JP6382832B2 - 電子音響変換器 - Google Patents

電子音響変換器 Download PDF

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Publication number
JP6382832B2
JP6382832B2 JP2015545704A JP2015545704A JP6382832B2 JP 6382832 B2 JP6382832 B2 JP 6382832B2 JP 2015545704 A JP2015545704 A JP 2015545704A JP 2015545704 A JP2015545704 A JP 2015545704A JP 6382832 B2 JP6382832 B2 JP 6382832B2
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JP
Japan
Prior art keywords
piezoelectric layer
electroacoustic transducer
electric field
electrode
alternating electric
Prior art date
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Active
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JP2015545704A
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English (en)
Japanese (ja)
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JP2016506130A (ja
JP2016506130A5 (enExample
Inventor
ヴェルナー ルイール，
ヴェルナー ルイール，
フィリップ ミヒャエル イェーガー，
フィリップ ミヒャエル イェーガー，
Original Assignee
スナップトラック・インコーポレーテッド
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Publication of JP2016506130A5 publication Critical patent/JP2016506130A5/ja
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/202—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/208—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using shear or torsion displacement, e.g. d15 type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H2009/241—Bulk-mode MEMS resonators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Transducers For Ultrasonic Waves (AREA)
JP2015545704A 2012-12-06 2013-10-14 電子音響変換器 Active JP6382832B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012111889.2A DE102012111889B9 (de) 2012-12-06 2012-12-06 Elektroakustischer Wandler
DE102012111889.2 2012-12-06
PCT/EP2013/071425 WO2014086524A2 (de) 2012-12-06 2013-10-14 Elektroakustischer wandler

Publications (3)

Publication Number Publication Date
JP2016506130A JP2016506130A (ja) 2016-02-25
JP2016506130A5 JP2016506130A5 (enExample) 2018-07-26
JP6382832B2 true JP6382832B2 (ja) 2018-08-29

Family

ID=49378278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015545704A Active JP6382832B2 (ja) 2012-12-06 2013-10-14 電子音響変換器

Country Status (5)

Country Link
US (1) US9497551B2 (enExample)
JP (1) JP6382832B2 (enExample)
CN (1) CN104838588B (enExample)
DE (1) DE102012111889B9 (enExample)
WO (1) WO2014086524A2 (enExample)

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DE102014111993B4 (de) * 2014-08-21 2017-12-21 Snaptrack, Inc. Mikroakustische Bauelement mit verbesserter Temperaturkompensation
DE102014112372B3 (de) * 2014-08-28 2016-02-25 Epcos Ag Filterchip und Verfahren zur Herstellung eines Filterchips
JP6233527B2 (ja) * 2014-10-06 2017-11-22 株式会社村田製作所 ラダー型フィルタ及びデュプレクサ
DE102016100925B4 (de) * 2016-01-20 2018-05-30 Snaptrack, Inc. Filterschaltung
JP6265578B1 (ja) * 2016-09-07 2018-01-24 株式会社アルバック デバイス及びデバイスの製造方法並びにアレイ型の超音波プローブの製造方法
WO2018056908A1 (en) * 2016-09-26 2018-03-29 Agency For Science, Technology And Research Piezoelectric resonator and method of forming the same
CN107026627A (zh) * 2016-12-12 2017-08-08 佛山市艾佛光通科技有限公司 垂直阵列纳米柱薄膜体声波谐振器及其制备方法和滤波器
JP2019165307A (ja) * 2018-03-19 2019-09-26 京セラ株式会社 超音波センサ
WO2020029153A1 (zh) * 2018-08-09 2020-02-13 天津大学 基于兰姆波谐振器的粒子聚集器及其操作方法
CN110113026B (zh) * 2019-05-22 2021-04-02 武汉敏声新技术有限公司 一种二维兰姆波谐振器
US12426506B2 (en) 2019-07-19 2025-09-23 Evatec Ag Piezoelectric coating and deposition process
CN110995194B (zh) * 2019-12-30 2021-12-17 武汉敏声新技术有限公司 一种二维高性能谐振器
KR102763470B1 (ko) * 2019-12-16 2025-02-05 엘지디스플레이 주식회사 표시장치
CN112995863A (zh) * 2021-03-15 2021-06-18 东莞市瑞勤电子有限公司 平面弯曲发声型扬声器、mems微扬声器和制作方法
US20230099440A1 (en) * 2021-09-28 2023-03-30 Skyworks Global Pte. Ltd. Piezoelectric mems device with thermal compensation from different material properties
CN114301412B (zh) * 2021-12-29 2024-04-30 苏州达波新材科技有限公司 具有改良衬底结构的兰姆波声波器件及其制作方法

