JP6400919B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP6400919B2
JP6400919B2 JP2014028314A JP2014028314A JP6400919B2 JP 6400919 B2 JP6400919 B2 JP 6400919B2 JP 2014028314 A JP2014028314 A JP 2014028314A JP 2014028314 A JP2014028314 A JP 2014028314A JP 6400919 B2 JP6400919 B2 JP 6400919B2
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Prior art keywords
substrate
volatile solvent
unit
supply
liquid
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Active
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JP2014028314A
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English (en)
Japanese (ja)
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JP2015029041A5 (enExample
JP2015029041A (ja
Inventor
邦浩 宮崎
邦浩 宮崎
林　航之介
航之介 林
崇 大田垣
崇 大田垣
裕次 長嶋
裕次 長嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2014028314A priority Critical patent/JP6400919B2/ja
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to PCT/JP2014/055054 priority patent/WO2014136670A1/ja
Priority to KR1020157025984A priority patent/KR101759414B1/ko
Priority to US14/773,055 priority patent/US10281210B2/en
Priority to EP14760514.1A priority patent/EP2966673B1/en
Priority to CN201480010842.3A priority patent/CN105027268B/zh
Priority to TW103107697A priority patent/TWI590318B/zh
Publication of JP2015029041A publication Critical patent/JP2015029041A/ja
Publication of JP2015029041A5 publication Critical patent/JP2015029041A5/ja
Application granted granted Critical
Publication of JP6400919B2 publication Critical patent/JP6400919B2/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
    • F26B3/30—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
    • F26B11/18—Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B7/00—Drying solid materials or objects by processes using a combination of processes not covered by a single one of groups F26B3/00 and F26B5/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Microbiology (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Molecular Biology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
JP2014028314A 2013-03-07 2014-02-18 基板処理装置及び基板処理方法 Active JP6400919B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014028314A JP6400919B2 (ja) 2013-03-07 2014-02-18 基板処理装置及び基板処理方法
KR1020157025984A KR101759414B1 (ko) 2013-03-07 2014-02-28 기판 처리 장치 및 기판 처리 방법
US14/773,055 US10281210B2 (en) 2013-03-07 2014-02-28 Substrate processing apparatus and substrate processing method
EP14760514.1A EP2966673B1 (en) 2013-03-07 2014-02-28 Substrate processing device and substrate processing method
PCT/JP2014/055054 WO2014136670A1 (ja) 2013-03-07 2014-02-28 基板処理装置及び基板処理方法
CN201480010842.3A CN105027268B (zh) 2013-03-07 2014-02-28 基板处理装置以及基板处理方法
TW103107697A TWI590318B (zh) 2013-03-07 2014-03-06 基板處理裝置及基板處理方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013045532 2013-03-07
JP2013045532 2013-03-07
JP2013140416 2013-07-04
JP2013140416 2013-07-04
JP2014028314A JP6400919B2 (ja) 2013-03-07 2014-02-18 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2015029041A JP2015029041A (ja) 2015-02-12
JP2015029041A5 JP2015029041A5 (enExample) 2017-04-20
JP6400919B2 true JP6400919B2 (ja) 2018-10-03

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JP2014028314A Active JP6400919B2 (ja) 2013-03-07 2014-02-18 基板処理装置及び基板処理方法

Country Status (7)

Country Link
US (1) US10281210B2 (enExample)
EP (1) EP2966673B1 (enExample)
JP (1) JP6400919B2 (enExample)
KR (1) KR101759414B1 (enExample)
CN (1) CN105027268B (enExample)
TW (1) TWI590318B (enExample)
WO (1) WO2014136670A1 (enExample)

