CN104838588B - 电声转换器 - Google Patents

电声转换器 Download PDF

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Publication number
CN104838588B
CN104838588B CN201380064071.1A CN201380064071A CN104838588B CN 104838588 B CN104838588 B CN 104838588B CN 201380064071 A CN201380064071 A CN 201380064071A CN 104838588 B CN104838588 B CN 104838588B
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CN
China
Prior art keywords
piezoelectric layer
electrode
electroacoustic transducer
layer
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380064071.1A
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English (en)
Chinese (zh)
Other versions
CN104838588A (zh
Inventor
W.吕勒
P.M.耶格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SnapTrack Inc
Original Assignee
Epcos AG
SnapTrack Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG, SnapTrack Inc filed Critical Epcos AG
Publication of CN104838588A publication Critical patent/CN104838588A/zh
Application granted granted Critical
Publication of CN104838588B publication Critical patent/CN104838588B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/202—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/208—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using shear or torsion displacement, e.g. d15 type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H2009/241—Bulk-mode MEMS resonators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
CN201380064071.1A 2012-12-06 2013-10-14 电声转换器 Active CN104838588B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012111889.2 2012-12-06
DE102012111889.2A DE102012111889B9 (de) 2012-12-06 2012-12-06 Elektroakustischer Wandler
PCT/EP2013/071425 WO2014086524A2 (de) 2012-12-06 2013-10-14 Elektroakustischer wandler

Publications (2)

Publication Number Publication Date
CN104838588A CN104838588A (zh) 2015-08-12
CN104838588B true CN104838588B (zh) 2017-11-17

Family

ID=49378278

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380064071.1A Active CN104838588B (zh) 2012-12-06 2013-10-14 电声转换器

Country Status (5)

Country Link
US (1) US9497551B2 (enExample)
JP (1) JP6382832B2 (enExample)
CN (1) CN104838588B (enExample)
DE (1) DE102012111889B9 (enExample)
WO (1) WO2014086524A2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014111993B4 (de) * 2014-08-21 2017-12-21 Snaptrack, Inc. Mikroakustische Bauelement mit verbesserter Temperaturkompensation
DE102014112372B3 (de) 2014-08-28 2016-02-25 Epcos Ag Filterchip und Verfahren zur Herstellung eines Filterchips
JP6233527B2 (ja) * 2014-10-06 2017-11-22 株式会社村田製作所 ラダー型フィルタ及びデュプレクサ
DE102016100925B4 (de) * 2016-01-20 2018-05-30 Snaptrack, Inc. Filterschaltung
JP6265578B1 (ja) * 2016-09-07 2018-01-24 株式会社アルバック デバイス及びデバイスの製造方法並びにアレイ型の超音波プローブの製造方法
WO2018056908A1 (en) * 2016-09-26 2018-03-29 Agency For Science, Technology And Research Piezoelectric resonator and method of forming the same
CN107026627A (zh) * 2016-12-12 2017-08-08 佛山市艾佛光通科技有限公司 垂直阵列纳米柱薄膜体声波谐振器及其制备方法和滤波器
JP2019165307A (ja) * 2018-03-19 2019-09-26 京セラ株式会社 超音波センサ
WO2020029153A1 (zh) * 2018-08-09 2020-02-13 天津大学 基于兰姆波谐振器的粒子聚集器及其操作方法
CN110113026B (zh) * 2019-05-22 2021-04-02 武汉敏声新技术有限公司 一种二维兰姆波谐振器
US12426506B2 (en) 2019-07-19 2025-09-23 Evatec Ag Piezoelectric coating and deposition process
CN110995194B (zh) * 2019-12-30 2021-12-17 武汉敏声新技术有限公司 一种二维高性能谐振器
KR102763470B1 (ko) 2019-12-16 2025-02-05 엘지디스플레이 주식회사 표시장치
CN112995863A (zh) * 2021-03-15 2021-06-18 东莞市瑞勤电子有限公司 平面弯曲发声型扬声器、mems微扬声器和制作方法
US20230099440A1 (en) * 2021-09-28 2023-03-30 Skyworks Global Pte. Ltd. Piezoelectric mems device with thermal compensation from different material properties
CN114301412B (zh) * 2021-12-29 2024-04-30 苏州达波新材科技有限公司 具有改良衬底结构的兰姆波声波器件及其制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5684884A (en) * 1994-05-31 1997-11-04 Hitachi Metals, Ltd. Piezoelectric loudspeaker and a method for manufacturing the same
US20070252485A1 (en) * 2005-12-28 2007-11-01 Takashi Kawakubo Thin-film piezoelectric resonator and filter circuit
US20090010459A1 (en) * 2006-11-28 2009-01-08 Garbini Lex J Multi-twisted acoustic array for medical ultrasound
US20120007475A1 (en) * 2008-12-17 2012-01-12 Epcos Ag Construction element that operates with acoustic waves, and method for the manufacture thereof
WO2012064283A1 (en) * 2010-11-08 2012-05-18 Agency For Science, Technology And Research Cross-reference to related application

