WO2019004241A1 - 有機el表示素子用面内封止剤及び有機el表示素子用封止剤セット - Google Patents
有機el表示素子用面内封止剤及び有機el表示素子用封止剤セット Download PDFInfo
- Publication number
- WO2019004241A1 WO2019004241A1 PCT/JP2018/024279 JP2018024279W WO2019004241A1 WO 2019004241 A1 WO2019004241 A1 WO 2019004241A1 JP 2018024279 W JP2018024279 W JP 2018024279W WO 2019004241 A1 WO2019004241 A1 WO 2019004241A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- organic
- sealing agent
- plane
- display element
- display elements
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 141
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 149
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 46
- 150000001875 compounds Chemical class 0.000 claims abstract description 45
- 239000004593 Epoxy Substances 0.000 claims abstract description 38
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 239000002250 absorbent Substances 0.000 claims abstract description 24
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 14
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 13
- 150000001925 cycloalkenes Chemical class 0.000 claims abstract description 13
- 230000002093 peripheral effect Effects 0.000 claims description 58
- 239000000565 sealant Substances 0.000 claims description 32
- 230000002745 absorbent Effects 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000006365 alkylene oxy carbonyl group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 claims description 2
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- -1 oxetane compound Chemical class 0.000 description 56
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 229920001187 thermosetting polymer Polymers 0.000 description 18
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 15
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 239000006087 Silane Coupling Agent Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 150000002148 esters Chemical class 0.000 description 11
- 239000007870 radical polymerization initiator Substances 0.000 description 11
- 239000003607 modifier Substances 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 9
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000003892 spreading Methods 0.000 description 8
- 230000007480 spreading Effects 0.000 description 8
- 239000003381 stabilizer Substances 0.000 description 8
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Natural products CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 7
- 238000012663 cationic photopolymerization Methods 0.000 description 7
- 239000003999 initiator Substances 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010943 off-gassing Methods 0.000 description 6
- 230000035515 penetration Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- UCBQKJQXUPVHFJ-UHFFFAOYSA-N 1-cyclopenta-2,4-dien-1-yl-2-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC=C1C1C=CC=C1 UCBQKJQXUPVHFJ-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 150000001450 anions Chemical class 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 3
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 3
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920002367 Polyisobutene Polymers 0.000 description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- PFHLXMMCWCWAMA-UHFFFAOYSA-N [4-(4-diphenylsulfoniophenyl)sulfanylphenyl]-diphenylsulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC(C=C1)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 PFHLXMMCWCWAMA-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 3
- 150000001342 alkaline earth metals Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 3
- 239000000292 calcium oxide Substances 0.000 description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000012954 diazonium Substances 0.000 description 3
- HYVNJCOHGOONJK-UHFFFAOYSA-N dibenzyl-methyl-phenylazanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(C)CC1=CC=CC=C1 HYVNJCOHGOONJK-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000003456 ion exchange resin Substances 0.000 description 3
- 229920003303 ion-exchange polymer Polymers 0.000 description 3
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000000171 quenching effect Effects 0.000 description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 229910018286 SbF 6 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 235000011941 Tilia x europaea Nutrition 0.000 description 2
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 2
- 235000010216 calcium carbonate Nutrition 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 238000005341 cation exchange Methods 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- 239000004571 lime Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229940105570 ornex Drugs 0.000 description 2
- 125000003566 oxetanyl group Chemical group 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 230000003405 preventing effect Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- ZNGSVRYVWHOWLX-KHFUBBAMSA-N (1r,2s)-2-(methylamino)-1-phenylpropan-1-ol;hydrate Chemical compound O.CN[C@@H](C)[C@H](O)C1=CC=CC=C1.CN[C@@H](C)[C@H](O)C1=CC=CC=C1 ZNGSVRYVWHOWLX-KHFUBBAMSA-N 0.000 description 1
- VLTYTTRXESKBKI-UHFFFAOYSA-N (2,4-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 VLTYTTRXESKBKI-UHFFFAOYSA-N 0.000 description 1
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- NQEJEMZJOBCYOD-UHFFFAOYSA-N (4-methoxyphenyl)methyl-dimethyl-phenylazanium Chemical compound C1=CC(OC)=CC=C1C[N+](C)(C)C1=CC=CC=C1 NQEJEMZJOBCYOD-UHFFFAOYSA-N 0.000 description 1
- QKAIFCSOWIMRJG-UHFFFAOYSA-N (4-methylphenyl)-(4-propan-2-ylphenyl)iodanium Chemical compound C1=CC(C(C)C)=CC=C1[I+]C1=CC=C(C)C=C1 QKAIFCSOWIMRJG-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- HIYIGPVBMDKPCR-UHFFFAOYSA-N 1,1-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1(COC=C)CCCCC1 HIYIGPVBMDKPCR-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- QLGYTJLZFZUDFL-UHFFFAOYSA-N 1,3-bis[1-(1h-imidazol-2-yl)propyl]urea Chemical compound N=1C=CNC=1C(CC)NC(=O)NC(CC)C1=NC=CN1 QLGYTJLZFZUDFL-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- VQYUAFDBUVMFKD-UHFFFAOYSA-N 1-(4-phenylsulfanylphenyl)octane-1,2-dione Chemical compound C1=CC(C(=O)C(=O)CCCCCC)=CC=C1SC1=CC=CC=C1 VQYUAFDBUVMFKD-UHFFFAOYSA-N 0.000 description 1
- VSHKLLPSERFSRJ-UHFFFAOYSA-N 1-(naphthalen-1-ylmethyl)pyridin-1-ium-2-carbonitrile Chemical compound N#CC1=CC=CC=[N+]1CC1=CC=CC2=CC=CC=C12 VSHKLLPSERFSRJ-UHFFFAOYSA-N 0.000 description 1
- OBSKXJSZGYXFFB-UHFFFAOYSA-N 1-benzylpyridin-1-ium-2-carbonitrile Chemical compound N#CC1=CC=CC=[N+]1CC1=CC=CC=C1 OBSKXJSZGYXFFB-UHFFFAOYSA-N 0.000 description 1
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 description 1
- RQJCIXUNHZZFMB-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxypropoxy)propane Chemical compound C=COCC(C)OCC(C)OC=C RQJCIXUNHZZFMB-UHFFFAOYSA-N 0.000 description 1
- FOWNZLLMQHBVQT-UHFFFAOYSA-N 1-ethenoxy-2-[2-(2-ethenoxypropoxy)propoxy]propane Chemical compound C=COCC(C)OCC(C)OCC(C)OC=C FOWNZLLMQHBVQT-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- VDAIJDKQXDCJSI-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)ethylurea Chemical compound CC1=NC=CN1CCNC(N)=O VDAIJDKQXDCJSI-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- IITAGOPHHFGANB-UHFFFAOYSA-N 2-(phenoxymethyl)oxetane Chemical compound C1COC1COC1=CC=CC=C1 IITAGOPHHFGANB-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- HTJPMGZZCKEJNA-UHFFFAOYSA-N 2-[3-[4-[4-[2,3-bis(2-hydroxyethoxy)phenyl]sulfanylphenyl]sulfanylphenyl]sulfanyl-2-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=CC(SC=2C=CC(SC=3C=CC(SC=4C(=C(OCCO)C=CC=4)OCCO)=CC=3)=CC=2)=C1OCCO HTJPMGZZCKEJNA-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- PNPLRTWSLDSFET-UHFFFAOYSA-N 2-naphthalen-1-yl-5-phenyl-1,3,4-oxadiazole Chemical compound C1=CC=CC=C1C1=NN=C(C=2C3=CC=CC=C3C=CC=2)O1 PNPLRTWSLDSFET-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- HEHQAVVEDNWWBS-UHFFFAOYSA-N C(C=C1)=CC=C1[S+](C1=CC=CC=C1)C1=CC=CC=C1.[AsH3].[AsH3] Chemical compound C(C=C1)=CC=C1[S+](C1=CC=CC=C1)C1=CC=CC=C1.[AsH3].[AsH3] HEHQAVVEDNWWBS-UHFFFAOYSA-N 0.000 description 1
- GCTUFNGQXMXWEI-UHFFFAOYSA-N C1C(C2)OC1CC2C1CC2OC2CC1 Chemical compound C1C(C2)OC1CC2C1CC2OC2CC1 GCTUFNGQXMXWEI-UHFFFAOYSA-N 0.000 description 1
- GMXOYEFGMAXIIU-UHFFFAOYSA-N C[N+](CC1=CC(=C(C=C1)C)C)(C1=CC=CC=C1)C Chemical compound C[N+](CC1=CC(=C(C=C1)C)C)(C1=CC=CC=C1)C GMXOYEFGMAXIIU-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- WHOYSPWXXOLXPT-UHFFFAOYSA-N F.F.F.F.F.F.[AsH3].[AsH3] Chemical compound F.F.F.F.F.F.[AsH3].[AsH3] WHOYSPWXXOLXPT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N O=C(C1CC2OC2CC1)OCC1CC2OC2CC1 Chemical compound O=C(C1CC2OC2CC1)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 239000007877 V-601 Substances 0.000 description 1
- WYGWHHGCAGTUCH-ISLYRVAYSA-N V-65 Substances CC(C)CC(C)(C#N)\N=N\C(C)(C#N)CC(C)C WYGWHHGCAGTUCH-ISLYRVAYSA-N 0.000 description 1
- MOOIXEMFUKBQLJ-UHFFFAOYSA-N [1-(ethenoxymethyl)cyclohexyl]methanol Chemical compound C=COCC1(CO)CCCCC1 MOOIXEMFUKBQLJ-UHFFFAOYSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- VPSDPCXOOHMTDQ-UHFFFAOYSA-N [B+3].C(C)[N+](C1=CC=CC=C1)(CC1=CC=CC=C1)CC Chemical compound [B+3].C(C)[N+](C1=CC=CC=C1)(CC1=CC=CC=C1)CC VPSDPCXOOHMTDQ-UHFFFAOYSA-N 0.000 description 1
- GROOQLAYIIFIBG-UHFFFAOYSA-N [B+3].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 Chemical compound [B+3].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 GROOQLAYIIFIBG-UHFFFAOYSA-N 0.000 description 1
- BFVANNVEMACRTA-UHFFFAOYSA-N [Sb+3].CCCC[P+](CCCC)(CCCC)CCCC Chemical compound [Sb+3].CCCC[P+](CCCC)(CCCC)CCCC BFVANNVEMACRTA-UHFFFAOYSA-N 0.000 description 1