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US2405472A (en) * 1934-06-12 1946-08-06 Gen Radio Co Diaphragm
US3423543A (en) * 1965-06-24 1969-01-21 Harry W Kompanek Loudspeaker with piezoelectric wafer driving elements
US4843275A (en) * 1988-01-19 1989-06-27 Pennwalt Corporation Air buoyant piezoelectric polymeric film microphone
JP3288815B2 (ja) 1993-06-30 2002-06-04 株式会社東芝 ２次元アレイ超音波プローブ
US5684884A (en) 1994-05-31 1997-11-04 Hitachi Metals, Ltd. Piezoelectric loudspeaker and a method for manufacturing the same
JPH07327297A (ja) * 1994-05-31 1995-12-12 Hitachi Metals Ltd 圧電スピーカ
JP3428803B2 (ja) * 1996-03-06 2003-07-22 松下電器産業株式会社 加速度センサ及びその製造方法
US5684883A (en) 1996-11-26 1997-11-04 E Lead Electronic Co., Ltd. Device for receiving earphone/microphone wire of holdfree hand set
JP2004088056A (ja) 2002-07-02 2004-03-18 Sumitomo Electric Ind Ltd 圧電振動子とその実装方法、実装デバイス、それを用いた超音波プローブ、およびそれを用いた３次元超音波診断装置
US7109642B2 (en) * 2003-11-29 2006-09-19 Walter Guy Scott Composite piezoelectric apparatus and method
JP2007181087A (ja) 2005-12-28 2007-07-12 Toshiba Corp 薄膜圧電共振器およびフィルタ回路
US8206305B2 (en) * 2006-11-28 2012-06-26 Siemens Medical Solutions Usa, Inc. Multi-twisted acoustic array for medical ultrasound
DE102008062605B4 (de) 2008-12-17 2018-10-18 Snaptrack, Inc. Bauelement, welches mit akustischen Wellen arbeitet, und Verfahren zu dessen Herstellung
EP2239845A1 (en) 2009-04-09 2010-10-13 Nxp B.V. MEMS resonator
JP2011018959A (ja) * 2009-07-07 2011-01-27 Murata Mfg Co Ltd 圧電振動子
WO2011016994A1 (en) * 2009-07-27 2011-02-10 Cts Corporation Encapsulated ceramic element and method of making the same
FI123640B (fi) 2010-04-23 2013-08-30 Teknologian Tutkimuskeskus Vtt Laajakaistainen akustisesti kytketty ohutkalvo-BAW-suodin
FI20106063A7 (fi) * 2010-10-14 2012-06-08 Valtion Teknillinen Tutkimuskeskus Akustisesti kytketty laajakaistainen ohutkalvo-BAW-suodatin
SG190064A1 (en) * 2010-11-08 2013-06-28 Agency Science Tech & Res A piezoelectric resonator
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KR101893236B1 (ko) 2011-04-01 2018-08-29 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법과 휴대 전화기

Also Published As

Publication number Publication date
WO2014086524A3 (de) 2014-10-23
DE102012111889B9 (de) 2014-09-04
CN104838588A (zh) 2015-08-12
DE102012111889B3 (de) 2014-06-05
JP2016506130A (ja) 2016-02-25
US20150312681A1 (en) 2015-10-29
WO2014086524A2 (de) 2014-06-12
CN104838588B (zh) 2017-11-17
US9497551B2 (en) 2016-11-15

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