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US2405472A (en) * 1934-06-12 1946-08-06 Gen Radio Co Diaphragm
US3423543A (en) * 1965-06-24 1969-01-21 Harry W Kompanek Loudspeaker with piezoelectric wafer driving elements
US4843275A (en) * 1988-01-19 1989-06-27 Pennwalt Corporation Air buoyant piezoelectric polymeric film microphone
JP3288815B2 (ja) 1993-06-30 2002-06-04 株式会社東芝 ２次元アレイ超音波プローブ
JPH07327297A (ja) * 1994-05-31 1995-12-12 Hitachi Metals Ltd 圧電スピーカ
JP3428803B2 (ja) 1996-03-06 2003-07-22 松下電器産業株式会社 加速度センサ及びその製造方法
US5684883A (en) 1996-11-26 1997-11-04 E Lead Electronic Co., Ltd. Device for receiving earphone/microphone wire of holdfree hand set
JP2004088056A (ja) 2002-07-02 2004-03-18 Sumitomo Electric Ind Ltd 圧電振動子とその実装方法、実装デバイス、それを用いた超音波プローブ、およびそれを用いた３次元超音波診断装置
US7109642B2 (en) * 2003-11-29 2006-09-19 Walter Guy Scott Composite piezoelectric apparatus and method
EP2239845A1 (en) 2009-04-09 2010-10-13 Nxp B.V. MEMS resonator
JP2011018959A (ja) 2009-07-07 2011-01-27 Murata Mfg Co Ltd 圧電振動子
US8399059B2 (en) 2009-07-27 2013-03-19 Cts Corporation Encapsulated ceramic element and method of making the same
FI123640B (fi) 2010-04-23 2013-08-30 Teknologian Tutkimuskeskus Vtt Laajakaistainen akustisesti kytketty ohutkalvo-BAW-suodin
FI20106063L (fi) * 2010-10-14 2012-06-08 Valtion Teknillinen Akustisesti kytketty laajakaistainen ohutkalvo-BAW-suodatin
FR2971652A1 (fr) 2011-02-11 2012-08-17 Commissariat Energie Atomique Dispositif acoustique comprenant une structure de cristal phononique a inclusions de type conique et procede de realisation dudit dispositif
JP5735099B2 (ja) 2011-04-01 2015-06-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法ならびに携帯電話機

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5684884A (en) * 1994-05-31 1997-11-04 Hitachi Metals, Ltd. Piezoelectric loudspeaker and a method for manufacturing the same
US20070252485A1 (en) * 2005-12-28 2007-11-01 Takashi Kawakubo Thin-film piezoelectric resonator and filter circuit
US20090010459A1 (en) * 2006-11-28 2009-01-08 Garbini Lex J Multi-twisted acoustic array for medical ultrasound
US20120007475A1 (en) * 2008-12-17 2012-01-12 Epcos Ag Construction element that operates with acoustic waves, and method for the manufacture thereof
WO2012064283A1 (en) * 2010-11-08 2012-05-18 Agency For Science, Technology And Research Cross-reference to related application

Also Published As

Publication number Publication date
JP6382832B2 (ja) 2018-08-29
US20150312681A1 (en) 2015-10-29
CN104838588A (zh) 2015-08-12
JP2016506130A (ja) 2016-02-25
DE102012111889B3 (de) 2014-06-05
US9497551B2 (en) 2016-11-15
WO2014086524A2 (de) 2014-06-12
WO2014086524A3 (de) 2014-10-23
DE102012111889B9 (de) 2014-09-04

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SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20170911

Address after: American California

Applicant after: Snaptrack, Inc.

Address before: Munich, Germany

Applicant before: Epcos Co., Ltd.

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