JP6407281B2 - 撥水性および撥油性を有する高分子薄膜およびその製造方法 - Google Patents
撥水性および撥油性を有する高分子薄膜およびその製造方法 Download PDFInfo
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- 229920000642 polymer Polymers 0.000 title claims description 151
- 239000010409 thin film Substances 0.000 title claims description 126
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 102
- 150000001875 compounds Chemical class 0.000 claims description 63
- 239000000178 monomer Substances 0.000 claims description 56
- 238000007740 vapor deposition Methods 0.000 claims description 46
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 31
- 239000003999 initiator Substances 0.000 claims description 29
- 125000001153 fluoro group Chemical group F* 0.000 claims description 28
- 125000000524 functional group Chemical group 0.000 claims description 27
- 230000003746 surface roughness Effects 0.000 claims description 26
- 238000000151 deposition Methods 0.000 claims description 24
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 20
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 20
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 20
- 239000005642 Oleic acid Substances 0.000 claims description 20
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 20
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 20
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 20
- 230000003068 static effect Effects 0.000 claims description 19
- 230000008021 deposition Effects 0.000 claims description 16
- 229910052731 fluorine Inorganic materials 0.000 claims description 14
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 13
- 239000011737 fluorine Substances 0.000 claims description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 238000003786 synthesis reaction Methods 0.000 claims description 9
- 239000002952 polymeric resin Substances 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 8
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- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 6
- 101100365516 Mus musculus Psat1 gene Proteins 0.000 claims description 6
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- -1 pentafluorobenzyl Chemical group 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 150000002978 peroxides Chemical class 0.000 claims description 5
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 claims description 4
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 claims description 3
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 3
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 claims description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 229960000834 vinyl ether Drugs 0.000 claims description 2
- YZAZXIUFBCPZGB-QZOPMXJLSA-N (z)-octadec-9-enoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O.CCCCCCCC\C=C/CCCCCCCC(O)=O YZAZXIUFBCPZGB-QZOPMXJLSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000000977 initiatory effect Effects 0.000 claims 1