- HPYWHNVMFQVCPV-UHFFFAOYSA-N [Sb+3].[Sb+3].C1(=CC=CC=C1)[S+](C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound [Sb+3].[Sb+3].C1(=CC=CC=C1)[S+](C1=CC=CC=C1)C1=CC=CC=C1 HPYWHNVMFQVCPV-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005349 anion exchange Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 1
- 150000001454 anthracenes Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- KUBDAUORBIPBFS-UHFFFAOYSA-N antimony(3+) benzyl-dimethyl-phenylazanium Chemical compound [Sb+3].C=1C=CC=CC=1[N+](C)(C)CC1=CC=CC=C1 KUBDAUORBIPBFS-UHFFFAOYSA-N 0.000 description 1
- CFPCDQPUCAECLL-UHFFFAOYSA-N antimony(3+) ethyl(triphenyl)phosphanium Chemical compound [Sb+3].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 CFPCDQPUCAECLL-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- AENNXXRRACDJAY-UHFFFAOYSA-N bis(2-dodecylphenyl)iodanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC AENNXXRRACDJAY-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- NKWPZUCBCARRDP-UHFFFAOYSA-L calcium bicarbonate Chemical compound [Ca+2].OC([O-])=O.OC([O-])=O NKWPZUCBCARRDP-UHFFFAOYSA-L 0.000 description 1
- 229910000020 calcium bicarbonate Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical class [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical group C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- ONRGBXGMVZEZLY-UHFFFAOYSA-N dimethyl-[(4-methylphenyl)methyl]-phenylazanium Chemical compound C1=CC(C)=CC=C1C[N+](C)(C)C1=CC=CC=C1 ONRGBXGMVZEZLY-UHFFFAOYSA-N 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 description 1
- 125000001207 fluorophenyl group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- BLGWXSOTAXXXDE-UHFFFAOYSA-N n'-[1-(1h-imidazol-2-yl)propyl]hexanediamide Chemical compound NC(=O)CCCCC(=O)NC(CC)C1=NC=CN1 BLGWXSOTAXXXDE-UHFFFAOYSA-N 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- HMKGBOLFVMRQRP-UHFFFAOYSA-N tribenzyl(phenyl)azanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 HMKGBOLFVMRQRP-UHFFFAOYSA-N 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Definitions
- the present invention relates to an in-plane sealing agent for an organic EL display element which is excellent in coating properties, wet spreading properties, and curability.
- the present invention also relates to a sealant set for an organic EL display device, which comprises a peripheral sealant and the in-plane sealant for the organic EL display device.
- An organic electroluminescent display element (organic EL display element) has a thin film structure in which an organic light emitting material layer is sandwiched between a pair of electrodes facing each other. Electrons are injected from one electrode into the organic light emitting material layer and holes are injected from the other electrode, whereby the electrons and holes are combined in the organic light emitting material layer to perform self-emission.
- a liquid crystal display element or the like which requires a backlight, it has the advantages of high visibility, capable of being thinned, and capable of direct current low voltage driving.
- an organic EL display element has a problem that the light emission characteristics thereof are rapidly deteriorated and the life becomes short when the organic light emitting material layer or the electrode is exposed to the outside air. Therefore, for the purpose of enhancing the stability and durability of the organic EL display device, in the organic EL display device, a sealing technique for shielding the organic light emitting material layer and the electrode from moisture and oxygen in the air becomes indispensable. There is.
- an organic filling layer comprising an in-plane sealing agent for covering and sealing a laminate having an organic light emitting material layer, and a peripheral sealing agent containing a moisture absorbent, the organic filling layer
- the method of sealing an organic electroluminescent display element is disclosed by the structure which has the moisture absorption sealing layer which covers the side surface of, and.
- a material excellent in coating property and wet spreading necessary for the in-plane sealing agent is used.
- the curability can not be sufficiently obtained, or a display defect may occur in the organic EL display element.
- An object of this invention is to provide the in-plane sealing agent for organic EL display elements which is excellent in applicability
- Another object of the present invention is to provide a sealant set for an organic EL display device comprising a peripheral sealant and the in-plane sealant for the organic EL display device.
- the present invention is an in-plane sealing agent for an organic EL display device, which is used by being applied to the inner side of a peripheral sealing agent for an organic EL display device containing a moisture absorbent, and a curable resin and a cationic polymerization initiator
- the curable resin contains a cycloalkene oxide type alicyclic epoxy compound having a silicone skeleton, and is 25 ° C. using an E-type viscometer in the entire in-plane sealing agent for an organic EL display device.
- It is an in-plane sealing agent for organic EL display elements whose viscosity measured on condition of 20 rpm is 50 mPa * s or more and 150 mPa * s or less. The present invention will be described in detail below.
- the inventors of the present invention have found that when the organic EL display element is sealed by the configuration using the in-plane sealing agent and the peripheral sealing agent, the reason why the curing property of the in-plane sealing agent can not be sufficiently obtained is It was considered that the water absorbent contained in the anti-static agent inhibited the curing of the in-plane sealing agent.
- the in-plane sealing agent for an organic EL display element of the present invention contains a curable resin.
- the curable resin contains a cycloalkene oxide type alicyclic epoxy compound having a silicone skeleton.
- the in-plane sealing agent for an organic EL display device of the present invention is excellent in curability and dark in the obtained organic EL display device. It becomes possible to suppress display defects such as spots.
- a compound represented by the following formula (1) is preferable because it is excellent in wettability and curability, and further, low outgassing and organic light emitting material
- the compound represented by following formula (2) is more preferable, since it is excellent in the effect which suppresses the penetration to the laminated body which has a layer.
- n represents an integer of 0 or more and 10 or less.
- the preferable lower limit of the content of the cycloalkene oxide type alicyclic epoxy compound having a silicone skeleton in 100 parts by weight of the curable resin is 20 parts by weight, and the preferable upper limit is 70 parts by weight.
- the content of the cycloalkene oxide type alicyclic epoxy compound having a silicone skeleton is 20 parts by weight or more, the in-plane sealing agent for an organic EL display element obtained is curable, and the obtained organic EL It becomes excellent by the effect which suppresses the display defect of a display element.
- the in-plane sealing agent for an organic EL display element obtained is more excellent in coatability.
- the more preferable lower limit of the content of the cycloalkene oxide type alicyclic epoxy compound having a silicone skeleton is 40 parts by weight, and the more preferable upper limit is 60 parts by weight.
- the said curable resin contains other curable resin for the purpose of adjusting the viscosity of the in-plane sealing agent for organic EL display elements obtained.
- said other curable resin another epoxy compound, an oxetane compound, a vinyl ether compound etc. are mentioned, for example.
- the other epoxy compounds include compounds represented by the following formula (3), dicyclopentadiene dimethanol diglycidyl ether, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, Hydrogenated bisphenol F diglycidyl ether etc. are mentioned.
- oxetane compounds include bis ((3-ethyloxetan-3-yl) methyl) ether, phenoxymethyl oxetane, 3-ethyl-3-hydroxymethyl oxetane, 3-ethyl-3- (phenoxymethyl) oxetane, 3-ethyl-3-((2-ethylhexyloxy) methyl) oxetane, 3-ethyl-3-((3- (triethoxysilyl) propoxy) methyl) oxetane, oxetanyl silsesquioxane, phenol novolac oxetane, 1, 4-bis (((3-ethyl-3-oxetanyl) methoxy) methyl) benzene and the like.
- vinyl ether compounds examples include benzyl vinyl ether, cyclohexane dimethanol monovinyl ether, dicyclopentadiene vinyl ether, 1,4-butanediol divinyl ether, cyclohexane dimethanol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, dipropylene glycol Divinyl ether, tripropylene glycol divinyl ether and the like can be mentioned.
- a compound represented by the following formula (3) is preferable, and a compound represented by the following formula (4-1), represented by the following formula (4-2) Compounds are more preferred.
- R 1 to R 18 each represent a hydrogen atom, a halogen atom, or a hydrocarbon group which may contain an oxygen atom or a halogen atom, which may be identical to or different from each other. It is also good.
- X is a bond, an oxygen atom, an alkylene group of 1 to 5 carbon atoms, an oxycarbonyl group, an alkylene oxy carbonyl group of 2 to 5 carbon atoms, or a secondary amino group.
- the in-plane sealing agent for an organic EL display element of the present invention contains a cationic polymerization initiator.
- a cationic polymerization initiator the thermal cationic polymerization initiator which generate
- An ionic acid generation type It may be a non-ionic acid generating type.
- thermal cationic polymerization initiator BF 4 ⁇ , PF 6 ⁇ , SbF 6 ⁇ or (BX 4 ) ⁇ (wherein X is a phenyl substituted by at least two or more fluorine or trifluoromethyl groups)
- a sulfonium salt, a phosphonium salt, a quaternary ammonium salt, a diazonium salt, or an iodonium salt is preferred, in which the group is a counter anion. Among them, sulfonium salts having the above counter anion are more preferable.
- sulfonium salt examples include triphenylsulfonium boron tetrafluoride, triphenylsulfonium antimony antimony hexafluoride, triphenylsulfonium arsenic arsenic hexafluoride, tri (4-methoxyphenyl) sulfonium arsenic arsenic hexafluoride, diphenyl (4-phenylthiophenyl) And sulfone hexafluoride arsenic and the like.
- Examples of the phosphonium salt include ethyl triphenyl phosphonium antimony hexafluoride, tetrabutyl phosphonium antimony hexafluoride and the like.
- Examples of the quaternary ammonium salt include dimethylphenyl (4-methoxybenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methoxybenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methoxybenzyl) ammonium tetrakis (penta Fluorophenyl) borate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methylbenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorotetrakis (pentafluorophenyl) borate , Me
- thermal cationic polymerization initiator As what is marketed among the said thermal cationic polymerization initiators, the thermal cationic polymerization initiator by Sanshin Chemical Industry Co., Ltd., the thermal cationic polymerization initiator by King Industries Ltd., etc. are mentioned, for example.
- the thermal cationic polymerization initiator manufactured by Sanshin Chemical Industry Co., Ltd. include San Aid SI-60, San Aid SI-80, San Aid SI-B3, San Aid SI-B3A, San Aid SI-B4 and the like.
- thermal cationic polymerization initiator manufactured by King Industries, Inc. include CXC-1612, CXC-1738, CXC-1821 and the like.
- the anionic moiety of the above-mentioned ionic acid-generating photocationic polymerization initiator may be, for example, BF 4 ⁇ , PF 6 ⁇ , SbF 6 ⁇ or (BX 4 ) ⁇ (wherein X is at least 2 or more). And a phenyl group substituted with a fluorine or trifluoromethyl group) and the like.
- Examples of the above-described ionic photoacid-generating photocationic polymerization initiator include an aromatic sulfonium salt, an aromatic iodonium salt, an aromatic diazonium salt, an aromatic ammonium salt, or (2,4 And -cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe salt and the like.
- aromatic sulfonium salt examples include bis (4- (diphenylsulfonio) phenyl) sulfide bishexafluorophosphate, bis (4- (diphenylsulfonio) phenyl) sulfide bishexafluoroantimonate, bis (4- (diphenyl) Diphenylsulfonio) phenyl) sulfide bis tetrafluoroborate, bis (4- (diphenylsulfonio) phenyl) sulfide tetrakis (pentafluorophenyl) borate, diphenyl-4- (phenylthio) phenylsulfonium hexafluorophosphate, diphenyl-4- (4) Phenylthio) phenylsulfonium hexafluoroantimonate, diphenyl-4- (phenylthio) phenylsulfon
- aromatic iodonium salt examples include diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium tetrafluoroborate, diphenyliodonium tetrakis (pentafluorophenyl) borate, bis (dodecylphenyl) iodonium hexafluorophosphate, bis (Dodecylphenyl) iodonium hexafluoroantimonate, bis (dodecylphenyl) iodonium tetrafluoroborate, bis (dodecylphenyl) iodonium tetrakis (pentafluorophenyl) borate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium hexa Fluorophosphate, 4-methylphenyl-4- (1-methylethy
- aromatic diazonium salt examples include phenyl diazonium hexafluorophosphate, phenyl diazonium hexafluoro antimonate, phenyl diazonium tetrafluoroborate, phenyl diazonium tetrakis (pentafluorophenyl) borate and the like.
- aromatic ammonium salt examples include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl 2-cyanopyridinium hexafluoroantimonate, 1-benzyl 2-cyanopyridinium tetrafluoroborate, 1-benzyl 2-Cyanopyridinium tetrakis (pentafluorophenyl) borate, 1- (naphthylmethyl) -2-cyanopyridinium hexafluorophosphate, 1- (naphthylmethyl) -2-cyanopyridinium hexafluoroantimonate, 1- (naphthylmethyl) Examples thereof include -2-cyanopyridinium tetrafluoroborate, 1- (naphthylmethyl) -2-cyanopyridinium tetrakis (pentafluorophenyl) borate and the like.
- Examples of the (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe salt include, for example, (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene ) -Fe (II) hexafluorophosphate, (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe (II) hexafluoroantimonate, (2,4-cyclopentadiene-1) -Yl) ((1-methylethyl) benzene) -Fe (II) tetrafluoroborate, (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe (II) tetrakis (penta) And fluorophenyl) borate and the like.
- nonionic acid generating type examples include nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenol sulfonic acid ester, diazonaphthoquinone, N-hydroxyimide sulfonate and the like.
- photo cationic polymerization initiators commercially available ones are, for example, a photo cationic polymerization initiator manufactured by Midori Chemical Co., a photo cationic polymerization initiator manufactured by Union Carbide, a photo cationic polymerization initiator manufactured by ADEKA, Examples thereof include a cationic photopolymerization initiator manufactured by 3M, a cationic photopolymerization initiator manufactured by BASF, and a cationic photopolymerization initiator manufactured by Rhodia. Examples of the photocationic polymerization initiator manufactured by Midori Kagaku Co., Ltd. include DTS-200.
- Examples of the cationic photopolymerization initiator manufactured by Union Carbide include UVI6990, UVI6974 and the like.
- Examples of the cationic photopolymerization initiator manufactured by ADEKA include SP-150 and SP-170.
- Examples of the photocationic polymerization initiator manufactured by 3M include FC-508, FC-512 and the like.
- Examples of the cationic photopolymerization initiator manufactured by BASF include IRGACURE 290 and the like.
- Examples of the cationic photopolymerization initiator manufactured by Rhodia include PI 2074 and the like.
- thermal cationic polymerization initiator can also be used as the said thermal cationic polymerization initiator, and can also be used as the said photo cationic polymerization initiator.
- quaternary ammonium salts in which the counter anion is a borate type (hereinafter also referred to as "borate type quaternary ammonium salt") are suitably used.
- the counter anion of the borate quaternary ammonium salt is BF 4 ⁇ or (BX 4 ) ⁇ (wherein X represents a phenyl group substituted by at least two or more fluorine or trifluoromethyl groups) Is preferred.
- the lower limit of the content of the cationic polymerization initiator is preferably 0.05 parts by weight and the upper limit is 10 parts by weight with respect to 100 parts by weight of the cationically polymerizable compound.
- the content of the cationic polymerization initiator is in this range, the in-plane sealing agent for an organic EL display element obtained is excellent in curability and storage stability.
- a more preferable lower limit of the content of the cationic polymerization initiator is 0.1 parts by weight, and a more preferable upper limit is 5 parts by weight.
- the in-plane sealing agent for an organic EL display element of the present invention may contain a sensitizer.
- the sensitizer has a role of further improving the polymerization initiation efficiency of the photocationic polymerization initiator to further accelerate the curing reaction of the in-plane sealing agent for an organic EL display element of the present invention.
- Examples of the sensitizer include anthracene compounds, thioxanthone compounds, 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, 2,4-dichlorobenzophenone, methyl o-benzoylbenzoate, 4,4'-bis (dimethylamino) benzophenone, 4-benzoyl-4'-methyl diphenyl sulfide and the like.
- Examples of the anthracene compound include 9,10-dibutoxyanthracene and the like.
- Examples of the thioxanthone compounds include 2,4-diethylthioxanthone and the like.
- the lower limit of the content of the sensitizer is preferably 0.05 parts by weight and the upper limit is 3 parts by weight with respect to 100 parts by weight of the curable resin.
- the content of the sensitizer is 0.05 parts by weight or more, the sensitizing effect is more exhibited.
- the content of the sensitizer is 3 parts by weight or less, light can be transmitted to the deep part without the absorption becoming too large.
- a more preferable lower limit of the content of the sensitizer is 0.1 parts by weight, and a more preferable upper limit is 1 part by weight.
- the in-plane sealing agent for organic EL display elements of this invention may contain a thermosetting agent.
- thermosetting agent include hydrazide compounds, imidazole derivatives, acid anhydrides, dicyandiamides, guanidine derivatives, modified aliphatic polyamines, and addition products of various amines and epoxy resins.
- hydrazide compound examples include 1,3-bis (hydrazinocarboethyl) -5-isopropylhydantoin, sebacic acid dihydrazide, isophthalic acid dihydrazide, adipic acid dihydrazide, malonic acid dihydrazide and the like.
- imidazole derivatives examples include 1-cyanoethyl-2-phenylimidazole, N- (2- (2-methyl-1-imidazolyl) ethyl) urea, 2,4-diamino-6- (2′-methylimidazolyl- (1 ′))-Ethyl-s-triazine, N, N′-bis (2-methyl-1-imidazolylethyl) urea, N, N ′-(2-methyl-1-imidazolylethyl) -adipamide, 2- Examples include phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and the like.
- acid anhydride examples include tetrahydrophthalic anhydride, ethylene glycol bis (anhydrotrimellitate) and the like. These thermosetting agents may be used alone or in combination of two or more.
