JP6389988B2 - 異物除去装置 - Google Patents

異物除去装置 Download PDF

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Publication number
JP6389988B2
JP6389988B2 JP2016117573A JP2016117573A JP6389988B2 JP 6389988 B2 JP6389988 B2 JP 6389988B2 JP 2016117573 A JP2016117573 A JP 2016117573A JP 2016117573 A JP2016117573 A JP 2016117573A JP 6389988 B2 JP6389988 B2 JP 6389988B2
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JP
Japan
Prior art keywords
foreign matter
carbon dioxide
chamber
matter removing
removing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016117573A
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English (en)
Japanese (ja)
Other versions
JP2017224664A (ja
Inventor
智宣 中村
智宣 中村
洋 尾又
洋 尾又
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2016117573A priority Critical patent/JP6389988B2/ja
Priority to CN201780049515.2A priority patent/CN109564865B/zh
Priority to KR1020197001065A priority patent/KR102133214B1/ko
Priority to PCT/JP2017/020553 priority patent/WO2017217252A1/ja
Priority to TW106119735A priority patent/TWI675423B/zh
Publication of JP2017224664A publication Critical patent/JP2017224664A/ja
Application granted granted Critical
Publication of JP6389988B2 publication Critical patent/JP6389988B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2016117573A 2016-06-14 2016-06-14 異物除去装置 Active JP6389988B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016117573A JP6389988B2 (ja) 2016-06-14 2016-06-14 異物除去装置
CN201780049515.2A CN109564865B (zh) 2016-06-14 2017-06-02 异物去除装置
KR1020197001065A KR102133214B1 (ko) 2016-06-14 2017-06-02 이물 제거 장치
PCT/JP2017/020553 WO2017217252A1 (ja) 2016-06-14 2017-06-02 異物除去装置
TW106119735A TWI675423B (zh) 2016-06-14 2017-06-14 異物除去裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016117573A JP6389988B2 (ja) 2016-06-14 2016-06-14 異物除去装置

Publications (2)

Publication Number Publication Date
JP2017224664A JP2017224664A (ja) 2017-12-21
JP6389988B2 true JP6389988B2 (ja) 2018-09-19

Family

ID=60664074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016117573A Active JP6389988B2 (ja) 2016-06-14 2016-06-14 異物除去装置

Country Status (5)

Country Link
JP (1) JP6389988B2 (zh)
KR (1) KR102133214B1 (zh)
CN (1) CN109564865B (zh)
TW (1) TWI675423B (zh)
WO (1) WO2017217252A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7129793B2 (ja) * 2018-03-06 2022-09-02 シャープ株式会社 接合装置
CN110091256A (zh) * 2019-06-12 2019-08-06 上海悦威电子设备有限公司 一种液态二氧化碳清洗设备
KR102232036B1 (ko) * 2019-08-27 2021-03-25 세메스 주식회사 약액 토출 장치
DE102019129446A1 (de) * 2019-10-31 2021-05-06 Krones Ag Vorrichtung und Verfahren zur Kopfrauminertisierung und Produktrestentfernung bei Flaschen
CN110700163A (zh) * 2019-11-13 2020-01-17 华南理工大学广州学院 一种基于干冰微爆炸的隧道清洗机的喷头装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000117201A (ja) * 1998-10-12 2000-04-25 Sony Corp 洗浄装置及び洗浄方法
JP4802002B2 (ja) * 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 基板の洗浄処理装置及び洗浄処理方法
JP5198826B2 (ja) * 2007-10-17 2013-05-15 岩谷産業株式会社 洗浄装置
JP2009226290A (ja) * 2008-03-21 2009-10-08 Gurintekku Sanyo:Kk 洗浄装置
JP2011167822A (ja) * 2010-02-22 2011-09-01 Cool Technos:Kk ドライアイススノー洗浄装置用噴射ノズル
JP5889537B2 (ja) * 2011-03-23 2016-03-22 ファスフォードテクノロジ株式会社 ダイボンダ
JP5540032B2 (ja) * 2012-03-05 2014-07-02 富士フイルム株式会社 ラビリンスシール、洗浄装置、洗浄方法、及び溶液製膜方法
US20150224627A1 (en) * 2012-11-15 2015-08-13 Mitsubishi Heavy Industries, Ltd. Adhered substances removing device, and vapor deposition system and removal method using such adhered substances removing device
KR101731236B1 (ko) * 2015-06-22 2017-05-02 주식회사 케이씨텍 기판 처리 장치

Also Published As

Publication number Publication date
JP2017224664A (ja) 2017-12-21
CN109564865B (zh) 2023-07-04
TWI675423B (zh) 2019-10-21
CN109564865A (zh) 2019-04-02
WO2017217252A1 (ja) 2017-12-21
KR20190019140A (ko) 2019-02-26
TW201810448A (zh) 2018-03-16
KR102133214B1 (ko) 2020-07-13

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