JP2016157752A5 - - Google Patents

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Publication number
JP2016157752A5
JP2016157752A5 JP2015033418A JP2015033418A JP2016157752A5 JP 2016157752 A5 JP2016157752 A5 JP 2016157752A5 JP 2015033418 A JP2015033418 A JP 2015033418A JP 2015033418 A JP2015033418 A JP 2015033418A JP 2016157752 A5 JP2016157752 A5 JP 2016157752A5
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JP
Japan
Prior art keywords
laminated film
flexible wiring
breaking stress
wiring board
mpa
Prior art date
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Application number
JP2015033418A
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English (en)
Japanese (ja)
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JP2016157752A (ja
JP6403095B2 (ja
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Priority to JP2015033418A priority Critical patent/JP6403095B2/ja
Priority claimed from JP2015033418A external-priority patent/JP6403095B2/ja
Publication of JP2016157752A publication Critical patent/JP2016157752A/ja
Publication of JP2016157752A5 publication Critical patent/JP2016157752A5/ja
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Publication of JP6403095B2 publication Critical patent/JP6403095B2/ja
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JP2015033418A 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板 Active JP6403095B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015033418A JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015033418A JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Publications (3)

Publication Number Publication Date
JP2016157752A JP2016157752A (ja) 2016-09-01
JP2016157752A5 true JP2016157752A5 (enExample) 2017-06-22
JP6403095B2 JP6403095B2 (ja) 2018-10-10

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ID=56826490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015033418A Active JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Country Status (1)

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JP (1) JP6403095B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6904194B2 (ja) * 2017-09-22 2021-07-14 住友金属鉱山株式会社 配線基板用積層体及びその製造方法
JP6904195B2 (ja) * 2017-09-22 2021-07-14 住友金属鉱山株式会社 フレキシブル配線基板及びその製造方法
JP7550599B2 (ja) * 2020-10-14 2024-09-13 日東電工株式会社 金属層、導電性フィルム、および、金属層の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008149772A1 (ja) * 2007-06-08 2008-12-11 Mitsui Mining & Smelting Co., Ltd. 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置
KR20150048905A (ko) * 2011-06-28 2015-05-07 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박을 사용한 배선판 및 플렉서블 배선판
CN104247576B (zh) * 2012-04-24 2017-05-31 住友金属矿山株式会社 2层挠性配线用基板及挠性配线板及其制造方法
JP5769030B2 (ja) * 2012-04-26 2015-08-26 住友金属鉱山株式会社 金属化樹脂フィルムおよびその製造方法

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