JP6393930B2 - 半導体センサー・デバイスおよびその製造方法 - Google Patents

半導体センサー・デバイスおよびその製造方法 Download PDF

Info

Publication number
JP6393930B2
JP6393930B2 JP2012016017A JP2012016017A JP6393930B2 JP 6393930 B2 JP6393930 B2 JP 6393930B2 JP 2012016017 A JP2012016017 A JP 2012016017A JP 2012016017 A JP2012016017 A JP 2012016017A JP 6393930 B2 JP6393930 B2 JP 6393930B2
Authority
JP
Japan
Prior art keywords
substrate
groove
side wall
hole
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012016017A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013156102A5 (enExample
JP2013156102A (ja
Inventor
俊 保坂
俊 保坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2012016017A priority Critical patent/JP6393930B2/ja
Priority to PCT/JP2013/052087 priority patent/WO2013115270A1/ja
Publication of JP2013156102A publication Critical patent/JP2013156102A/ja
Publication of JP2013156102A5 publication Critical patent/JP2013156102A5/ja
Application granted granted Critical
Publication of JP6393930B2 publication Critical patent/JP6393930B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0005—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using variations in capacitance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0002—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using variations in ohmic resistance
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2012016017A 2012-01-30 2012-01-30 半導体センサー・デバイスおよびその製造方法 Expired - Fee Related JP6393930B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012016017A JP6393930B2 (ja) 2012-01-30 2012-01-30 半導体センサー・デバイスおよびその製造方法
PCT/JP2013/052087 WO2013115270A1 (ja) 2012-01-30 2013-01-30 半導体センサー・デバイスおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012016017A JP6393930B2 (ja) 2012-01-30 2012-01-30 半導体センサー・デバイスおよびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018007756A Division JP2018124275A (ja) 2018-01-21 2018-01-21 半導体センサー・デバイスおよびその製造方法

Publications (3)

Publication Number Publication Date
JP2013156102A JP2013156102A (ja) 2013-08-15
JP2013156102A5 JP2013156102A5 (enExample) 2015-03-19
JP6393930B2 true JP6393930B2 (ja) 2018-09-26

Family

ID=48905302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012016017A Expired - Fee Related JP6393930B2 (ja) 2012-01-30 2012-01-30 半導体センサー・デバイスおよびその製造方法

Country Status (2)

Country Link
JP (1) JP6393930B2 (enExample)
WO (1) WO2013115270A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180356255A1 (en) * 2015-12-04 2018-12-13 Goertek Inc. Environmental sensor and manufacturing method thereof

