JP6374189B2 - ダイボンダ及びボンディング方法 - Google Patents

ダイボンダ及びボンディング方法 Download PDF

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JP6374189B2
JP6374189B2 JP2014053699A JP2014053699A JP6374189B2 JP 6374189 B2 JP6374189 B2 JP 6374189B2 JP 2014053699 A JP2014053699 A JP 2014053699A JP 2014053699 A JP2014053699 A JP 2014053699A JP 6374189 B2 JP6374189 B2 JP 6374189B2
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die
driven body
bonding
processing operation
vibration
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JP2015177110A (ja
JP2015177110A5 (enExample
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良彦 大堀
良彦 大堀
谷　由貴夫
由貴夫 谷
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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JP2014053699A 2014-03-17 2014-03-17 ダイボンダ及びボンディング方法 Active JP6374189B2 (ja)

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JP2014053699A JP6374189B2 (ja) 2014-03-17 2014-03-17 ダイボンダ及びボンディング方法

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JP2015177110A JP2015177110A (ja) 2015-10-05
JP2015177110A5 JP2015177110A5 (enExample) 2017-03-23
JP6374189B2 true JP6374189B2 (ja) 2018-08-15

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Publication number Priority date Publication date Assignee Title
JP7102113B2 (ja) * 2017-09-11 2022-07-19 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US11172600B2 (en) * 2017-09-29 2021-11-09 Shinkawa Ltd. Mounting device
KR102037972B1 (ko) * 2018-05-30 2019-10-29 세메스 주식회사 다이 본딩 방법
JP7161870B2 (ja) * 2018-06-27 2022-10-27 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法
JP7128697B2 (ja) * 2018-09-19 2022-08-31 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN117080127B (zh) * 2023-10-11 2024-01-05 江苏快克芯装备科技有限公司 芯片吸取异常检测装置及检测方法

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JP3216300B2 (ja) * 1993-01-30 2001-10-09 ソニー株式会社 ヘッド部と突き上げ部を有する設備の状態確認方法
JP5713787B2 (ja) * 2011-04-28 2015-05-07 芝浦メカトロニクス株式会社 電子部品の実装装置
JP5771847B2 (ja) * 2011-09-27 2015-09-02 Ｊｕｋｉオートメーションシステムズ株式会社 実装装置、電子部品の実装方法、基板の製造方法及びプログラム

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