- thermosetting agent As what is marketed among the said thermosetting agent, the thermosetting agent by Nippon Finechem Co., Ltd., the thermosetting agent by Otsuka Chemical Co., Ltd., the thermosetting agent by Ajinomoto Fine Techno Co., Ltd., etc. are mentioned, for example.
- thermosetting agent manufactured by Japan Finechem Co., Ltd. include SDH and the like.
- thermosetting agent manufactured by the said Otsuka Chemical Co., Ltd., ADH etc. are mentioned, for example.
- thermosetting agent manufactured by Ajinomoto Fine Techno Co., Ltd. include Amicure VDH, Amicure VDH-J, Amicure UDH and the like.
- the lower limit of the content of the thermosetting agent is preferably 0.5 parts by weight and the upper limit is 30 parts by weight with respect to 100 parts by weight of the cationically polymerizable compound.
- content of the said thermosetting agent is 0.5 weight part or more
- the in-plane sealing agent for organic EL display elements obtained will be excellent by thermosetting.
- the content of the thermosetting agent is 30 parts by weight or less
- the obtained in-plane sealing agent for an organic EL display element is more excellent in storage stability.
- the more preferable lower limit of the content of the thermosetting agent is 1 part by weight, and the more preferable upper limit is 15 parts by weight.
- the in-plane sealing agent for organic EL display elements of this invention contains a stabilizer. By containing the said stabilizer, the in-plane sealing agent for organic EL display elements of this invention becomes what is more excellent in storage stability.
- amine compounds such as a benzylamine, an aminophenol type epoxy resin, etc. are mentioned, for example.
- the preferable lower limit of the content of the stabilizer is 0.001 parts by weight, and the preferable upper limit is 2 parts by weight with respect to 100 parts by weight of the cationically polymerizable compound.
- the content of the stabilizer is in this range, the obtained in-plane sealing agent for an organic EL display element is more excellent in storage stability while maintaining excellent curability.
- the more preferable lower limit of the content of the stabilizer is 0.005 part by weight, and the more preferable upper limit is 1 part by weight.
- the in-plane sealing agent for organic EL display elements of the present invention may contain a silane coupling agent.
- the said silane coupling agent has a role of improving the adhesiveness of the in-plane sealing agent for organic EL display elements of this invention, a board
- silane coupling agent examples include 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltrimethoxysilane and the like. These silane coupling agents may be used alone or in combination of two or more.
- the preferable lower limit of the content of the silane coupling agent is 0.1 parts by weight and the preferable upper limit is 10 parts by weight with respect to 100 parts by weight of the cationically polymerizable compound.
- the content of the above-mentioned silane coupling agent being this range, it is an effect which improves the adhesiveness of the in-plane sealing agent for organic EL display elements obtained, preventing the bleed out of the excess silane coupling agent. It will be excellent.
- a more preferable lower limit of the content of the silane coupling agent is 0.5 parts by weight, and a more preferable upper limit is 5 parts by weight.
- the in-plane sealing agent for organic EL display elements of this invention may contain a surface modifier in the range which does not inhibit the objective of this invention.
- a surface modifier By containing the said surface modifier, the flatness of the coating film of the in-plane sealing agent for organic EL display elements of this invention can be improved.
- surfactant As said surface modifier, surfactant, a leveling agent, etc. are mentioned, for example.
- Examples of the surface modifier include those of silicone type, acrylic type and fluorine type.
- commercially available ones include, for example, a surface modifier manufactured by Bick Chemie Japan Ltd., a surface modifier manufactured by Kushimoto Chemical Co., Ltd., a surface modifier manufactured by AGC Seimi Chemical Co., Ltd. It can be mentioned.
- Examples of the surface modifying agent manufactured by Big Chem Japan Ltd. include BYK-300, BYK-302, BYK-331 and the like.
- Examples of the surface modifier manufactured by Kushimoto Chemical Co., Ltd. include UVX-272.
- Examples of the surface modifying agent manufactured by AGC Seimi Chemical Co., Ltd. include Surfron S-611.
- the in-plane sealing agent for an organic EL display element of the present invention was generated in the in-plane sealing agent for an organic EL display element in order to improve the durability of the element electrode within the range not inhibiting the object of the present invention. It may contain a compound that reacts with an acid or an ion exchange resin.
- Examples of the compound that reacts with the generated acid include substances that can be neutralized with an acid, such as carbonates or hydrogencarbonates of alkali metals or carbonates or hydrogencarbonates of alkaline earth metals.
- an acid such as carbonates or hydrogencarbonates of alkali metals or carbonates or hydrogencarbonates of alkaline earth metals.
- carbonates or hydrogencarbonates of alkali metals or carbonates or hydrogencarbonates of alkaline earth metals such as calcium carbonate, calcium hydrogen carbonate, sodium carbonate, sodium hydrogen carbonate and the like are used.
- any of cation exchange type, anion exchange type, and both ion exchange types can be used, and in particular, cation exchange type or both ion exchange type capable of adsorbing chloride ions. Is preferred.
- the in-plane sealing agent for organic EL display elements of this invention is a range which does not inhibit the objective of this invention, and as needed, a hardening retarder, a reinforcing agent, a softener, a plasticizer, a viscosity modifier, an ultraviolet-ray You may contain well-known various additives, such as an absorber and antioxidant.
- the in-plane sealing agent for organic EL display elements of this invention does not contain a solvent from a viewpoint of suppressing generation
- a hardener using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader or a 3-roll mill.
- a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader or a 3-roll mill.
- the method of mixing resin, a cationic polymerization initiator, and additives, such as a stabilizer and a silane coupling agent which are added as needed, etc. are mentioned.
- the in-plane sealing agent for an organic EL display element of the present invention has a lower limit of 50 mPa ⁇ s and an upper limit of 150 mPa ⁇ s as a whole viscosity measured at 25 ° C. and 20 rpm using an E-type viscometer.
- the lower limit of the viscosity is preferably 60 mPa ⁇ s, preferably 140 mPa ⁇ s, more preferably 80 mPa ⁇ s, and still more preferably 120 mPa ⁇ s.
- VISCOMETER TV-22 made by Toki Sangyo Co., Ltd.
- VISCOMETER TV-22 can be used, for example, It can measure with the cone plate of CP1.
- the preferable lower limit of the surface tension of the in-plane sealing agent for an organic EL display element of the present invention is 15 mN / m, and the preferable upper limit is 45 mN / m.
- the surface tension is in this range, the in-plane sealing agent for an organic EL display element obtained is excellent in coatability, and is particularly suitable as an in-plane sealing agent for an organic EL display element.
- the more preferable lower limit of the surface tension is 20 mN / m, and the more preferable upper limit is 35 mN / m.
- the surface tension can be measured by a dynamic wettability tester at 25 ° C.
- the in-plane sealing agent for an organic EL display element of the present invention is used by being applied to the inner side of a peripheral sealing agent for an organic EL display element containing a moisture absorbent.
- a sealing agent set for an organic EL display element used for sealing an organic EL display element comprising: a peripheral sealing agent for sealing a peripheral portion of the organic EL display element; and an organic light emitting material inside the peripheral sealing agent
- an in-plane sealing agent for covering and sealing a laminate having a layer, wherein the peripheral sealing agent contains a curable resin, a polymerization initiator and a water absorbent, and the in-plane sealing agent
- a sealant set for an organic EL display device which is an in-plane sealant for an organic EL display device according to the present invention, is also one of the present invention.
- the peripheral sealing agent contains a curable resin.
- a curable resin used for the said peripheral sealing agent The radically polymerizable compound which has cationically polymerizable groups, such as an epoxy group, oxetanyl group, vinyl ether group, and the radical which has radically polymerizable groups, such as (meth) acryloyl group Polymerizable compounds can be mentioned.
- an epoxy resin having a bisphenol skeleton As a cationically polymerizable compound used for the peripheral sealing agent, an epoxy resin having a bisphenol skeleton, an epoxy resin having a novolac skeleton, an epoxy resin having a naphthalene skeleton, and an epoxy resin having a naphthalene skeleton, from the viewpoint of easy adjustment of viscosity, etc.
- At least one epoxy resin selected from the group consisting of epoxy resins having a cyclopentadiene skeleton is preferred. Among them, an epoxy resin having a bisphenol skeleton is more preferable, and a bisphenol F-type epoxy resin is more preferable.
- the peripheral sealing agent preferably contains a compound represented by the above formula (3) as the above cationic polymerizable compound, and it is preferable to use the above formula (4-1) It is preferable to contain the compound represented and / or the compound represented by the above formula (4-2).
- a (meth) acrylic compound is suitably used as the radically polymerizable compound.
- an epoxy (meth) acrylate, a (meth) acrylic acid ester compound, urethane (meth) acrylate etc. are mentioned, for example.
- epoxy (meth) acrylate is preferable.
- the “(meth) acrylic” indicates acrylic or methacrylic
- the “(meth) acrylate” indicates an acrylate or methacrylate
- the “epoxy (meth) acrylate” indicates The compound which made all the epoxy groups in an epoxy resin react with (meth) acrylic acid is represented.
- epoxy (meth) acrylates for example, epoxy (meth) acrylate manufactured by Daicel Ornex, epoxy (meth) acrylate manufactured by Shin-Nakamura Chemical Co., Ltd., epoxy manufactured by Kyoeisha Chemical Examples thereof include meta) acrylates and epoxy (meth) acrylates manufactured by Nagase ChemteX Corporation. Examples of the epoxy (meth) acrylate manufactured by the above-mentioned Daicel Ornex Co., Ltd.
- Examples of the epoxy (meth) acrylate manufactured by Shin-Nakamura Chemical Co., Ltd. include EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 and the like. Examples of epoxy (meth) acrylates manufactured by Kyoeisha Chemical Co., Ltd.
- epoxy ester M-600A examples include epoxy ester M-600A, epoxy ester 40EM, epoxy ester 70PA, epoxy ester 200PA, epoxy ester 80MFA, epoxy ester 3002M, epoxy ester 3002A, epoxy ester 1600A, Epoxy ester 3000 M, epoxy ester 3000 A, epoxy ester 200 EA, epoxy ester 400 EA, etc. may be mentioned.
- Examples of the epoxy (meth) acrylate manufactured by Nagase ChemteX Corporation examples include Denacol acrylate DA-141, Denacol acrylate DA-314, Denacol acrylate DA-911 and the like.
- the peripheral sealing agent preferably contains a resin having a polyisobutylene skeleton from the viewpoints of transparency, moisture permeation prevention, and adhesiveness, and the resin having the polyisobutylene skeleton and the radical polymerizable compound It is more preferable to use in combination.
- Examples of the resin having a polyisobutylene skeleton include a homopolymer of isobutene, an isobutylene / isoprene copolymer obtained by copolymerizing isobutene and isoprene in an amount of several percent by weight with respect to the isobutene, and the isobutylene / isoprene copolymer.
- part derived from isoprene in an isoprene copolymer are mentioned.
- the peripheral sealing agent contains a polymerization initiator.
- a polymerization initiator used for the said peripheral sealing agent a cationic polymerization initiator and a radical polymerization initiator can be used.
- radical polymerization initiator a photo radical polymerization initiator and a thermal radical polymerization initiator can be used.
- photo radical polymerization initiator examples include benzophenone compounds, acetophenone compounds, acyl phosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, benzyl, thioxanthone and the like.
- photoradical polymerization initiator examples include 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone, and 1,2- (dimethylamino).
- thermal radical polymerization initiator examples include peroxides and azo compounds. As what is marketed among the said thermal radical polymerization initiators, the thermal radical polymerization initiator by NOF Corporation, the thermal radical polymerization initiator by Fujifilm Wako Pure Chemical Industries Ltd., etc. are mentioned, for example. Examples of the thermal radical polymerization initiator manufactured by NOF Corporation include perbutyl O, perhexyl O, and perbutyl PV. Examples of the thermal radical polymerization initiator manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. include V-30, V-65, V-501, V-601, VPE-0201 and the like.
- the content of the polymerization initiator used for the peripheral sealing agent is preferably 0.1 parts by weight with respect to 100 parts by weight of the curable resin, and 10 parts by weight with a preferable upper limit.
- the content of the polymerization initiator used for the peripheral sealant is in this range, the peripheral sealant obtained is excellent in curability, storage stability, and barrier property.
- the more preferable lower limit of the content of the polymerization initiator used for the peripheral sealing agent is 0.5 parts by weight, and the more preferable upper limit is 5 parts by weight.
- the peripheral sealant may contain a thermosetting agent.
- a thermosetting agent used for the said periphery sealing agent the thing similar to the thermosetting agent mentioned above in the in-plane sealing agent for organic EL display elements of this invention is mentioned.
- the peripheral sealant contains a moisture absorbent. By containing the water absorbent, the peripheral sealant becomes excellent in barrier properties.
- the sealant set for an organic EL display device of the present invention uses one containing the moisture absorbent as the peripheral sealant, but the sealant for an organic EL display device of the present invention is used as an in-plane sealant. In order to use, even if it uses combining these, an in-plane sealing agent can fully be hardened and generation
- the preferred lower limit of the water absorption of the water absorbent is 10% by weight.
- the water absorption rate of the water absorbent is 10% by weight or more, the peripheral sealing agent obtained is more excellent in the barrier property.
- a more preferable lower limit of the water absorption rate of the water absorbent is 20% by weight.
- said "water absorption coefficient" means the change rate of weight in the case of performing the high temperature and high humidity test left to stand in the atmosphere of temperature 85 degreeC and humidity 85% for 24 hours.
- Examples of the material constituting the water absorbent include oxides of alkaline earth metals such as calcium oxide, strontium oxide and barium oxide, magnesium oxide, molecular sieves and the like. Among them, from the viewpoint of water absorption, oxides of alkaline earth metals are preferable, and calcium oxide is more preferable.
- the preferable lower limit is 5 parts by weight and the preferable upper limit is 60 parts by weight with respect to 100 parts by weight of the curable resin.
- the content of the water absorbent in the peripheral sealing agent is in this range, the effect of suppressing panel peeling can be excellent while the peripheral sealing agent obtained has excellent barrier properties.
- a more preferable lower limit of the content of the water absorbent in the peripheral sealing agent is 10 parts by weight, and a more preferable upper limit is 40 parts by weight.
- the peripheral sealing agent may contain other fillers in addition to the water absorbent as long as the object of the present invention is not impaired for the purpose of improving the adhesiveness and the like.
- the other fillers include inorganic fillers such as silica, talc and alumina, and organic fillers such as polyester fine particles, polyurethane fine particles, vinyl polymer fine particles, and acrylic polymer fine particles. Among them, talc is preferred.
- the above-mentioned peripheral sealing agent is a sensitizer, a stabilizer, a silane coupling agent, a surface modifier, an ion exchange resin, a curing retarder, a reinforcing agent, a softener, a plasticizer, a viscosity modifier, an ultraviolet absorber, oxidation
- You may contain additives, such as an inhibitor. Examples of these additives include the same as those described above in the in-plane sealing agent for an organic EL display element of the present invention.
- the said peripheral sealing agent does not contain a solvent from a viewpoint of suppressing generation
- the peripheral sealing agent can be excellent in coatability without containing the solvent.
- the peripheral sealing agent for example, a curable resin, a polymerization initiator, and the like using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, and a 3-roll mill,
- a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, and a 3-roll mill
- the peripheral sealing agent is preferably a paste having a viscosity of 150 Pa ⁇ s or more and 500 Pa ⁇ s or less measured at 25 ° C. using an E-type viscometer.
- the peripheral sealing agent is a paste having a viscosity in this range, it becomes excellent due to both the coating property and the dispersibility of the water absorbent.
- a more preferable lower limit of the viscosity of the peripheral sealing agent is 200 Pa ⁇ s, and a more preferable upper limit is 400 Pa ⁇ s.
- a solvent is used to adjust the viscosity of the peripheral sealing agent, it becomes difficult to suppress the generation of outgassing.
- the viscosity of the above-mentioned peripheral sealing agent is appropriately determined from the optimum torque number in each viscosity region with a cone plate of CP1 using, for example, VISCOMETER TV-22 (manufactured by Toki Sangyo Co., Ltd.) as an E-type viscometer. It can be measured by selecting a rotational speed of ⁇ 100 rpm.
- an in-plane sealing agent for an organic EL display element which is excellent in coatability, wet spreading property, and curability. Further, according to the present invention, it is possible to provide a sealant set for an organic EL display device, which comprises a peripheral sealant and the in-plane sealant for the organic EL display device.
- Examples 1 to 8 and Comparative Examples 1 to 5 According to the compounding ratio described in Tables 1 to 3, each material is uniformly stirred and mixed at a stirring speed of 3000 rpm using a stirring mixer ("AR-250" manufactured by Shinky Co., Ltd.), Examples 1 to 8; The in-plane sealing agent for organic EL display elements of Comparative Examples 1 to 5 was produced.
- “X22-163” is a compound represented by the following formula (5).
- Viscosity Each of the in-plane sealing agents for organic EL display elements obtained in Examples and Comparative Examples was measured at 25 ° C. using an E-type viscometer (“VISCOMETER TV-22” manufactured by Toki Sangyo Co., Ltd.). The viscosity was measured under the conditions of 20 rpm.
- the substrate is ultrasonically cleaned with acetone, an aqueous alkaline solution, ion-exchanged water, and isopropyl alcohol for 15 minutes, respectively, and then cleaned with boiled isopropyl alcohol for 10 minutes, and then a UV-ozone cleaner (manufactured by Nippon Laser Electronics Co., Ltd.) The previous treatment was performed with "NL-UV253").
- this substrate is fixed to a substrate holder of a vacuum deposition apparatus, and N, N'-di (1-naphthyl) -N, N'-diphenylbenzidine (.alpha.-NPD) 200 mg in an unglazed pot is the other different 200 mg of tris (8-quinolinolato) aluminum (Alq 3 ) was placed in an unglazed pan and the inside of the vacuum chamber was depressurized to 1 ⁇ 10 ⁇ 4 Pa. Thereafter, the crucible containing ⁇ -NPD was heated, and ⁇ -NPD was deposited on the substrate at a deposition rate of 15 ⁇ / s to form a hole transport layer having a film thickness of 600 ⁇ .
- the crucible containing Alq 3 was heated to form an organic light emitting material layer having a film thickness of 600 ⁇ at a deposition rate of 15 ⁇ / s.
- the substrate on which the hole transport layer and the organic light emitting material layer were formed was transferred to another vacuum deposition apparatus, and 200 mg of lithium fluoride was added to the tungsten resistance heating boat in this vacuum deposition apparatus, and aluminum was used for another tungsten boat. I put a line 1.0g.
- the pressure in the deposition chamber of the vacuum deposition apparatus is reduced to 2 ⁇ 10 -4 Pa, lithium fluoride is deposited 5 ⁇ at a deposition rate of 0.2 ⁇ / s, and aluminum is deposited 1000 ⁇ at a rate of 20 ⁇ / s. did.