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101467934B1 (ko) 2013-12-02 2014-12-02 한국세라믹기술원 피에조 파이버 컴포지트 구조체 및 이를 이용한 소자
KR101467933B1 (ko) 2013-12-02 2014-12-02 한국세라믹기술원 피에조 파이버 컴포지트 구조체 및 이를 이용한 소자
CN106104831B (zh) 2014-03-14 2019-04-05 国立研究开发法人科学技术振兴机构 对于沟道采用了压电电阻体的晶体管以及电子电路
KR101971874B1 (ko) * 2015-02-04 2019-04-25 (주)엘지하우시스 광투과율 가변 필름, 이를 포함한 표시 장치 및 광투과율 가변 필름의 제조 방법
DE102015210919A1 (de) * 2015-06-15 2016-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben
DE102017206766A1 (de) 2017-04-21 2018-10-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mems-wandler zum interagieren mit einem volumenstrom eines fluids und verfahren zum herstellen desselben
JP6932536B2 (ja) * 2017-04-21 2021-09-08 株式会社バルカー 圧電積層体の製造方法および圧電積層体
CN107529121A (zh) * 2017-09-28 2017-12-29 歌尔股份有限公司 电容式麦克风及电子装置
CN107994006A (zh) * 2017-12-30 2018-05-04 颀中科技（苏州）有限公司 倒装芯片组件、倒装芯片封装结构及封装方法
CN112335179A (zh) * 2018-07-30 2021-02-05 京瓷株式会社 复合基板
US11779232B2 (en) 2019-04-30 2023-10-10 Korea Advanced Institute Of Science And Technology Flexible pressure sensor using multi-material 3D-printed microchannel mold and method for manufacturing the same
CN110545505A (zh) * 2019-08-19 2019-12-06 歌尔股份有限公司 一种用于发声装置的导电膜以及发声装置
CN114729909A (zh) * 2019-11-14 2022-07-08 Nok株式会社 细胞外电位测定装置
JP7543641B2 (ja) * 2019-11-20 2024-09-03 株式会社デンソー 素子形成ウェハおよびその製造方法、チップの製造方法
CN112781757B (zh) * 2020-12-26 2023-10-31 重庆华知光环保科技有限责任公司 一种基于石墨烯的柔性电容式压力传感器及其制备方法
JP7566979B2 (ja) * 2022-07-21 2024-10-15 キヤノン株式会社 ダイシング方法および記録素子製造方法
WO2024018769A1 (ja) * 2022-07-21 2024-01-25 キヤノン株式会社 ダイシング方法および記録素子製造方法
CN119905413B (zh) * 2025-01-21 2025-10-31 复旦大学 混合键合结构及键合方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0746068B2 (ja) * 1987-01-16 1995-05-17 日産自動車株式会社 圧力センサ
JPS6413158U (enExample) * 1987-07-10 1989-01-24
JPH11220137A (ja) * 1998-02-02 1999-08-10 Denso Corp 半導体圧力センサ及びその製造方法
JP5206726B2 (ja) * 2010-04-12 2013-06-12 株式会社デンソー 力学量検出装置およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180356255A1 (en) * 2015-12-04 2018-12-13 Goertek Inc. Environmental sensor and manufacturing method thereof
US10760929B2 (en) * 2015-12-04 2020-09-01 Weifang Goertek Microelectronics Co., Ltd. Environmental sensor and manufacturing method thereof

Also Published As

Publication number Publication date
WO2013115270A1 (ja) 2013-08-08
JP2013156102A (ja) 2013-08-15

Similar Documents

Publication Publication Date Title
JP6393930B2 (ja) 半導体センサー・デバイスおよびその製造方法
JP6432722B2 (ja) 半導体センサー・デバイスおよびその製造方法
JP2018124275A (ja) 半導体センサー・デバイスおよびその製造方法
US10107830B2 (en) Method of forming capacitive MEMS sensor devices
TWI664755B (zh) 使用熔合結合工序在ｃｍｏｓ基板上整合ａｉｎ超音波傳感器
US9567207B2 (en) Recess with tapered sidewalls for hermetic seal in MEMS devices
US7898081B2 (en) MEMS device and method of making the same
US20140264651A1 (en) Semiconductor Devices and Methods of Forming Thereof
US9975757B2 (en) Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices
US20100162823A1 (en) Mems sensor and mems sensor manufacture method
CN110798788B (zh) 一种mems结构及其形成方法
US20080137886A1 (en) Microphone arrangement and method for production thereof
TW202015033A (zh) 麥克風及其製造方法
CN103917304A (zh) 具有应力层的预塌陷电容式微加工换能器单元
CN100530735C (zh) 压电元件的制造方法
KR20050084104A (ko) 디스플레이 및 그 제조 방법
US20230061430A1 (en) Method for manufacturing an integrated system including a capacitive pressure sensor and an inertial sensor, and integrated system
US8129805B2 (en) Microelectromechanical system (MEMS) device and methods for fabricating the same
JP2012026956A (ja) 圧力センサの製造方法及び圧力センサ
CN113226978B (zh) 制造包括悬在腔之上的膜的器件的方法
US7943410B2 (en) Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming
US9434607B2 (en) MEMS device
JP2011038780A (ja) 半導体装置及び半導体装置の製造方法
US9917243B2 (en) Method of fabricating piezoelectric MEMS devices
US11818957B2 (en) Piezoelectrically actuated MEMS optical device having a protected chamber and manufacturing process thereof

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150129

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150129

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150424

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160329

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20160526

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160727

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160805

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161121

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170523

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20170721

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170920

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20171121

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20171220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180121

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180115

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180219

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180807

R150 Certificate of patent or registration of utility model

Ref document number: 6393930

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees