JP6409063B2 - 歪み修正面活性領域を有するiii族窒化物ナノワイヤled及びその製造方法 - Google Patents
歪み修正面活性領域を有するiii族窒化物ナノワイヤled及びその製造方法 Download PDFInfo
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- JP6409063B2 JP6409063B2 JP2016526939A JP2016526939A JP6409063B2 JP 6409063 B2 JP6409063 B2 JP 6409063B2 JP 2016526939 A JP2016526939 A JP 2016526939A JP 2016526939 A JP2016526939 A JP 2016526939A JP 6409063 B2 JP6409063 B2 JP 6409063B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
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- Led Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361917046P | 2013-12-17 | 2013-12-17 | |
| US61/917,046 | 2013-12-17 | ||
| PCT/US2014/070347 WO2015095049A1 (en) | 2013-12-17 | 2014-12-15 | Iii-nitride nanowire led with strain modified surface active region and method of making thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017503333A JP2017503333A (ja) | 2017-01-26 |
| JP2017503333A5 JP2017503333A5 (enExample) | 2017-12-28 |
| JP6409063B2 true JP6409063B2 (ja) | 2018-10-17 |
Family
ID=53403568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016526939A Active JP6409063B2 (ja) | 2013-12-17 | 2014-12-15 | 歪み修正面活性領域を有するiii族窒化物ナノワイヤled及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9281442B2 (enExample) |
| EP (1) | EP3084847B1 (enExample) |
| JP (1) | JP6409063B2 (enExample) |
| TW (1) | TWI621278B (enExample) |
| WO (1) | WO2015095049A1 (enExample) |
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| EP2297794B1 (en) | 2008-07-07 | 2017-09-06 | Glo Ab | Nanostructured light emitting diode |
| WO2015095049A1 (en) | 2013-12-17 | 2015-06-25 | Glo Ab | Iii-nitride nanowire led with strain modified surface active region and method of making thereof |
| WO2016022824A1 (en) | 2014-08-08 | 2016-02-11 | Glo Ab | Pixilated display device based upon nanowire leds and method for making the same |
| EP3180806A4 (en) * | 2014-08-12 | 2018-03-07 | Glo Ab | Iii-nitride nanowire led with strain modified surface active region and method of making thereof |
| US9620559B2 (en) | 2014-09-26 | 2017-04-11 | Glo Ab | Monolithic image chip for near-to-eye display |
| US10290767B2 (en) | 2015-06-09 | 2019-05-14 | The Royal Institution For The Advancement Of Learning/Mcgill University | High efficiency visible and ultraviolet nanowire emitters |
| US11322652B2 (en) * | 2015-12-14 | 2022-05-03 | Ostendo Technologies, Inc. | Methods for producing composite GaN nanocolumns and light emitting structures made from the methods |
| EP3446330A4 (en) | 2016-04-22 | 2019-12-18 | Glo Ab | DIRECT VIEW DISPLAY WITH A SMALL TILTING ANGLE AND METHOD FOR PRODUCING THE SAME |
| KR20180133436A (ko) | 2016-05-04 | 2018-12-14 | 글로 에이비 | 상이한 색상의 led를 포함하는 일체형 다색 직시형 디스플레이와 이의 제조 방법 |
| US10096469B2 (en) * | 2016-08-24 | 2018-10-09 | COMSATS Institute of Information Technology (CIIT) | Sn doped ZnS nanowires for white light source material |
| JP6662464B2 (ja) | 2016-09-29 | 2020-03-11 | 日亜化学工業株式会社 | 発光素子 |
| KR102335714B1 (ko) | 2016-10-24 | 2021-12-06 | 글로 에이비 | 발광 다이오드, 디스플레이 소자 및 직시형 디스플레이 소자 |
| KR102305344B1 (ko) | 2017-01-09 | 2021-09-27 | 글로 에이비 | 다이렉트 뷰 디스플레이를 위한 집적 반사기를 갖는 발광 다이오드 및 이의 제조 방법 |
| US10998465B2 (en) | 2017-01-09 | 2021-05-04 | Glo Ab | Light emitting diodes with integrated reflector for a direct view display and method of making thereof |
| US20180277713A1 (en) * | 2017-03-21 | 2018-09-27 | Glo Ab | Red light emitting diodes having an indium gallium nitride template layer and method of making thereof |