- the inside of the vaporizer was returned to normal pressure with nitrogen, and the substrate on which the laminate having the 10 mm ⁇ 10 mm organic light emitting material layer was disposed was taken out.
- a curable resin, a photocationic polymerization initiator, a water absorbing agent, and a silane coupling agent are uniformly mixed at a stirring speed of 3000 rpm using a homodisper type stirring mixer (manufactured by Primix, "homodisper L type")
- the peripheral sealant was prepared by stirring and mixing.
- As the curable resin 65 parts by weight of novolac epoxy resin (manufactured by Dow Chemical Co., "D.E.N.
- silane coupling agent 1.5 parts by weight of 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., “KBM-403”) was used.
- the prepared peripheral sealing agent is applied to the outer periphery of the substrate on which the laminate is disposed so that the line width becomes 6 mm, and the in-plane sealing for each of the organic EL display elements obtained in the examples and comparative examples is performed on the inner side thereof.
- another glass substrate (length 45 mm, width 45 mm, thickness 0.7 mm) was superposed.
- ultraviolet rays having a wavelength of 365 nm are irradiated so that the irradiation amount is 3000 mJ / cm 2, and heating is further performed at 100 ° C. for 30 minutes to cure the in-plane sealing agent and peripheral sealing agent.
- An organic EL display device was produced.
- the in-plane sealing agent for organic EL display elements obtained in Example 4 the in-plane sealing agent and the periphery sealing agent were hardened without heating.
- the organic EL display element used for evaluation of the following "(hardness of in-plane sealing agent)" was produced similarly.
- an in-plane sealing agent for an organic EL display element which is excellent in coatability, wet spreading property, and curability. Further, according to the present invention, it is possible to provide a sealant set for an organic EL display device, which comprises a peripheral sealant and the in-plane sealant for the organic EL display device.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Epoxy Resins (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
以下に本発明を詳述する。
上記硬化性樹脂は、シリコーン骨格を有するシクロアルケンオキシド型脂環式エポキシ化合物を含有する。上記シリコーン骨格を有するシクロアルケンオキシド型脂環式エポキシ化合物を含有することにより、本発明の有機EL表示素子用面内封止剤は、硬化性に優れ、かつ、得られる有機EL表示素子におけるダークスポット等の表示不良を抑制することができるものとなる。
上記他の硬化性樹脂としては、例えば、その他のエポキシ化合物、オキセタン化合物、ビニルエーテル化合物等が挙げられる。
上記その他のエポキシ化合物としては、例えば、下記式(3)で表される化合物、ジシクロペンタジエンジメタノールジグリシジルエーテル、ビスフェノールAジグリシジルエーテル、ビスフェノールFジグリシジルエーテル、水添ビスフェノールAジグリシジルエーテル、水添ビスフェノールFジグリシジルエーテル等が挙げられる。
上記オキセタン化合物としては、例えば、ビス((3-エチルオキセタン-3-イル)メチル)エーテル、フェノキシメチルオキセタン、3-エチル-3-ヒドロキシメチルオキセタン、3-エチル-3-(フェノキシメチル)オキセタン、3-エチル-3-((2-エチルヘキシルオキシ)メチル)オキセタン、3-エチル-3-((3-(トリエトキシシリル)プロポキシ)メチル)オキセタン、オキセタニルシルセスキオキサン、フェノールノボラックオキセタン、1,4-ビス(((3-エチル-3-オキセタニル)メトキシ)メチル)ベンゼン等が挙げられる。
上記ビニルエーテル化合物としては、例えば、ベンジルビニルエーテル、シクロヘキサンジメタノールモノビニルエーテル、ジシクロペンタジエンビニルエーテル、1,4-ブタンジオールジビニルエーテル、シクロヘキサンジメタノールジビニルエーテル、ジエチレングリコールジビニルエーテル、トリエチレングリコールジビニルエーテル、ジプロピレングリコールジビニルエーテル、トリプロピレングリコールジビニルエーテル等が挙げられる。
なかでも、硬化性及び低アウトガス性の観点から、下記式(3)で表される化合物が好ましく、下記式(4-1)で表される化合物、下記式(4-2)で表される化合物がより好ましい。
上記カチオン重合開始剤としては、加熱によりプロトン酸又はルイス酸を発生する熱カチオン重合開始剤や、光照射によりプロトン酸又はルイス酸を発生する光カチオン重合開始剤が挙げられ、イオン性酸発生型であってもよいし、非イオン性酸発生型であってもよい。
上記ホスホニウム塩としては、エチルトリフェニルホスホニウム六フッ化アンチモン、テトラブチルホスホニウム六フッ化アンチモン等が挙げられる。
上記第4級アンモニウム塩としては、例えば、ジメチルフェニル(4-メトキシベンジル)アンモニウムヘキサフルオロホスフェート、ジメチルフェニル(4-メトキシベンジル)アンモニウムヘキサフルオロアンチモネート、ジメチルフェニル(4-メトキシベンジル)アンモニウムテトラキス(ペンタフルオロフェニル)ボレート、ジメチルフェニル(4-メチルベンジル)アンモニウムヘキサフルオロホスフェート、ジメチルフェニル(4-メチルベンジル)アンモニウムヘキサフルオロアンチモネート、ジメチルフェニル(4-メチルベンジル)アンモニウムヘキサフルオロテトラキス(ペンタフルオロフェニル)ボレート、メチルフェニルジベンジルアンモニウム、メチルフェニルジベンジルアンモニウムヘキサフルオロアンチモネートヘキサフルオロホスフェート、メチルフェニルジベンジルアンモニウムテトラキス(ペンタフルオロフェニル)ボレート、フェニルトリベンジルアンモニウムテトラキス(ペンタフルオロフェニル)ボレート、ジメチルフェニル(3,4-ジメチルベンジル)アンモニウムテトラキス(ペンタフルオロフェニル)ボレート、N,N-ジメチル-N-ベンジルアニリニウム六フッ化アンチモン、N,N-ジエチル-N-ベンジルアニリニウム四フッ化ホウ素、N,N-ジメチル-N-ベンジルピリジニウム六フッ化アンチモン、N,N-ジエチル-N-ベンジルピリジニウムトリフルオロメタンスルホン酸等が挙げられる。
上記三新化学工業社製の熱カチオン重合開始剤としては、例えば、サンエイドSI-60、サンエイドSI-80、サンエイドSI-B3、サンエイドSI-B3A、サンエイドSI-B4等が挙げられる。
上記King Industries社製の熱カチオン重合開始剤としては、例えば、CXC-1612、CXC-1738、CXC-1821等が挙げられる。
上記イオン性光酸発生型の光カチオン重合開始剤としては、例えば、上記アニオン部分を有する、芳香族スルホニウム塩、芳香族ヨードニウム塩、芳香族ジアゾニウム塩、芳香族アンモニウム塩、又は、(2,4-シクロペンタジエン-1-イル)((1-メチルエチル)ベンゼン)-Fe塩等が挙げられる。
上記みどり化学社製の光カチオン重合開始剤としては、例えば、DTS-200等が挙げられる。
上記ユニオンカーバイド社製の光カチオン重合開始剤としては、例えば、UVI6990、UVI6974等が挙げられる。
上記ADEKA社製の光カチオン重合開始剤としては、例えば、SP-150、SP-170等が挙げられる。
上記3M社製の光カチオン重合開始剤としては、例えば、FC-508、FC-512等が挙げられる。
上記BASF社製の光カチオン重合開始剤としては、例えば、IRGACURE290等が挙げられる。
上記ローディア社製の光カチオン重合開始剤としては、例えば、PI2074等が挙げられる。
上記アントラセン系化合物としては、例えば、9,10-ジブトキシアントラセン等が挙げられる。
上記チオキサントン系化合物としては、例えば、2,4-ジエチルチオキサントン等が挙げられる。
上記熱硬化剤としては、例えば、ヒドラジド化合物、イミダゾール誘導体、酸無水物、ジシアンジアミド、グアニジン誘導体、変性脂肪族ポリアミン、各種アミンとエポキシ樹脂との付加生成物等が挙げられる。
上記イミダゾール誘導体としては、例えば、1-シアノエチル-2-フェニルイミダゾール、N-(2-(2-メチル-1-イミダゾリル)エチル)尿素、2,4-ジアミノ-6-(2’-メチルイミダゾリル-(1’))-エチル-s-トリアジン、N,N’-ビス(2-メチル-1-イミダゾリルエチル)尿素、N,N’-(2-メチル-1-イミダゾリルエチル)-アジポアミド、2-フェニル-4-メチル-5-ヒドロキシメチルイミダゾール、2-フェニル-4,5-ジヒドロキシメチルイミダゾール等が挙げられる。
