JP6396409B2 - Ｅｐｉプロセスのための均一性調整レンズを有するサセプタ支持シャフト - Google Patents

Ｅｐｉプロセスのための均一性調整レンズを有するサセプタ支持シャフト Download PDF

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JP6396409B2
JP6396409B2 JP2016500273A JP2016500273A JP6396409B2 JP 6396409 B2 JP6396409 B2 JP 6396409B2 JP 2016500273 A JP2016500273 A JP 2016500273A JP 2016500273 A JP2016500273 A JP 2016500273A JP 6396409 B2 JP6396409 B2 JP 6396409B2
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support shaft
susceptor
support
solid disk
substrate
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JP2016519208A5 (enExample
JP2016519208A (ja
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チョーポン ツォン，
チョーポン ツォン，
バラスブラマニアン ラマチャンドラン，
バラスブラマニアン ラマチャンドラン，
才人 石井
才人 石井
シュエピン リー，
シュエピン リー，
メフメト トゥールル サミール，
メフメト トゥールル サミール，
シュー−クワン ラウ，
シュー−クワン ラウ，
ポール ブリルハート，
ポール ブリルハート，
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/032—Heaters specially adapted for heating by radiation heating

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  • Engineering & Computer Science (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2016500273A 2013-03-15 2014-02-14 Ｅｐｉプロセスのための均一性調整レンズを有するサセプタ支持シャフト Active JP6396409B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361798503P 2013-03-15 2013-03-15
US61/798,503 2013-03-15
PCT/US2014/016608 WO2014143499A1 (en) 2013-03-15 2014-02-14 Susceptor support shaft with uniformity tuning lenses for epi process

Related Child Applications (1)

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JP2018159892A Division JP6577104B2 (ja) 2013-03-15 2018-08-29 Ｅｐｉプロセスのための均一性調整レンズを有するサセプタ支持シャフト

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JP2016519208A JP2016519208A (ja) 2016-06-30
JP2016519208A5 JP2016519208A5 (enExample) 2017-03-23
JP6396409B2 true JP6396409B2 (ja) 2018-09-26

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JP2018159892A Active JP6577104B2 (ja) 2013-03-15 2018-08-29 Ｅｐｉプロセスのための均一性調整レンズを有するサセプタ支持シャフト

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US (1) US9532401B2 (enExample)
JP (2) JP6396409B2 (enExample)
KR (1) KR101819095B1 (enExample)
CN (1) CN105027275B (enExample)
DE (1) DE112014001376T5 (enExample)
TW (1) TWI598936B (enExample)
WO (1) WO2014143499A1 (enExample)

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KR102263006B1 (ko) * 2019-07-18 2021-06-10 세메스 주식회사 기판 처리 장치
US12084770B2 (en) * 2020-08-18 2024-09-10 Globalwafers Co., Ltd. Window for chemical vapor deposition systems and related methods
CN112216636A (zh) * 2020-08-27 2021-01-12 西安奕斯伟硅片技术有限公司 一种晶圆外延反应设备
JP7698042B2 (ja) * 2020-10-13 2025-06-24 チュソン エンジニアリング カンパニー，リミテッド 基板処理装置｛ｓｕｂｓｔｒａｔｅ ｐｒｏｃｅｓｓｉｎｇ ａｐｐａｒａｔｕｓ｝
US20220210872A1 (en) * 2020-12-31 2022-06-30 Globalwafers Co., Ltd. System and methods for a radiant heat cap in a semiconductor wafer reactor
CN113604871B (zh) * 2021-08-10 2023-04-18 西安奕斯伟材料科技有限公司 一种用于硅片的外延生长的基座支撑架、装置及方法
US12134835B2 (en) * 2021-09-01 2024-11-05 Applied Materials, Inc. Quartz susceptor for accurate non-contact temperature measurement
KR20230122477A (ko) * 2022-02-14 2023-08-22 주성엔지니어링(주) 기판 처리 장치
EP4523250A1 (en) * 2022-05-12 2025-03-19 Watlow Electric Manufacturing Company Hybrid shaft assembly for thermal control in heated semiconductor pedestals
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CN117821947A (zh) * 2022-09-29 2024-04-05 中微半导体设备(上海)股份有限公司 一种石英部件及其制作方法以及基片处理设备
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Also Published As

Publication number Publication date
WO2014143499A1 (en) 2014-09-18
TWI598936B (zh) 2017-09-11
KR20150130479A (ko) 2015-11-23
DE112014001376T5 (de) 2015-11-26
JP2019016800A (ja) 2019-01-31
US20140263268A1 (en) 2014-09-18
US9532401B2 (en) 2016-12-27
KR101819095B1 (ko) 2018-01-16
CN105027275A (zh) 2015-11-04
JP2016519208A (ja) 2016-06-30
JP6577104B2 (ja) 2019-09-18
TW201435979A (zh) 2014-09-16
CN105027275B (zh) 2018-06-26

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