| JP7147132B2 (ja) * | 2017-05-31 | 2022-10-05 | セイコーエプソン株式会社 | 発光装置、プロジェクター、および発光装置の製造方法 |
| US10418499B2 (en) | 2017-06-01 | 2019-09-17 | Glo Ab | Self-aligned nanowire-based light emitting diode subpixels for a direct view display and method of making thereof |
| US11417794B2 (en) | 2017-08-15 | 2022-08-16 | Nanosys, Inc. | Method of making a semiconductor device using nano-imprint lithography for formation of a selective growth mask |
| US10439101B2 (en) * | 2017-08-18 | 2019-10-08 | Intel Corporation | Micro light-emitting diode (LED) elements and display |
| US10707374B2 (en) | 2017-09-15 | 2020-07-07 | Glo Ab | Etendue enhancement for light emitting diode subpixels |
| EP3692580A4 (en) | 2017-10-06 | 2022-07-13 | Nanosys, Inc. | LED WITH OXIDIZED METAL CONTACTS |
| US11362238B2 (en) | 2017-10-06 | 2022-06-14 | Nanosys, Inc. | Light emitting diode containing oxidized metal contacts |
| FR3076399B1 (fr) * | 2017-12-28 | 2020-01-24 | Aledia | Dispositif optoelectronique comprenant des diodes electroluminescentes tridimensionnelles |
| US10627673B2 (en) | 2018-04-06 | 2020-04-21 | Glo Ab | Light emitting diode array containing a multilayer bus electrode and method of making the same |
| US11257983B2 (en) | 2018-04-11 | 2022-02-22 | Nanosys, Inc. | Light emitting diodes formed on nanodisk substrates and methods of making the same |
| TW202431960A (zh) | 2018-04-20 | 2024-08-01 | 美商納諾西斯有限公司 | 用於直視型顯示器之子像素發光二極體及其製造方法 |
| WO2019240894A1 (en) | 2018-06-14 | 2019-12-19 | Glo Ab | Epitaxial gallium nitride based light emitting diode and method of making thereof |
| US11239212B2 (en) | 2018-08-24 | 2022-02-01 | Nanosys, Inc. | Light emitting diode array containing a black matrix and an optical bonding layer and method of making the same |
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| US11637219B2 (en) | 2019-04-12 | 2023-04-25 | Google Llc | Monolithic integration of different light emitting structures on a same substrate |
| WO2020243147A1 (en) | 2019-05-30 | 2020-12-03 | Glo Ab | Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same |
| FR3098012B1 (fr) * | 2019-06-25 | 2023-01-13 | Aledia | Procédé d'homogénéisation de la section de nanofils pour diodes électroluminescentes |
| FR3098992B1 (fr) * | 2019-07-18 | 2023-01-13 | Aledia | Diode électroluminescente et procédé de fabrication |
| GB2586862B (en) | 2019-09-06 | 2021-12-15 | Plessey Semiconductors Ltd | LED precursor incorporating strain relaxing structure |
| US11462659B2 (en) * | 2019-09-10 | 2022-10-04 | Koito Manufacturing Co., Ltd. | Semiconductor light emitting device and manufacturing method of semiconductor light emitting device |
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| JP7520305B2 (ja) * | 2020-08-31 | 2024-07-23 | 株式会社小糸製作所 | 半導体発光素子および半導体発光素子の製造方法 |
| WO2022150162A1 (en) | 2021-01-08 | 2022-07-14 | Nanosys, Inc. | Light-emitting diode device containing microlenses and method of making the same |
| CN114122204B (zh) * | 2021-11-26 | 2024-03-12 | 江苏第三代半导体研究院有限公司 | 一种半导体外延片及其制备方法与应用 |
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| JP3282174B2 (ja) * | 1997-01-29 | 2002-05-13 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
| JP4158519B2 (ja) * | 2002-12-26 | 2008-10-01 | 住友電気工業株式会社 | 白色発光素子およびその製造方法 |
| US7968359B2 (en) * | 2006-03-10 | 2011-06-28 | Stc.Unm | Thin-walled structures |