上記酸無水物としては、例えば、テトラヒドロ無水フタル酸、エチレングリコールビス(アンヒドロトリメリテート)等が挙げられる。
これらの熱硬化剤は、単独で用いられてもよいし、2種以上が併用されてもよい。
上記日本ファインケム社製の熱硬化剤としては、例えば、SDH等が挙げられる。
上記大塚化学社製の熱硬化剤としては、例えば、ADH等が挙げられる。
上記味の素ファインテクノ社製の熱硬化剤としては、例えば、アミキュアVDH、アミキュアVDH-J、アミキュアUDH等が挙げられる。
上記表面改質剤としては、例えば、界面活性剤やレベリング剤等が挙げられる。
上記表面改質剤のうち市販されているものとしては、例えば、ビックケミー・ジャパン社製の表面改質剤、楠本化成社製の表面改質剤、AGCセイミケミカル社製の表面改質剤等が挙げられる。
上記ビックケミー・ジャパン社製の表面改質剤としては、例えば、BYK-300、BYK-302、BYK-331等が挙げられる。
上記楠本化成社製の表面改質剤としては、例えば、UVX-272等が挙げられる。
上記AGCセイミケミカル社製の表面改質剤としては、例えば、サーフロンS-611等が挙げられる。
なお、上記E型粘度計としては、例えば、VISCOMETER TV-22(東機産業社製)を用いることができ、CP1のコーンプレートにて測定することができる。
なお、本明細書において、上記表面張力は、25℃において動的濡れ性試験機により測定することができる。
有機EL表示素子の封止に用いる有機EL表示素子用封止剤セットであって、有機EL表示素子の周辺部を封止する周辺封止剤と、該周辺封止剤の内側において有機発光材料層を有する積層体を被覆して封止する面内封止剤とからなり、上記周辺封止剤は、硬化性樹脂と重合開始剤と水分吸収剤とを含有し、上記面内封止剤は、本発明の有機EL表示素子用面内封止剤である有機EL表示素子用封止剤セットもまた、本発明の1つである。
上記周辺封止剤に用いられる硬化性樹脂としては、エポキシ基、オキセタニル基、ビニルエーテル基等のカチオン重合性基を有するカチオン重合性化合物や、(メタ)アクリロイル基等のラジカル重合性基を有するラジカル重合性化合物が挙げられる。
上記(メタ)アクリル化合物としては、例えば、エポキシ(メタ)アクリレート、(メタ)アクリル酸エステル化合物、ウレタン(メタ)アクリレート等が挙げられる。なかでも、エポキシ(メタ)アクリレートが好ましい。
なお、本明細書において、上記「(メタ)アクリル」とは、アクリル又はメタクリルを示し、上記「(メタ)アクリレート」とは、アクリレート又はメタクリレートを示し、上記「エポキシ(メタ)アクリレート」とは、エポキシ樹脂中の全てのエポキシ基を(メタ)アクリル酸と反応させた化合物のことを表す。
上記ダイセル・オルネクス社製のエポキシ(メタ)アクリレートとしては、例えば、EBECRYL860、EBECRYL3200、EBECRYL3201、EBECRYL3412、EBECRYL3600、EBECRYL3700、EBECRYL3701、EBECRYL3702、EBECRYL3703、EBECRYL3708、EBECRYL3800、EBECRYL6040、EBECRYL RDX63182等が挙げられる。
上記新中村化学工業社製のエポキシ(メタ)アクリレートとしては、例えば、EA-1010、EA-1020、EA-5323、EA-5520、EA-CHD、EMA-1020等が挙げられる。
上記共栄社化学社製のエポキシ(メタ)アクリレートとしては、例えば、エポキシエステルM-600A、エポキシエステル40EM、エポキシエステル70PA、エポキシエステル200PA、エポキシエステル80MFA、エポキシエステル3002M、エポキシエステル3002A、エポキシエステル1600A、エポキシエステル3000M、エポキシエステル3000A、エポキシエステル200EA、エポキシエステル400EA等が挙げられる。
上記ナガセケムテックス社製のエポキシ(メタ)アクリレートとしては、例えば、デナコールアクリレートDA-141、デナコールアクリレートDA-314、デナコールアクリレートDA-911等が挙げられる。
上記周辺封止剤に用いられる重合開始剤としては、カチオン重合開始剤やラジカル重合開始剤を用いることができる。
上記熱ラジカル重合開始剤のうち市販されているものとしては、例えば、日油社製の熱ラジカル重合開始剤、富士フイルム和光純薬社製の熱ラジカル重合開始剤等が挙げられる。
上記日油社製の熱ラジカル重合開始剤としては、例えば、パーブチルO、パーヘキシルO、パーブチルPV等が挙げられる。
上記富士フイルム和光純薬社製の熱ラジカル重合開始剤としては、例えば、V-30、V-65、V-501、V-601、VPE-0201等が挙げられる。
本発明の有機EL表示素子用封止剤セットは、上記周辺封止剤として上記水分吸収剤を含有するものを用いるが、面内封止剤として本発明の有機EL表示素子用封止剤を用いるため、これらを組み合わせて用いても面内封止剤を充分に硬化させることができ、得られる有機EL表示素子における表示不良の発生を抑制することができる。
また、上記水分吸収剤の吸水率の好ましい上限は特にないが、実質的な上限は50重量%である。
なお、上記「吸水率」は、温度85℃、湿度85%の雰囲気下で24時間放置する高温高湿試験を行った場合における重量の変化率を意味する。具体的には、高温高湿試験(85℃-85%、24時間)前の重量をW1、高温高湿試験後の重量をW2とした場合、下記式(I)により算出される。
吸水率(重量%)=((W2-W1)/W1)×100 (I)
上記その他のフィラーとしては、例えば、シリカ、タルク、アルミナ等の無機フィラーや、ポリエステル微粒子、ポリウレタン微粒子、ビニル重合体微粒子、アクリル重合体微粒子等の有機フィラー等が挙げられる。なかでも、タルクが好ましい。
なお、上記周辺封止剤の粘度は、例えば、E型粘度計としてVISCOMETER TV-22(東機産業社製)を用い、CP1のコーンプレートにて、各粘度領域における最適なトルク数から適宜1~100rpmの回転数を選択することにより測定することができる。
表1~3に記載された配合比に従い、各材料を、撹拌混合機(シンキー社製、「AR-250」)を用い、撹拌速度3000rpmで均一に撹拌混合して、実施例1~8、比較例1~5の有機EL表示素子用面内封止剤を作製した。
なお、表中における「X22-163」は、下記式(5)で表される化合物である。
実施例及び比較例で得られた各有機EL表示素子用面内封止剤について以下の評価を行った。結果を表1~3に示した。
実施例及び比較例で得られた各有機EL表示素子用面内封止剤について、E型粘度計(東機産業社製、「VISCOMETER TV-22」)を用いて、25℃、20rpmの条件における粘度を測定した。
ピペットを用いて実施例及び比較例で得られた各有機EL表示素子用面内封止剤0.1mLをガラス基板上に塗布し、1分後に広がった直径を測定した。直径が15mm以上であった場合を「○」、10mm以上15mm未満であった場合を「△」、10mm未満であった場合を「×」として、濡れ広がり性を評価した。
実施例及び比較例で得られた各有機EL表示素子用面内封止剤を、異なる大きさの孔を有するガラス基板上に塗布した。その結果、2μmの大きさの孔にも封止剤がしみ込まなかった場合を「○」、0.5μmの大きさの孔にはしみ込みが確認されなかったが2μmの大きさの孔にはしみ込みが確認された場合を「△」、0.5μmの大きさの孔でもしみ込みが確認された場合を「×」として、しみ込み防止性を評価した。
実施例及び比較例で得られた各有機EL表示素子用面内封止剤を、バイアル瓶中に300mg計量して封入した後、100℃で30分間加熱を行うことで硬化させた。更に、このバイアル瓶を85℃の恒温オーブンで100時間加熱し、バイアル瓶中の気化成分を、ガスクロマトグラフ質量分析計(日本電子社製、「JMS-Q1050」)を用いて測定した。
気化成分量が50ppm未満であった場合を「○」、50ppm以上100ppm未満であった場合を「△」、100ppm以上であった場合を「×」として低アウトガス性を評価した。
(有機発光材料層を有する積層体が配置された基板の作製)
ガラス基板(長さ45mm、幅45mm、厚さ0.7mm)にITO電極を1000Åの厚さで成膜したものを基板とした。上記基板をアセトン、アルカリ水溶液、イオン交換水、イソプロピルアルコールにてそれぞれ15分間超音波洗浄した後、煮沸させたイソプロピルアルコールにて10分間洗浄し、更に、UV-オゾンクリーナ(日本レーザー電子社製、「NL-UV253」)にて直前処理を行った。
次に、この基板を真空蒸着装置の基板フォルダに固定し、素焼きの坩堝にN,N’-ジ(1-ナフチル)-N,N’-ジフェニルベンジジン(α-NPD)を200mg、他の異なる素焼き坩堝にトリス(8-キノリノラト)アルミニウム(Alq3)を200mg入れ、真空チャンバー内を、1×10-4Paまで減圧した。その後、α-NPDの入った坩堝を加熱し、α-NPDを蒸着速度15Å/sで基板に堆積させ、膜厚600Åの正孔輸送層を成膜した。次いで、Alq3の入った坩堝を加熱し、15Å/sの蒸着速度で膜厚600Åの有機発光材料層を成膜した。その後、正孔輸送層及び有機発光材料層が形成された基板を別の真空蒸着装置に移し、この真空蒸着装置内のタングステン製抵抗加熱ボートにフッ化リチウム200mgを、別のタングステン製ボートにアルミニウム線1.0gを入れた。その後、真空蒸着装置の蒸着器内を2×10-4Paまで減圧してフッ化リチウムを0.2Å/sの蒸着速度で5Å成膜した後、アルミニウムを20Å/sの速度で1000Å成膜した。窒素により蒸着器内を常圧に戻し、10mm×10mmの有機発光材料層を有する積層体が配置された基板を取り出した。
硬化性樹脂と、光カチオン重合開始剤と、水分吸収剤と、シランカップリング剤とを、ホモディスパー型撹拌混合機(プライミクス社製、「ホモディスパーL型」)を用い、撹拌速度3000rpmで均一に撹拌混合することにより、周辺封止剤を調製した。
上記硬化性樹脂としては、ノボラック型エポキシ樹脂(ダウ・ケミカル社製、「D.E.N.431」)65重量部、ビスフェノールF型エポキシ樹脂(DIC社製、「EPICLON EXA-830LVP」)20重量部、及び、ジシクロペンタジエン型エポキシ樹脂(DIC社製、「EPICLON HP-7200」)15重量部を用いた。
上記光カチオン重合開始剤としては、芳香族スルホニウム塩(みどり化学社製、「DTS-200」)1重量部を用いた。
上記水分吸収剤としては、酸化カルシウム(吉沢石灰工業社製、「生石灰J1P」)20重量部を用いた。
上記シランカップリング剤としては、3-グリシドキシプロピルトリメトキシシラン(信越化学工業社製、「KBM-403」)1.5重量部を用いた。
得られた周辺封止剤について、E型粘度計(東機産業社製、「VISCOMETER TV-22」)を用いて、25℃において測定された粘度は、250Pa・sであった。
積層体が配置された基板の外周に、調製した周辺封止剤を線幅が6mmとなるよう塗布し、その内側に実施例及び比較例で得られた各有機EL表示素子用面内封止剤を、積層体全体を覆うように塗布した後、別のガラス基板(長さ45mm、幅45mm、厚さ0.7mm)を重ね合わせた。その後、高圧水銀灯を用いて波長365nmの紫外線を照射量が3000mJ/cm2となるように照射し、更に100℃で30分加熱することで面内封止剤及び周辺封止剤を硬化させて有機EL表示素子を作製した。なお、実施例4で得られた有機EL表示素子用面内封止剤については、加熱を行わずに面内封止剤及び周辺封止剤を硬化させた。また、下記「(面内封止剤の硬化性)」の評価に用いる有機EL表示素子を同様にして作製した。
