JP6400316B2 - 光学装置 - Google Patents

光学装置 Download PDF

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Publication number
JP6400316B2
JP6400316B2 JP2014065614A JP2014065614A JP6400316B2 JP 6400316 B2 JP6400316 B2 JP 6400316B2 JP 2014065614 A JP2014065614 A JP 2014065614A JP 2014065614 A JP2014065614 A JP 2014065614A JP 6400316 B2 JP6400316 B2 JP 6400316B2
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JP
Japan
Prior art keywords
package
protruding
housing
side wall
projecting
Prior art date
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Active
Application number
JP2014065614A
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English (en)
Japanese (ja)
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JP2015191896A5 (enExample
JP2015191896A (ja
Inventor
敬司 中澤
敬司 中澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Device Innovations Inc
Original Assignee
Sumitomo Electric Device Innovations Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Device Innovations Inc filed Critical Sumitomo Electric Device Innovations Inc
Priority to JP2014065614A priority Critical patent/JP6400316B2/ja
Priority to US14/669,895 priority patent/US9748731B2/en
Priority to CN201510142307.XA priority patent/CN104953464A/zh
Publication of JP2015191896A publication Critical patent/JP2015191896A/ja
Publication of JP2015191896A5 publication Critical patent/JP2015191896A5/ja
Application granted granted Critical
Publication of JP6400316B2 publication Critical patent/JP6400316B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/02365—Fixing laser chips on mounts by clamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
JP2014065614A 2014-03-27 2014-03-27 光学装置 Active JP6400316B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014065614A JP6400316B2 (ja) 2014-03-27 2014-03-27 光学装置
US14/669,895 US9748731B2 (en) 2014-03-27 2015-03-26 Optical apparatus
CN201510142307.XA CN104953464A (zh) 2014-03-27 2015-03-27 光学装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014065614A JP6400316B2 (ja) 2014-03-27 2014-03-27 光学装置

Publications (3)

Publication Number Publication Date
JP2015191896A JP2015191896A (ja) 2015-11-02
JP2015191896A5 JP2015191896A5 (enExample) 2017-04-27
JP6400316B2 true JP6400316B2 (ja) 2018-10-03

Family

ID=54167931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014065614A Active JP6400316B2 (ja) 2014-03-27 2014-03-27 光学装置

Country Status (3)

Country Link
US (1) US9748731B2 (enExample)
JP (1) JP6400316B2 (enExample)
CN (1) CN104953464A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170063464A1 (en) 2015-08-27 2017-03-02 Applied Optoelectronics, Inc. Multi-channel transmitter optical subassembly (tosa) with opposing placement of transistor outline (to) can laser packages
US20170063465A1 (en) * 2015-08-27 2017-03-02 Applied Optoelectronics, Inc. Techniques for reducing the footprint of a multi-channel transmitter optical subassembly (tosa) within an optical transceiver housing
JP7426843B2 (ja) * 2020-02-12 2024-02-02 古河電気工業株式会社 光学装置
WO2021024046A1 (ru) * 2020-04-16 2021-02-11 Владимир ВАХ Узел прибора терморегуляции полупроводникового лазера
US20230188241A1 (en) * 2021-12-15 2023-06-15 Applied Optoelectronics, Inc. Holder for mounting optical components and an optical subassembly implementing same
JP2023131872A (ja) * 2022-03-10 2023-09-22 株式会社東芝 半導体装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3525279A1 (de) * 1985-07-16 1987-01-29 Lautenschlaeger Kg Karl Moebelscharnier
JPH05327031A (ja) 1992-05-22 1993-12-10 Fujitsu Ltd 光半導体モジュール
JPH11142695A (ja) * 1997-11-14 1999-05-28 Fujitsu Ltd 光モジュールの取り付け具
JPH11330564A (ja) * 1998-05-19 1999-11-30 Fujitsu Quantum Devices Kk 光モジュール
WO2001043245A1 (en) * 1999-12-10 2001-06-14 Sumitomo Electric Industries, Ltd. Optical semiconductor module
JP2001284699A (ja) * 2000-01-25 2001-10-12 Furukawa Electric Co Ltd:The 光通信機器および光モジュールの固定方法
JP3433732B2 (ja) * 2000-11-22 2003-08-04 住友電気工業株式会社 光半導体気密封止容器及び光半導体モジュール並びに光ファイバー増幅器
JP2003258361A (ja) * 2002-03-06 2003-09-12 Mitsubishi Cable Ind Ltd 光学素子設置構造
JP2004247700A (ja) * 2002-05-14 2004-09-02 Sumitomo Electric Ind Ltd 光モジュール
US6917482B2 (en) * 2002-08-29 2005-07-12 The Furukawa Electric Co., Ltd. Optical module mounted body and securing method of optical module
JP4095874B2 (ja) * 2002-10-04 2008-06-04 株式会社日立製作所 半導体レーザモジュールおよび光伝送器
JP2004247543A (ja) * 2003-02-14 2004-09-02 Yamaha Corp 熱電装置用パッケージ
JP4615414B2 (ja) * 2005-09-30 2011-01-19 住友電工デバイス・イノベーション株式会社 光モジュール
US7365979B2 (en) * 2005-11-01 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating assembly with fan fastening device
US7865046B2 (en) * 2006-04-14 2011-01-04 Omron Corporation Optical transmission module, connecting part, and electronic device having optical transmission module
JP4740089B2 (ja) * 2006-10-27 2011-08-03 富士通株式会社 光モジュールおよびその製造方法並びに光ファイバの回転角調整方法
JP5121026B2 (ja) * 2009-02-17 2013-01-16 株式会社リコー 光走査装置及び画像形成装置
JP2012123979A (ja) * 2010-12-07 2012-06-28 Mitsubishi Electric Corp 照明器具
JP2012134349A (ja) * 2010-12-22 2012-07-12 Kyocera Corp 電子装置
CN102801043A (zh) * 2011-05-26 2012-11-28 鸿富锦精密工业（深圳）有限公司 插座连接器

Also Published As

Publication number Publication date
US20150280395A1 (en) 2015-10-01
CN104953464A (zh) 2015-09-30
JP2015191896A (ja) 2015-11-02
US9748731B2 (en) 2017-08-29

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