| US20140012224A1 (en) * | 2006-04-07 | 2014-01-09 | The Regents Of The University Of California | Targeted hollow gold nanostructures and methods of use |
| CN101669219B (zh) | 2006-12-22 | 2011-10-05 | 昆南诺股份有限公司 | 带有直立式纳米线结构的led及其制作方法 |
| EP2102899B1 (en) | 2007-01-12 | 2020-11-11 | QuNano AB | Nitride nanowires and method of producing such |
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| JP2009105088A (ja) * | 2007-10-19 | 2009-05-14 | Panasonic Electric Works Co Ltd | 半導体発光素子およびそれを用いる照明装置ならびに半導体発光素子の製造方法 |
| SE533090C2 (sv) * | 2008-07-09 | 2010-06-22 | Qunano Ab | Nanostrukturerad ljusdiod |
| US8138493B2 (en) | 2008-07-09 | 2012-03-20 | Qunano Ab | Optoelectronic semiconductor device |
| US8932940B2 (en) * | 2008-10-28 | 2015-01-13 | The Regents Of The University Of California | Vertical group III-V nanowires on si, heterostructures, flexible arrays and fabrication |
| KR101549620B1 (ko) * | 2009-01-30 | 2015-09-02 | 삼성전자주식회사 | pn 구조를 지닌 Zn 산화물 나노 와이어 및 그 제조 방법 |
| KR20110064702A (ko) * | 2009-12-08 | 2011-06-15 | 삼성전자주식회사 | 요철 구조를 지닌 코어-쉘 나노 와이어 및 이를 이용한 열전 소자 |
| US9112240B2 (en) * | 2010-01-04 | 2015-08-18 | Nanotek Instruments, Inc. | Lithium metal-sulfur and lithium ion-sulfur secondary batteries containing a nano-structured cathode and processes for producing same |
| EP2553696A4 (en) * | 2010-04-02 | 2016-07-06 | Intel Corp | LOAD MEMORY DEVICE, METHOD OF MANUFACTURING THEREFOR, METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE THEREFOR, MOBILE ELECTRONIC DEVICE THEREWITH AND MICROELECTRONIC DEVICE THEREWITH |
| CN103098237A (zh) * | 2010-06-18 | 2013-05-08 | Glo公司 | 纳米线发光二极管结构及其制造方法 |
| CA2802500A1 (en) * | 2010-06-24 | 2011-12-29 | Glo Ab | Substrate with buffer layer for oriented nanowire growth |
| KR20120052651A (ko) | 2010-11-16 | 2012-05-24 | 삼성엘이디 주식회사 | 나노로드 발광소자 |
| KR20120059064A (ko) | 2010-11-30 | 2012-06-08 | 삼성엘이디 주식회사 | 발광소자 및 그 제조방법 |
| JP5409707B2 (ja) * | 2011-06-15 | 2014-02-05 | シャープ株式会社 | 半導体素子、半導体素子の製造方法、発光ダイオード、光電変換素子、太陽電池、照明装置、バックライトおよび表示装置 |
| US8937297B2 (en) * | 2011-12-02 | 2015-01-20 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Optoelectronic device including nanowires with a core/shell structure |
| TW201511357A (zh) | 2013-06-07 | 2015-03-16 | Glo Ab | 多色led及其製造方法 |
| WO2015095049A1 (en) | 2013-12-17 | 2015-06-25 | Glo Ab | Iii-nitride nanowire led with strain modified surface active region and method of making thereof |
-
2014
- 2014-12-15 WO PCT/US2014/070347 patent/WO2015095049A1/en not_active Ceased
- 2014-12-15 TW TW103143715A patent/TWI621278B/zh not_active IP Right Cessation
- 2014-12-15 EP EP14872419.8A patent/EP3084847B1/en active Active
- 2014-12-15 JP JP2016526939A patent/JP6409063B2/ja active Active
- 2014-12-15 US US14/570,521 patent/US9281442B2/en active Active
-
2016
- 2016-03-04 US US15/060,950 patent/US9761757B2/en active Active
-
2017
- 2017-08-14 US US15/676,654 patent/US10026866B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9761757B2 (en) | 2017-09-12 |
| TWI621278B (zh) | 2018-04-11 |
| WO2015095049A1 (en) | 2015-06-25 |
| JP2017503333A (ja) | 2017-01-26 |
| TW201530807A (zh) | 2015-08-01 |
| US20170345969A1 (en) | 2017-11-30 |
| US10026866B2 (en) | 2018-07-17 |
| US20150207028A1 (en) | 2015-07-23 |
| US20160260866A1 (en) | 2016-09-08 |
| EP3084847B1 (en) | 2018-02-14 |
| US9281442B2 (en) | 2016-03-08 |
| EP3084847A4 (en) | 2017-05-31 |
| EP3084847A1 (en) | 2016-10-26 |
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