得られた有機EL表示素子について、周辺封止剤と面内封止剤の界面において面内封止剤の硬化率を測定した。その結果、硬化率が80%以上であった場合を「○」、50%以上80%未満であった場合を「△」、50%未満であった場合を「×」として面内封止剤の硬化性を評価した。
得られた有機EL表示素子を、85℃、85%RHの環境下に1000時間暴露した後、10Vの電圧を印加し、有機EL表示素子の発光状態(ダークスポット及び画素周辺消光の有無)を目視で観察した。ダークスポットや周辺消光が無く均一に発光した場合を「○」、僅かにダークスポットや周辺消光が認められた場合を「△」、非発光部が著しく拡大した場合を「×」として有機EL表示素子の表示性能を評価した。
Claims (6)
- 水分吸収剤を含有する有機EL表示素子用周辺封止剤の内側に塗布して用いられる有機EL表示素子用面内封止剤であって、
硬化性樹脂とカチオン重合開始剤とを含有し、
前記硬化性樹脂は、シリコーン骨格を有するシクロアルケンオキシド型脂環式エポキシ化合物を含有し、
有機EL表示素子用面内封止剤全体における、E型粘度計を用いて、25℃、20rpmの条件で測定した粘度が50mPa・s以上150mPa・s以下である
ことを特徴とする有機EL表示素子用面内封止剤。 - 前記硬化性樹脂100重量部中における前記シリコーン骨格を有するシクロアルケンオキシド型脂環式エポキシ化合物の含有量が20重量部以上70重量部以下である請求項1、2又は3記載の有機EL表示素子用面内封止剤。
- 有機EL表示素子の封止に用いる有機EL表示素子用封止剤セットであって、
有機EL表示素子の周辺部を封止する周辺封止剤と、該周辺封止剤の内側において有機発光材料層を有する積層体を被覆して封止する面内封止剤とからなり、
前記周辺封止剤は、硬化性樹脂と重合開始剤と水分吸収剤とを含有し、
前記面内封止剤は、請求項1、2、3、4又は5記載の有機EL表示素子用面内封止剤である有機EL表示素子用封止剤セット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020197021229A KR102645231B1 (ko) | 2017-06-28 | 2018-06-27 | 유기 el 표시 소자용 면내 봉지제 및 유기 el 표시 소자용 봉지제 세트 |
CN201880011215.XA CN110268802A (zh) | 2017-06-28 | 2018-06-27 | 有机el显示元件用面内密封剂和有机el显示元件用密封剂套件 |
JP2018536305A JP6966454B2 (ja) | 2017-06-28 | 2018-06-27 | 有機el表示素子用面内封止剤及び有機el表示素子用封止剤セット |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017126530 | 2017-06-28 | ||
JP2017-126530 | 2017-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019004241A1 true WO2019004241A1 (ja) | 2019-01-03 |
Family
ID=64742276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2018/024279 WO2019004241A1 (ja) | 2017-06-28 | 2018-06-27 | 有機el表示素子用面内封止剤及び有機el表示素子用封止剤セット |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6966454B2 (ja) |
KR (1) | KR102645231B1 (ja) |
CN (1) | CN110268802A (ja) |
TW (1) | TW201905027A (ja) |
WO (1) | WO2019004241A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009298887A (ja) * | 2008-06-11 | 2009-12-24 | Sekisui Chem Co Ltd | 光学部品用硬化性組成物 |
JP2010140915A (ja) * | 2010-03-19 | 2010-06-24 | Sony Corp | 表示装置及びその製造方法 |
WO2016167347A1 (ja) * | 2015-04-17 | 2016-10-20 | 積水化学工業株式会社 | 電子デバイス用封止剤及び電子デバイスの製造方法 |
JP2018111792A (ja) * | 2016-10-07 | 2018-07-19 | パナソニックIpマネジメント株式会社 | 紫外線硬化性樹脂組成物、有機el発光装置の製造方法及び有機el発光装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6098091B2 (ja) | 2012-09-26 | 2017-03-22 | 凸版印刷株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
WO2015064410A1 (ja) * | 2013-10-30 | 2015-05-07 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
JP5966113B1 (ja) * | 2015-02-13 | 2016-08-10 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
WO2016136715A1 (ja) * | 2015-02-24 | 2016-09-01 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
-
2018
- 2018-06-27 KR KR1020197021229A patent/KR102645231B1/ko active IP Right Grant
- 2018-06-27 WO PCT/JP2018/024279 patent/WO2019004241A1/ja active Application Filing
- 2018-06-27 JP JP2018536305A patent/JP6966454B2/ja active Active
- 2018-06-27 CN CN201880011215.XA patent/CN110268802A/zh active Pending
- 2018-06-28 TW TW107122324A patent/TW201905027A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009298887A (ja) * | 2008-06-11 | 2009-12-24 | Sekisui Chem Co Ltd | 光学部品用硬化性組成物 |
JP2010140915A (ja) * | 2010-03-19 | 2010-06-24 | Sony Corp | 表示装置及びその製造方法 |
WO2016167347A1 (ja) * | 2015-04-17 | 2016-10-20 | 積水化学工業株式会社 | 電子デバイス用封止剤及び電子デバイスの製造方法 |
JP2018111792A (ja) * | 2016-10-07 | 2018-07-19 | パナソニックIpマネジメント株式会社 | 紫外線硬化性樹脂組成物、有機el発光装置の製造方法及び有機el発光装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201905027A (zh) | 2019-02-01 |
JP6966454B2 (ja) | 2021-11-17 |
JPWO2019004241A1 (ja) | 2020-04-23 |
KR102645231B1 (ko) | 2024-03-07 |
KR20200021442A (ko) | 2020-02-28 |
CN110268802A (zh) | 2019-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5966113B1 (ja) | 有機エレクトロルミネッセンス表示素子用封止剤 | |
JP2020024938A (ja) | 硬化性組成物及び有機エレクトロルミネッセンス表示素子用封止剤 | |
JPWO2018030232A1 (ja) | 硬化性樹脂組成物及び有機エレクトロルミネッセンス表示素子用封止剤 | |
JP6527390B2 (ja) | 有機エレクトロルミネッセンス表示素子用封止剤 | |
JP6378450B2 (ja) | 有機エレクトロルミネッセンス表示素子用封止剤 | |
JP2019147963A (ja) | 有機エレクトロルミネッセンス表示素子用封止剤 | |
WO2020149359A1 (ja) | 有機el表示素子用封止剤セット及び有機el表示素子 | |
JP2011021183A (ja) | 光硬化性樹脂組成物、有機エレクトロルミネッセンス表示素子用封止剤、及び、有機エレクトロルミネッセンス表示素子 | |
WO2021002379A1 (ja) | 有機el表示素子用封止剤セット及び有機el表示素子 | |
JP6966454B2 (ja) | 有機el表示素子用面内封止剤及び有機el表示素子用封止剤セット | |
KR102340967B1 (ko) | 유기 일렉트로 루미네선스 표시 소자용 봉지제 | |
WO2020196479A1 (ja) | 樹脂組成物及び有機el表示素子用周辺封止剤 | |
JPWO2019203180A1 (ja) | 有機el表示素子用封止剤 | |
WO2021002375A1 (ja) | 有機el表示素子用封止剤 | |
WO2020149363A1 (ja) | 有機el表示素子封止用樹脂組成物、硬化物、及び、有機el表示素子 | |
WO2020149360A1 (ja) | 硬化物及び有機el表示素子 | |
WO2020149362A1 (ja) | 硬化物及び有機el表示素子 | |
WO2020149358A1 (ja) | 有機el表示素子封止用樹脂組成物、硬化物、及び、有機el表示素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2018536305 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18824336 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20197021229 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18824336 Country of ref document: EP Kind code of ref document: A1 |