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 40
- 238000000034 method Methods 0.000 description 32
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- 239000000126 substance Substances 0.000 description 19
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- 238000010438 heat treatment Methods 0.000 description 12
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- 238000000089 atomic force micrograph Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
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- QUKRIOLKOHUUBM-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCOC(=O)C=C QUKRIOLKOHUUBM-UHFFFAOYSA-N 0.000 description 4
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- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 2
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical group 0.000 description 2
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- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
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- 238000010574 gas phase reaction Methods 0.000 description 2
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- 239000012528 membrane Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- JJRDRFZYKKFYMO-UHFFFAOYSA-N 2-methyl-2-(2-methylbutan-2-ylperoxy)butane Chemical compound CCC(C)(C)OOC(C)(C)CC JJRDRFZYKKFYMO-UHFFFAOYSA-N 0.000 description 1
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GQBGJQIPSUOZRK-UHFFFAOYSA-N N(=NC(C)(C)C)C(C)(C)C.N(=NC(C)(C)C)C(C)(C)C Chemical compound N(=NC(C)(C)C)C(C)(C)C.N(=NC(C)(C)C)C(C)(C)C GQBGJQIPSUOZRK-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- ATMLPEJAVWINOF-UHFFFAOYSA-N acrylic acid acrylic acid Chemical compound OC(=O)C=C.OC(=O)C=C ATMLPEJAVWINOF-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 238000004050 hot filament vapor deposition Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000007773 negative electrode material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
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Description
蒸着分圧=Pm/Psat
蒸着基板のシリコンウエハを酸素プラズマで前処理洗浄し、熱線化学気相蒸着反応器の内部に位置させた。前記気相蒸着反応器において、基板の表面温度は20℃に維持し、工程圧を0.1Torrで適用し、ニッケル−クロム(8:2)の熱線を300℃に加熱した。
前記エチレングリコールジアクリレートを使用せず、下記表1に記載の気化時の適用温度および計測バルブの開放程度を適用した点を除き、実施例1と同様の方法で高分子薄膜を製造した。この時、比較例1では約30分程度蒸着を行った。
実施例1と同様の方法で高分子薄膜を製造するが、この時、下記表1に記載のように、エチレングリコールジアクリレートを相対的に微量または相対的に過剰注入して、比較例2および比較例3の高分子薄膜を製造した。この時、比較例2〜3では約15分程度蒸着を行った。
実験例1:蒸着膜の成分分析
X線光電子分光分析器(XPS or ESCAモデル名:ESCALAB250(VG))を用いて、次のようなシステム条件で蒸着膜の成分分析を実施した。
原子力顕微鏡(Large stage AFM(Veeco社Dimension3100))を用いて、タッピングモード(Tapping mode)5μmx5μmの領域に対してスキャンを実施して、前記実施例および比較例で得られた高分子蒸着薄膜の平均表面粗さ(Ra)を測定した。
(1)静接触角の測定
タンジェント方法(Tangent method)により、水とオレイン酸(oleic acid)それぞれ3μlを、前記実施例および比較例で得られた高分子蒸着薄膜の表面に載せ、DSA100測定装置を用いて静接触角を測定した。
