JP6371122B2 - パワー半導体装置および樹脂封止型モータ - Google Patents

パワー半導体装置および樹脂封止型モータ Download PDF

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Publication number
JP6371122B2
JP6371122B2 JP2014117042A JP2014117042A JP6371122B2 JP 6371122 B2 JP6371122 B2 JP 6371122B2 JP 2014117042 A JP2014117042 A JP 2014117042A JP 2014117042 A JP2014117042 A JP 2014117042A JP 6371122 B2 JP6371122 B2 JP 6371122B2
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Japan
Prior art keywords
chip
size
electrode pad
semiconductor device
power semiconductor
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JP2014117042A
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English (en)
Japanese (ja)
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JP2015230990A (ja
JP2015230990A5 (https=
Inventor
河野　賢哉
賢哉 河野
健司 桜井
健司 桜井
太輔 磯部
太輔 磯部
智之 内海
智之 内海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
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Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
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Priority to JP2014117042A priority Critical patent/JP6371122B2/ja
Publication of JP2015230990A publication Critical patent/JP2015230990A/ja
Publication of JP2015230990A5 publication Critical patent/JP2015230990A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Inverter Devices (AREA)
JP2014117042A 2014-06-05 2014-06-05 パワー半導体装置および樹脂封止型モータ Active JP6371122B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014117042A JP6371122B2 (ja) 2014-06-05 2014-06-05 パワー半導体装置および樹脂封止型モータ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014117042A JP6371122B2 (ja) 2014-06-05 2014-06-05 パワー半導体装置および樹脂封止型モータ

Publications (3)

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JP2015230990A JP2015230990A (ja) 2015-12-21
JP2015230990A5 JP2015230990A5 (https=) 2017-04-13
JP6371122B2 true JP6371122B2 (ja) 2018-08-08

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11626221B2 (en) 2021-06-16 2023-04-11 Fuji Electric Co., Ltd. Resistance element and its manufacturing method
US20240112996A1 (en) * 2019-10-24 2024-04-04 Rohm Co., Ltd. Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7290960B2 (ja) * 2019-03-11 2023-06-14 ローム株式会社 半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134862U (ja) * 1991-06-04 1992-12-15 沖電気工業株式会社 混成集積回路装置
JPH06181286A (ja) * 1992-12-14 1994-06-28 Toshiba Corp 半導体装置
US5977640A (en) * 1998-06-26 1999-11-02 International Business Machines Corporation Highly integrated chip-on-chip packaging
JP3503133B2 (ja) * 1999-12-10 2004-03-02 日本電気株式会社 電子デバイス集合体と電子デバイスの接続方法
JP3815933B2 (ja) * 1999-12-10 2006-08-30 ローム株式会社 半導体装置及びその製造方法
JP2002170920A (ja) * 2000-12-04 2002-06-14 Nec Eng Ltd フリップチップ装置
JP3723869B2 (ja) * 2001-03-30 2005-12-07 株式会社日立製作所 半導体装置
JP2003152158A (ja) * 2001-11-09 2003-05-23 Matsushita Electric Ind Co Ltd 半導体素子を実装した電子部品及びその製造方法
JP2003258197A (ja) * 2002-03-07 2003-09-12 Seiko Instruments Inc 半導体装置
JP2003319615A (ja) * 2002-04-23 2003-11-07 Matsushita Electric Ind Co Ltd モールド型モータ
JP2004146728A (ja) * 2002-10-28 2004-05-20 Sony Corp 半導体装置とその製造方法
JP5966287B2 (ja) * 2011-09-15 2016-08-10 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240112996A1 (en) * 2019-10-24 2024-04-04 Rohm Co., Ltd. Semiconductor device
US11626221B2 (en) 2021-06-16 2023-04-11 Fuji Electric Co., Ltd. Resistance element and its manufacturing method

Also Published As

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JP2015230990A (ja) 2015-12-21

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