JP6403095B2 - フレキシブル配線用基板およびフレキシブル配線板 - Google Patents

フレキシブル配線用基板およびフレキシブル配線板 Download PDF

Info

Publication number
JP6403095B2
JP6403095B2 JP2015033418A JP2015033418A JP6403095B2 JP 6403095 B2 JP6403095 B2 JP 6403095B2 JP 2015033418 A JP2015033418 A JP 2015033418A JP 2015033418 A JP2015033418 A JP 2015033418A JP 6403095 B2 JP6403095 B2 JP 6403095B2
Authority
JP
Japan
Prior art keywords
layer
copper
flexible wiring
wiring board
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015033418A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016157752A (ja
JP2016157752A5 (enExample
Inventor
雅司 野口
雅司 野口
富雄 島村
富雄 島村
芳英 西山
芳英 西山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2015033418A priority Critical patent/JP6403095B2/ja
Publication of JP2016157752A publication Critical patent/JP2016157752A/ja
Publication of JP2016157752A5 publication Critical patent/JP2016157752A5/ja
Application granted granted Critical
Publication of JP6403095B2 publication Critical patent/JP6403095B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2015033418A 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板 Active JP6403095B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015033418A JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015033418A JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Publications (3)

Publication Number Publication Date
JP2016157752A JP2016157752A (ja) 2016-09-01
JP2016157752A5 JP2016157752A5 (enExample) 2017-06-22
JP6403095B2 true JP6403095B2 (ja) 2018-10-10

Family

ID=56826490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015033418A Active JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Country Status (1)

Country Link
JP (1) JP6403095B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6904194B2 (ja) * 2017-09-22 2021-07-14 住友金属鉱山株式会社 配線基板用積層体及びその製造方法
JP6904195B2 (ja) * 2017-09-22 2021-07-14 住友金属鉱山株式会社 フレキシブル配線基板及びその製造方法
JP7550599B2 (ja) * 2020-10-14 2024-09-13 日東電工株式会社 金属層、導電性フィルム、および、金属層の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008149772A1 (ja) * 2007-06-08 2008-12-11 Mitsui Mining & Smelting Co., Ltd. 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置
KR20150048905A (ko) * 2011-06-28 2015-05-07 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박을 사용한 배선판 및 플렉서블 배선판
CN104247576B (zh) * 2012-04-24 2017-05-31 住友金属矿山株式会社 2层挠性配线用基板及挠性配线板及其制造方法
JP5769030B2 (ja) * 2012-04-26 2015-08-26 住友金属鉱山株式会社 金属化樹脂フィルムおよびその製造方法

Also Published As

Publication number Publication date
JP2016157752A (ja) 2016-09-01

Similar Documents

Publication Publication Date Title
JP6083433B2 (ja) ２層フレキシブル配線用基板及びフレキシブル配線板並びにそれらの製造方法
JP6398596B2 (ja) ２層フレキシブル配線用基板及びそれを用いたフレキシブル配線板
JP5940256B2 (ja) 銅電気めっき方法及びその銅電気めっき方法を用いて成膜された銅めっき被膜を有する金属化樹脂フィルム
JP5769030B2 (ja) 金属化樹脂フィルムおよびその製造方法
TWI568865B (zh) Layer 2 flexible wiring substrate and manufacturing method thereof, and two-layer flexible wiring board and manufacturing method thereof
JP2012057191A (ja) 長尺導電性基板の電気めっき方法およびこの方法を用いた銅被覆長尺導電性基板の製造方法並びにロール・ツー・ロールタイプの電気めっき装置
JP6398175B2 (ja) ２層フレキシブル配線板およびその製造方法
JP6403095B2 (ja) フレキシブル配線用基板およびフレキシブル配線板
JP6035678B2 (ja) フレキシブル配線板の製造方法ならびにフレキシブル配線板
JP5440386B2 (ja) 金属化樹脂フィルム基板の製造方法
JP5858286B2 (ja) 長尺導電性基板の電解めっき方法および銅張積層板の製造方法
JP5751530B2 (ja) 長尺導電性基板の電解めっき方法および銅張積層板の製造方法
JP6280947B2 (ja) 可撓性メタルクラッド積層体の製造
JP6667982B2 (ja) フレキシブル配線板
JP6201191B2 (ja) 銅張積層板の製造方法
JP5293664B2 (ja) 長尺導電性基板の電気めっき方法及びその装置、金属化ポリイミドフィルム及びその製造方法
JP5835670B2 (ja) プリント配線基板およびその製造方法
JP5754275B2 (ja) 金属化ポリイミドフィルム及びプリント配線基板
JP6405615B2 (ja) ２層フレキシブル配線用基板およびその製造方法
JP2015140447A (ja) フレキシブル配線板
JP2008075113A (ja) めっき装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170515

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170515

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180206

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180320

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180820

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180902

R150 Certificate of patent or registration of utility model

Ref document number: 6403095

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150