JP6391885B1 - 回路基板 - Google Patents

回路基板 Download PDF

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Publication number
JP6391885B1
JP6391885B1 JP2018508254A JP2018508254A JP6391885B1 JP 6391885 B1 JP6391885 B1 JP 6391885B1 JP 2018508254 A JP2018508254 A JP 2018508254A JP 2018508254 A JP2018508254 A JP 2018508254A JP 6391885 B1 JP6391885 B1 JP 6391885B1
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JP
Japan
Prior art keywords
circuit board
ground
frame ground
signal
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018508254A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2018173263A1 (ja
Inventor
義章 入船
義章 入船
雄大 米岡
雄大 米岡
祐司 浅野
祐司 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of JP6391885B1 publication Critical patent/JP6391885B1/ja
Publication of JPWO2018173263A1 publication Critical patent/JPWO2018173263A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
JP2018508254A 2017-03-24 2017-03-24 回路基板 Active JP6391885B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/012056 WO2018173263A1 (fr) 2017-03-24 2017-03-24 Carte de circuit imprimé

Publications (2)

Publication Number Publication Date
JP6391885B1 true JP6391885B1 (ja) 2018-09-19
JPWO2018173263A1 JPWO2018173263A1 (ja) 2019-03-28

Family

ID=63579890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018508254A Active JP6391885B1 (ja) 2017-03-24 2017-03-24 回路基板

Country Status (4)

Country Link
JP (1) JP6391885B1 (fr)
KR (1) KR101999509B1 (fr)
CN (1) CN109565927A (fr)
WO (1) WO2018173263A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200114709A (ko) * 2019-03-29 2020-10-07 엘지전자 주식회사 기판 구조체 및 그 제어 방법
JP7268544B2 (ja) * 2019-08-30 2023-05-08 富士通株式会社 電気チップ及び光モジュール
EP4084597A4 (fr) * 2019-12-27 2023-12-27 Hitachi Astemo, Ltd. Dispositif de commande électronique
WO2021187241A1 (fr) * 2020-03-19 2021-09-23 株式会社ソニー・インタラクティブエンタテインメント Dispositif de communication
CN115299184B (zh) * 2020-03-25 2023-07-14 三菱电机株式会社 电路基板及电子设备
WO2022215176A1 (fr) * 2021-04-06 2022-10-13 三菱電機株式会社 Carte de circuit imprimé
CN115580983B (zh) * 2022-09-30 2023-08-29 荣耀终端有限公司 电路板组件和电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174427A (ja) * 1997-09-01 1999-03-16 Sharp Corp 回路素子の放熱構造
JP2003283072A (ja) * 2002-03-20 2003-10-03 Canon Inc プリント配線板ユニット
JP2008130584A (ja) * 2006-11-16 2008-06-05 Mitsubishi Electric Corp プリント基板の電磁ノイズ対策構造
JP2014197646A (ja) * 2013-03-29 2014-10-16 本田技研工業株式会社 雑音耐性の高い制御装置
JP2016219553A (ja) * 2015-05-18 2016-12-22 三菱電機株式会社 回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6230255B1 (en) 1990-07-06 2001-05-08 Advanced Micro Devices, Inc. Communications processor for voice band telecommunications
JP2010267728A (ja) * 2009-05-13 2010-11-25 Renesas Electronics Corp 半導体パッケージ、リードフレーム、及び半導体パッケージの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174427A (ja) * 1997-09-01 1999-03-16 Sharp Corp 回路素子の放熱構造
JP2003283072A (ja) * 2002-03-20 2003-10-03 Canon Inc プリント配線板ユニット
JP2008130584A (ja) * 2006-11-16 2008-06-05 Mitsubishi Electric Corp プリント基板の電磁ノイズ対策構造
JP2014197646A (ja) * 2013-03-29 2014-10-16 本田技研工業株式会社 雑音耐性の高い制御装置
JP2016219553A (ja) * 2015-05-18 2016-12-22 三菱電機株式会社 回路基板

Also Published As

Publication number Publication date
KR20190018535A (ko) 2019-02-22
KR101999509B1 (ko) 2019-07-11
JPWO2018173263A1 (ja) 2019-03-28
WO2018173263A1 (fr) 2018-09-27
CN109565927A (zh) 2019-04-02

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