JP6413654B2 - 回路基板及びその製造方法 - Google Patents

回路基板及びその製造方法 Download PDF

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Publication number
JP6413654B2
JP6413654B2 JP2014224164A JP2014224164A JP6413654B2 JP 6413654 B2 JP6413654 B2 JP 6413654B2 JP 2014224164 A JP2014224164 A JP 2014224164A JP 2014224164 A JP2014224164 A JP 2014224164A JP 6413654 B2 JP6413654 B2 JP 6413654B2
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JP
Japan
Prior art keywords
insulating layer
less
inorganic filler
resin
via hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014224164A
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English (en)
Japanese (ja)
Other versions
JP2016092172A (ja
Inventor
嘉生 西村
嘉生 西村
中村　茂雄
茂雄 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2014224164A priority Critical patent/JP6413654B2/ja
Priority to TW104133380A priority patent/TWI683607B/zh
Priority to CN201510728317.1A priority patent/CN105578737B/zh
Priority to KR1020150153425A priority patent/KR102362911B1/ko
Publication of JP2016092172A publication Critical patent/JP2016092172A/ja
Application granted granted Critical
Publication of JP6413654B2 publication Critical patent/JP6413654B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2014224164A 2014-11-04 2014-11-04 回路基板及びその製造方法 Active JP6413654B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014224164A JP6413654B2 (ja) 2014-11-04 2014-11-04 回路基板及びその製造方法
TW104133380A TWI683607B (zh) 2014-11-04 2015-10-12 電路基板及其製造方法
CN201510728317.1A CN105578737B (zh) 2014-11-04 2015-11-02 电路基板及其制造方法
KR1020150153425A KR102362911B1 (ko) 2014-11-04 2015-11-02 회로 기판 및 이의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014224164A JP6413654B2 (ja) 2014-11-04 2014-11-04 回路基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2016092172A JP2016092172A (ja) 2016-05-23
JP6413654B2 true JP6413654B2 (ja) 2018-10-31

Family

ID=55888242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014224164A Active JP6413654B2 (ja) 2014-11-04 2014-11-04 回路基板及びその製造方法

Country Status (4)

Country Link
JP (1) JP6413654B2 (ko)
KR (1) KR102362911B1 (ko)
CN (1) CN105578737B (ko)
TW (1) TWI683607B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7268953B2 (ja) * 2016-09-16 2023-05-08 味の素株式会社 樹脂シート、プリント配線板及び半導体装置
JP6911311B2 (ja) * 2016-09-21 2021-07-28 味の素株式会社 樹脂組成物
JP6919508B2 (ja) * 2017-11-07 2021-08-18 味の素株式会社 樹脂組成物
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7661190B2 (en) * 2003-03-04 2010-02-16 Zeon Corporation Process for producing multilayer printed wiring board
JP2007077234A (ja) * 2005-09-13 2007-03-29 Hitachi Chem Co Ltd 絶縁樹脂、支持体付き絶縁樹脂フィルム及びそれを用いた樹脂付き基材、該樹脂付き基材に導体回路を形成した配線板及びその製造方法。
JP2008037957A (ja) 2006-08-03 2008-02-21 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板
JP2013080757A (ja) * 2011-09-30 2013-05-02 National Institute Of Advanced Industrial & Technology プリント配線板用積層構造体およびプリント配線板の製造方法
JP5261756B1 (ja) * 2012-03-30 2013-08-14 株式会社フジクラ 多層配線基板
TWI657730B (zh) * 2012-05-31 2019-04-21 日商味之素股份有限公司 多層印刷配線板之製造方法
JP6011079B2 (ja) * 2012-07-05 2016-10-19 味の素株式会社 支持体付き樹脂シート
JP2014082334A (ja) * 2012-10-16 2014-05-08 Ibiden Co Ltd 配線板及びその製造方法

Also Published As

Publication number Publication date
KR102362911B1 (ko) 2022-02-16
CN105578737B (zh) 2020-01-24
TW201630497A (zh) 2016-08-16
TWI683607B (zh) 2020-01-21
CN105578737A (zh) 2016-05-11
KR20160052423A (ko) 2016-05-12
JP2016092172A (ja) 2016-05-23

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