JP6401444B2 - パワーモジュールおよびその製造方法 - Google Patents

パワーモジュールおよびその製造方法 Download PDF

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Publication number
JP6401444B2
JP6401444B2 JP2013210220A JP2013210220A JP6401444B2 JP 6401444 B2 JP6401444 B2 JP 6401444B2 JP 2013210220 A JP2013210220 A JP 2013210220A JP 2013210220 A JP2013210220 A JP 2013210220A JP 6401444 B2 JP6401444 B2 JP 6401444B2
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JP
Japan
Prior art keywords
metal plate
power module
resin
plate
module according
Prior art date
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Expired - Fee Related
Application number
JP2013210220A
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English (en)
Japanese (ja)
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JP2015076441A5 (https=
JP2015076441A (ja
Inventor
吉原　克彦
克彦 吉原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2013210220A priority Critical patent/JP6401444B2/ja
Publication of JP2015076441A publication Critical patent/JP2015076441A/ja
Publication of JP2015076441A5 publication Critical patent/JP2015076441A5/ja
Application granted granted Critical
Publication of JP6401444B2 publication Critical patent/JP6401444B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013210220A 2013-10-07 2013-10-07 パワーモジュールおよびその製造方法 Expired - Fee Related JP6401444B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013210220A JP6401444B2 (ja) 2013-10-07 2013-10-07 パワーモジュールおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013210220A JP6401444B2 (ja) 2013-10-07 2013-10-07 パワーモジュールおよびその製造方法

Publications (3)

Publication Number Publication Date
JP2015076441A JP2015076441A (ja) 2015-04-20
JP2015076441A5 JP2015076441A5 (https=) 2016-10-20
JP6401444B2 true JP6401444B2 (ja) 2018-10-10

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Family Applications (1)

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JP2013210220A Expired - Fee Related JP6401444B2 (ja) 2013-10-07 2013-10-07 パワーモジュールおよびその製造方法

Country Status (1)

Country Link
JP (1) JP6401444B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107507808A (zh) * 2017-08-23 2017-12-22 南京晟芯半导体有限公司 一种新型igbt模块封装结构
JP7019746B2 (ja) * 2020-05-21 2022-02-15 三菱電機株式会社 電力用半導体モジュール
CN118872053A (zh) * 2022-03-11 2024-10-29 尼得科株式会社 半导体模块、电力转换装置以及半导体模块的制造方法
JP7704323B1 (ja) * 2024-11-18 2025-07-08 三菱電機株式会社 リードフレーム、半導体装置および半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031338A (ja) * 1998-07-13 2000-01-28 Hitachi Ltd 半導体装置及びその製法
JP2002076204A (ja) * 2000-09-04 2002-03-15 Nitto Shinko Kk 樹脂付金属板状体
JP2008078445A (ja) * 2006-09-22 2008-04-03 Yamaha Corp リードフレーム
JP2008244365A (ja) * 2007-03-29 2008-10-09 Toshiba Corp 熱接続構造、およびこれを備えた電子機器
JP5163069B2 (ja) * 2007-11-20 2013-03-13 株式会社デンソー 半導体装置
JPWO2009110376A1 (ja) * 2008-03-06 2011-07-14 三菱電機株式会社 リードフレーム基板、半導体モジュール、及びリードフレーム基板の製造方法
JP5099243B2 (ja) * 2010-04-14 2012-12-19 株式会社デンソー 半導体モジュール

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