前記実施例および比較例で得られた高分子蒸着薄膜の表面に、30μlのオレイン酸(oleic acid)を載せた後に、ステージの一方を持ち上げて前記フィルムに傾斜角を設けながら前記オレイン酸の流れ落ちる時点の角度[スライディング角度、sliding angle]を、チルティングテーブル方法(Tilting table method)でDSA100測定装置を用いて測定した。
ASTM D3363試験規格に基づいた方法により、鉛筆硬度テスト器を用いて500gの錘を載せ、多様な硬度の鉛筆を用いて、前記実施例および比較例で得られた高分子蒸着薄膜の表面の鉛筆硬度を測定した。
前記実施例および比較例で得られた高分子蒸着試験片を、250℃のオーブンで1時間熱処理した後、加熱前と後の薄膜の表面状態を顕微鏡を通して観察した。
前記実施例および比較例で得られた高分子蒸着薄膜の表面にヘキサフルオロイソプロパノールを0.5mLを滴加し、溶解が発生したか否かを確認した。
Claims (16)
- 気体状の熱開始剤を熱分解してラジカルを形成する段階と、
フッ素系官能基が置換された(メタ)アクリレート系単量体、およびビニル基または(メタ)アクリレート系官能基を2以上含む反応性化合物を含む単量体混合物と、前記形成されたラジカルとが反応する高分子合成段階と、
前記合成された高分子が基材上に蒸着される段階とを含み、
前記フッ素系官能基が置換された(メタ)アクリレート系単量体が有する下記一般式1の蒸着分圧に対する、前記ビニル基または(メタ)アクリレート系官能基を2以上含む反応性化合物が有する下記一般式1の蒸着分圧の比率が0.13〜0.50であり、
3μlの蒸留水に対して120°〜140°の静接触角を有し、3μlのオレイン酸(oleic acid)に対して80°〜120°の静接触角を有し、30μlのオレイン酸(oleic acid)に対して有するスライディング角度(sliding angle)が3°〜30°であり、
平均表面粗さが15nm以下であり、
厚さ100nmあたりの平均表面粗さが3nm以下である、撥水性および撥油性を有する高分子蒸着薄膜の製造方法:
[一般式1]
蒸着分圧=Pm/Psat
前記一般式1において、
Psatは、前記合成された高分子が蒸着される基材の表面温度における当該単量体または化合物の飽和蒸気圧(saturation vapor pressure)を意味し、
Pmは、前記蒸着が行われる反応器内における当該単量体または化合物の分圧(partial pressure)を意味する。 - ASTM D3363により、500gの錘を用いて測定した前記製造される高分子薄膜の鉛筆硬度がHB以上である、請求項1に記載の高分子蒸着薄膜の製造方法。
- 10nm〜1,000nmの厚さを有する、請求項1に記載の高分子蒸着薄膜の製造方法。
- 前記気体状の熱開始剤を熱分解してラジカルを形成する段階は、前記気体状の熱開始剤と、150℃〜500℃の温度に加熱した金属フィラメントとを接触する段階を含む、請求項1に記載の高分子蒸着薄膜の製造方法。
- 前記熱開始剤は、過酸化物およびアゾ系化合物からなる群より選択された1種以上を含む、請求項1に記載の高分子蒸着薄膜の製造方法。
- 前記フッ素系官能基が置換された(メタ)アクリレート系単量体は、炭素数2〜12のペルフルオロアルキル(メタ)アクリレート、ペンタフルオロフェニル(メタ)アクリレート、およびペンタフルオロベンジル(メタ)アクリレートからなる群より選択された1種以上を含む、請求項1に記載の高分子蒸着薄膜の製造方法。
- 前記ビニル基または(メタ)アクリレート系官能基を2以上含む反応性化合物は、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、エチレングリコールジビニルエーテル、ジエチレングリコールジビニルエーテル、トリエチレングリコールジビニルエーテル、およびジビニルベンゼンからなる群より選択された1種以上を含む、請求項1に記載の高分子蒸着薄膜の製造方法。
- 前記フッ素系官能基が置換された(メタ)アクリレート系単量体、前記ビニル基または(メタ)アクリレート系官能基を2以上含む反応性化合物、および前記熱開始剤を、それぞれ、または同時に、20℃〜200℃の温度で気化させる段階をさらに含む、請求項1に記載の高分子蒸着薄膜の製造方法。
- 前記合成された高分子が基材上に蒸着される段階において、前記基材が0℃〜60℃の温度で維持される、請求項1に記載の撥水性および撥油性を有する高分子蒸着薄膜の製造方法。
- 前記合成された高分子が基材上に蒸着される段階における圧力が0.1Torr〜1Torrである、請求項1に記載の高分子蒸着薄膜の製造方法。
- 前記高分子合成段階の前に、前記フッ素系官能基が置換された(メタ)アクリレート系単量体、前記ビニル基または(メタ)アクリレート系官能基を2以上含む反応性化合物、および前記熱開始剤を、それぞれ、または同時に、20℃〜200℃の温度で気化させる段階をさらに含む、請求項1に記載の高分子蒸着薄膜の製造方法。
- 前記気化したフッ素系官能基が置換された(メタ)アクリレート系単量体、および前記気化したビニル基または(メタ)アクリレート系官能基を2以上含む反応性化合物の全体流量対比の、前記気化した熱開始剤の流量が10%〜100%となるようにして、前記高分子合成段階に注入する段階を含む、請求項11に記載の高分子蒸着薄膜の製造方法。
- フッ素系官能基が置換された(メタ)アクリレート系繰り返し単位;およびビニル基または(メタ)アクリレート系官能基を2以上含む反応性化合物由来の繰り返し単位を100:13〜100:50のモル比で含む高分子樹脂を含み、
平均表面粗さが15nm以下であり、厚さ100nmあたりの平均表面粗さが3nm以下であり、
3μlの蒸留水に対して120°〜140°の静接触角を有し、3μlのオレイン酸(oleic acid)に対して80°〜120°の静接触角を有し、30μlのオレイン酸(oleic acid)に対して有するスライディング角度(sliding angle)が3°〜30°である、撥水性および撥油性を有する高分子蒸着薄膜。 - ASTM D3363により、500gの錘を用いて測定した鉛筆硬度がHB以上である、請求項13に記載の高分子蒸着薄膜。
- 10nm〜1,000nmの厚さを有する、請求項13に記載の高分子蒸着薄膜。
- 前記高分子樹脂が10,000〜1,000,000の重量平均分子量を有する、請求項13に記載の高分子蒸着薄膜。
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