CN105027275B - 具有用于外延处理的均匀性调整透镜的基座支撑杆 - Google Patents

具有用于外延处理的均匀性调整透镜的基座支撑杆 Download PDF

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Publication number
CN105027275B
CN105027275B CN201480010968.0A CN201480010968A CN105027275B CN 105027275 B CN105027275 B CN 105027275B CN 201480010968 A CN201480010968 A CN 201480010968A CN 105027275 B CN105027275 B CN 105027275B
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support
support rod
substrate
arms
processing chamber
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CN105027275A (zh
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哲鹏·丛
巴拉苏布拉马尼恩·拉马钱德雷
石井雅人
李学斌
穆罕默德·图格鲁利·萨米尔
刘树坤
保罗·布里尔哈特
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/032—Heaters specially adapted for heating by radiation heating
CN201480010968.0A 2013-03-15 2014-02-14 具有用于外延处理的均匀性调整透镜的基座支撑杆 Active CN105027275B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361798503P 2013-03-15 2013-03-15
US61/798,503 2013-03-15
PCT/US2014/016608 WO2014143499A1 (en) 2013-03-15 2014-02-14 Susceptor support shaft with uniformity tuning lenses for epi process

Publications (2)

Publication Number Publication Date
CN105027275A CN105027275A (zh) 2015-11-04
CN105027275B true CN105027275B (zh) 2018-06-26

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US (1) US9532401B2 (enExample)
JP (2) JP6396409B2 (enExample)
KR (1) KR101819095B1 (enExample)
CN (1) CN105027275B (enExample)
DE (1) DE112014001376T5 (enExample)
TW (1) TWI598936B (enExample)
WO (1) WO2014143499A1 (enExample)

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US10658204B2 (en) 2017-08-08 2020-05-19 Lam Research Ag Spin chuck with concentrated center and radial heating
CN110373654B (zh) * 2018-04-13 2021-09-17 北京北方华创微电子装备有限公司 叉指结构、下电极装置和工艺腔室
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KR102848536B1 (ko) 2018-08-06 2025-08-21 어플라이드 머티어리얼스, 인코포레이티드 처리 챔버를 위한 라이너
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KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
KR102263006B1 (ko) * 2019-07-18 2021-06-10 세메스 주식회사 기판 처리 장치
US12084770B2 (en) * 2020-08-18 2024-09-10 Globalwafers Co., Ltd. Window for chemical vapor deposition systems and related methods
CN112216636A (zh) * 2020-08-27 2021-01-12 西安奕斯伟硅片技术有限公司 一种晶圆外延反应设备
JP7698042B2 (ja) * 2020-10-13 2025-06-24 チュソン エンジニアリング カンパニー，リミテッド 基板処理装置｛ｓｕｂｓｔｒａｔｅ ｐｒｏｃｅｓｓｉｎｇ ａｐｐａｒａｔｕｓ｝
US20220210872A1 (en) * 2020-12-31 2022-06-30 Globalwafers Co., Ltd. System and methods for a radiant heat cap in a semiconductor wafer reactor
CN113604871B (zh) * 2021-08-10 2023-04-18 西安奕斯伟材料科技有限公司 一种用于硅片的外延生长的基座支撑架、装置及方法
US12134835B2 (en) * 2021-09-01 2024-11-05 Applied Materials, Inc. Quartz susceptor for accurate non-contact temperature measurement
KR20230122477A (ko) * 2022-02-14 2023-08-22 주성엔지니어링(주) 기판 처리 장치
EP4523250A1 (en) * 2022-05-12 2025-03-19 Watlow Electric Manufacturing Company Hybrid shaft assembly for thermal control in heated semiconductor pedestals
US12308207B2 (en) * 2022-08-18 2025-05-20 Applied Materials Israel Ltd. Enhanced deposition rate by thermal isolation cover for GIS manipulator
CN117821947A (zh) * 2022-09-29 2024-04-05 中微半导体设备(上海)股份有限公司 一种石英部件及其制作方法以及基片处理设备
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Also Published As

Publication number Publication date
WO2014143499A1 (en) 2014-09-18
TWI598936B (zh) 2017-09-11
KR20150130479A (ko) 2015-11-23
JP6396409B2 (ja) 2018-09-26
DE112014001376T5 (de) 2015-11-26
JP2019016800A (ja) 2019-01-31
US20140263268A1 (en) 2014-09-18
US9532401B2 (en) 2016-12-27
KR101819095B1 (ko) 2018-01-16
CN105027275A (zh) 2015-11-04
JP2016519208A (ja) 2016-06-30
JP6577104B2 (ja) 2019-09-18
TW201435979A (zh) 2014-09-16

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