JP6378985B2 - 有機エレクトロルミネッセンス表示素子用封止剤 - Google Patents

有機エレクトロルミネッセンス表示素子用封止剤 Download PDF

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JP6378985B2
JP6378985B2 JP2014184416A JP2014184416A JP6378985B2 JP 6378985 B2 JP6378985 B2 JP 6378985B2 JP 2014184416 A JP2014184416 A JP 2014184416A JP 2014184416 A JP2014184416 A JP 2014184416A JP 6378985 B2 JP6378985 B2 JP 6378985B2
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JP2016058273A (ja
JP2016058273A5 (enExample
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康雄 渡邊
康雄 渡邊
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2014184416A 2014-09-10 2014-09-10 有機エレクトロルミネッセンス表示素子用封止剤 Active JP6378985B2 (ja)

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JP2014184416A JP6378985B2 (ja) 2014-09-10 2014-09-10 有機エレクトロルミネッセンス表示素子用封止剤

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JP2014184416A JP6378985B2 (ja) 2014-09-10 2014-09-10 有機エレクトロルミネッセンス表示素子用封止剤

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JP2016058273A JP2016058273A (ja) 2016-04-21
JP2016058273A5 JP2016058273A5 (enExample) 2017-03-16
JP6378985B2 true JP6378985B2 (ja) 2018-08-22

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108781489B (zh) * 2016-09-16 2023-02-07 积水化学工业株式会社 有机电致发光显示元件用密封剂
CN110169201B (zh) * 2017-01-12 2024-07-05 积水化学工业株式会社 有机el显示元件用密封剂
KR102118365B1 (ko) 2017-04-21 2020-06-04 주식회사 엘지화학 유기전자소자 봉지용 조성물
KR102536932B1 (ko) 2017-08-24 2023-05-30 덴카 주식회사 유기 일렉트로 루미네센스 소자용 봉지제
CN112470551B (zh) 2018-09-26 2024-05-14 电化株式会社 有机电致发光显示元件用密封剂
JPWO2020158776A1 (ja) * 2019-01-30 2021-12-02 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
WO2020171186A1 (ja) 2019-02-21 2020-08-27 デンカ株式会社 組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7569260B2 (en) * 2003-08-21 2009-08-04 Asahi Kasei Chemicals Corporation Photosensitive composition and cured products thereof
JP5143449B2 (ja) * 2007-03-02 2013-02-13 株式会社ダイセル 熱又は活性エネルギー線硬化型接着剤
JP2009019077A (ja) * 2007-07-10 2009-01-29 Kyocera Chemical Corp 硬化性組成物、表示素子用接着剤及び接着方法
DE102012202377A1 (de) * 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
JP5919574B2 (ja) * 2011-10-24 2016-05-18 パナソニックＩｐマネジメント株式会社 Ｕｖ硬化性樹脂組成物、光学部品用接着剤及び有機ｅｌ素子用封止材
JPWO2014017524A1 (ja) * 2012-07-26 2016-07-11 デンカ株式会社 樹脂組成物

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