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JP6317837B2 (ja) * 2012-11-08 2018-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6131162B2 (ja) 2012-11-08 2017-05-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
WO2015133391A1 (ja) * 2014-03-07 2015-09-11 富士フイルム株式会社 トランジスタの製造方法
JP6304592B2 (ja) * 2014-03-25 2018-04-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI667686B (zh) * 2015-01-23 2019-08-01 日本思可林集團股份有限公司 基板處理方法及基板處理裝置暨流體噴嘴
KR101860631B1 (ko) 2015-04-30 2018-05-23 시바우라 메카트로닉스 가부시끼가이샤 기판 처리 장치 및 기판 처리 방법
JP6687436B2 (ja) * 2015-04-30 2020-04-22 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6418554B2 (ja) * 2015-06-10 2018-11-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6742708B2 (ja) * 2015-09-29 2020-08-19 芝浦メカトロニクス株式会社 基板処理方法
US10804121B2 (en) * 2016-02-25 2020-10-13 Shibaura Mechatronics Corporation Substrate treatment apparatus, substrate treatment method, and method for manufacturing substrate
JP6742124B2 (ja) 2016-03-30 2020-08-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6722551B2 (ja) 2016-08-31 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP6728009B2 (ja) * 2016-09-26 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102030068B1 (ko) * 2017-10-12 2019-10-08 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102249802B1 (ko) * 2018-07-13 2021-05-10 세메스 주식회사 기판 처리 장치
JP7175119B2 (ja) * 2018-07-25 2022-11-18 東京エレクトロン株式会社 基板処理装置、および基板処理方法
JP7077184B2 (ja) * 2018-08-30 2022-05-30 キオクシア株式会社 基板処理方法及び半導体装置の製造方法
JP7336306B2 (ja) * 2018-10-23 2023-08-31 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
CN109489363A (zh) * 2018-12-24 2019-03-19 国兴(东莞)新能源科技有限公司 一种软包电池除水装置
CN111380331A (zh) * 2018-12-29 2020-07-07 中国科学院微电子研究所 一种微波干燥装置
JP7194645B2 (ja) * 2019-05-31 2022-12-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN110631342A (zh) * 2019-10-15 2019-12-31 东海县牡丹手套有限公司 一种手套加工用手套存放设备
KR102391973B1 (ko) * 2019-10-21 2022-04-27 세메스 주식회사 기판 처리 장치
CN113053728B (zh) 2019-12-27 2024-08-27 株式会社斯库林集团 基板处理方法以及基板处理装置
JP7406404B2 (ja) * 2020-02-28 2023-12-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6886546B2 (ja) * 2020-05-12 2021-06-16 芝浦メカトロニクス株式会社 基板処理装置
TWI793744B (zh) * 2020-09-09 2023-02-21 日商國際電氣股份有限公司 基板處理裝置、半導體裝置之製造方法及程式
GB202015527D0 (en) * 2020-09-30 2020-11-11 Lam Res Ag Apparatus for processing wafer-shaped articles
CN112503894A (zh) * 2020-12-07 2021-03-16 安徽海洋药业有限公司 一种药瓶干燥机
CN114674120A (zh) * 2020-12-24 2022-06-28 中国科学院微电子研究所 半导体干燥装置及方法
CN112856981A (zh) * 2021-01-13 2021-05-28 东莞理工学院 一种用于mems器件圆片的自动干燥设备
CN112902616A (zh) * 2021-01-22 2021-06-04 徐州中辉光伏科技有限公司 一种高效率的太阳能光伏板组件加工用烘干装置
KR102596286B1 (ko) * 2021-03-15 2023-11-01 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP7726653B2 (ja) * 2021-03-31 2025-08-20 芝浦メカトロニクス株式会社 基板乾燥装置及び基板処理装置
CN112944856B (zh) * 2021-04-18 2022-08-16 黄韶平 试剂盒烘干装置
CN112944831A (zh) * 2021-04-23 2021-06-11 江西省优斯特能源有限公司 一种具有转动结构的电池加工用烘干设备
JP2024033671A (ja) * 2022-08-31 2024-03-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
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Also Published As

Publication number Publication date
KR20150120506A (ko) 2015-10-27
TW201508830A (zh) 2015-03-01
EP2966673A4 (en) 2016-11-09
WO2014136670A1 (ja) 2014-09-12
CN105027268A (zh) 2015-11-04
US10281210B2 (en) 2019-05-07
EP2966673B1 (en) 2020-10-14
TWI590318B (zh) 2017-07-01
CN105027268B (zh) 2017-07-11
EP2966673A1 (en) 2016-01-13
KR101759414B1 (ko) 2017-07-18
US20160025409A1 (en) 2016-01-28
JP2015029041A (ja) 2015-02-12

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