotropic liquid crystalline polymers containing hydroquinone |
JP5165492B2 (ja) * | 2008-05-23 | 2013-03-21 | ポリプラスチックス株式会社 | 平面状コネクター |
JP5935288B2 (ja) * | 2010-10-29 | 2016-06-15 | 住友化学株式会社 | 液晶ポリエステル組成物 |
JP5485216B2 (ja) * | 2011-04-01 | 2014-05-07 | ポリプラスチックス株式会社 | 平面状コネクター |
JP5885520B2 (ja) * | 2012-01-30 | 2016-03-15 | 住友化学株式会社 | 樹脂組成物の製造方法 |
JP5769888B2 (ja) * | 2012-09-26 | 2015-08-26 | ポリプラスチックス株式会社 | 電子部品用複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品 |
CN108026269A (zh) * | 2015-10-21 | 2018-05-11 | 宝理塑料株式会社 | 全芳香族聚酯酰胺和其制造方法 |
CN108026270B (zh) * | 2015-10-21 | 2019-03-26 | 宝理塑料株式会社 | 全芳香族聚酯酰胺和其制造方法 |
-
2017
- 2017-12-11 JP JP2018520208A patent/JP6416442B1/ja active Active
- 2017-12-11 KR KR1020197008423A patent/KR102020634B1/ko active IP Right Grant
- 2017-12-11 CN CN201780064384.5A patent/CN109844028B/zh active Active
- 2017-12-11 WO PCT/JP2017/044424 patent/WO2018116888A1/ja active Application Filing
- 2017-12-19 TW TW106144571A patent/TWI716655B/zh active
Patent Citations (8)
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JPS6357634A (ja) * | 1986-08-28 | 1988-03-12 | バスフ アクチェンゲゼルシャフト | 全芳香族熱互変性ポリエステル |
JPH06263857A (ja) * | 1993-03-17 | 1994-09-20 | Dainippon Ink & Chem Inc | 共重合ポリエステル類およびその製造法 |
WO1998056578A1 (fr) * | 1997-06-13 | 1998-12-17 | Nippon Petrochemicals Company, Limited | Composite lie et composition adhesive pour ledit composite |
JP2005060455A (ja) * | 2003-08-20 | 2005-03-10 | Toray Ind Inc | 液晶性ポリエステルアミドおよびその製造方法 |
JP2010138228A (ja) * | 2008-12-09 | 2010-06-24 | Nippon Oil Corp | 液晶ポリエステル樹脂組成物 |
JP2013098313A (ja) * | 2011-10-31 | 2013-05-20 | Sumitomo Chemical Co Ltd | 高電圧コイル |
WO2013115168A1 (ja) * | 2012-01-31 | 2013-08-08 | Jx日鉱日石エネルギー株式会社 | 液晶ポリエステルアミド、液晶ポリエステルアミド樹脂組成物及び成形体 |
JP2016014137A (ja) * | 2014-06-09 | 2016-01-28 | 住友化学株式会社 | 液晶ポリエステル樹脂組成物、コネクターおよび液晶ポリエステル樹脂組成物の製造方法 |
Cited By (1)
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