JP6363097B2 - 単結晶複合材料を使用した集束回転ivusトランスデューサ - Google Patents
単結晶複合材料を使用した集束回転ivusトランスデューサ Download PDFInfo
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Description
本発明は、一般に、生体内部での血管内超音波(IVUS)画像化に関し、特に、トランスデューサが単結晶複合材料を含む実施形態を含めて、機械的走査超音波トランスデューサに依存するIVUS画像化カテーテルに関する。
血管内超音波(IVUS)画像化は、治療の必要性を決定し、インターベンションを案内し、及び/又はその有効性を評価するために、ヒトの体内における動脈など罹患血管の診断ツールとして心臓インターベンションで広く使用されている。IVUS画像化は、超音波エコーを使用して関心のある血管の画像を生成する。超音波は、大部分の組織及び血液を容易に通過するが、組織構造(血管壁の様々な層など)、赤血球及び関心のある他の特徴により生じる不連続性によって部分的に反射する。患者インターフェースモジュール(PIM)によってIVUSカテーテルに接続されるIVUS画像化システムは、受信された超音波エコーを処理して、カテーテルが配置されている血管の断面画像を生成する。
いくつかの実施形態によれば、血管内超音波(IVUS)画像化システムで使用するための超音波トランスデューサが提供され、このものは、単結晶複合体(SCC)層と、該SCC層の一方の側にある前面電極と、該SCC層の反対側にある背面電極とを備える。いくつかの実施形態では、SCC層は、単結晶圧電材料からなるピラーを備える。ピラーは、いくつかの例では重合体マトリックス中に埋め込まれている。SCC層は、いくつかの実施形態では、凹面及び対向する凸面によって画定された皿形状を有する。背面電極は、いくつかの例では互いに電気的に分離した2個の電極に分割される。
本発明の原理の理解を進める目的で、図面に示された実施形態を参照し、特定の用語を同じものを説明するために使用する。それにもかかわらず、本発明の範囲の限定を意図するものではないことが分かるであろう。説明する装置、システム及び方法の任意の変更及びさらなる改変、並びに本発明の原理のさらなる適用が完全に意図され、かつ、本発明の範囲内に含まれる。この開示が関連する当業者であれば通常思いつくと考えられるからである。特に、一実施形態に関して説明した特徴、構成要素及び/又は工程を、本発明の他の実施形態に関して説明した特徴、構成要素及び/又は工程と組み合わせることができることが完全に意図される。しかしながら、単純化のため、これらの組み合わせの多数の反復は別々には説明しない。
102 回転IVUSカテーテル
104 患者インターフェースモジュール(PIM)
106 IVUSコンソール
108 モニタ
110 イメージングコア
112 外側カテーテル/シースアセンブリ
114 回転インターフェース
116 ハウジング
118 ハブ
120 ルアーロックフラッシュポート
122 テレスコープ
124 窓
126 近位シャフト
128 開口
130 超音波ビーム
132 可撓性ドライブシャフト
134 電気ケーブル
148 成形バッキング
150 超音波トランスデューサ
151 背面電極
152 前面電極
301 単結晶圧電材料
310 インピーダンス整合層
320 圧電体
330 重合体マトリックス
506 ボンディングパッド
507 ボンディングパッド
620 ピラー
630 重合体マトリックス
650 切欠経路
Claims (17)
- 長手方向をY方向とする円筒状の細長い部材を含む血管内超音波(IVUS)画像化システムにおいて、前記細長い部材に配置されて使用される超音波トランスデューサであって、
単結晶複合体(SCC)層と、
該SCC層の一方側にある前面電極と、
該SCC層の反対側にある背面電極と
を備え、
該SCC層が単結晶圧電材料からなるピラーを備え、
該ピラーが重合体マトリックス中に埋め込まれており、しかも
該SCC層が凹状上部表面及び対向する凸状下部表面を有し、
前記凹状上部表面及び前記凸状下部表面がZ方向に積層されており、
前記凹状上部表面の湾曲半径が、前記SCC層のXZ平面内とYZ平面内とにおいて異なる、超音波トランスデューサ。 - 前記トランスデューサによって送信される超音波信号の中心周波数の1/4波長の厚さのインピーダンス整合層をさらに備える、請求項1に記載の超音波トランスデューサ。
- 前記ピラーが0.6以下の幅対高さのアスペクト比を有する、請求項1に記載の超音波トランスデューサ。
- 前記ピラーが50μm以下の厚さを有する、請求項1に記載の超音波トランスデューサ。
- 前記ピラーが前記SCC層の表面積の25%の面積をカバーする、請求項1に記載の超音波トランスデューサ。
- 前記ピラーが円形、正方形、長方形及びランダムパターンからの図形よりなる群から選択される形状を有する前記SCC層の表面上の断面を有する、請求項1に記載の超音波トランスデューサ。
- 前記背面電極が互いに電気的に切り離された2個の電極に分割されている、請求項1に記載の超音波トランスデューサ。
- 長手方向をY方向とする円筒状の細長い部材を含むIVUS画像化システムにおいて、前記細長い部材に配置されて使用される超音波トランスデューサを形成する方法であって、
単結晶をエッチングし;
該エッチングされた単結晶材料上にあるピラー間の溝に重合体充填材料を充填させ;
該充填結晶の第1表面上の過剰の材料を除去し;
該充填結晶の第1側に第1電極を配置し;
該充填結晶の第2表面上の過剰の材料を除去して、所望の厚さの単結晶複合体(SCC)層を残し;
該SCCの第2側に第2電極を配置し;そして
該SCCを成形先端部に配置すること
を含み、
前記SCCを成形先端部上に配置することが、該SCCを凹形状に成形して、該SCCに凹状上部表面及び対向する凸状下部表面を形成することを含み、
前記凹状上部表面及び前記凸状下部表面がZ方向に積層されており、
前記凹状上部表面の湾曲半径が、前記SCC層のXZ平面内とYZ平面内とにおいて異なる方法。 - 前記SCC層上に音響インピーダンス整合層を形成することをさらに含み、該音響インピーダンス整合層は、前記トランスデューサによって送信された超音波信号の中心周波数の1/4波長の厚さを有する、請求項8に記載の方法。
- 前記凹形状を成形することが球体の部分を成形することを含み、該部分は20μmの深さを有する、請求項8に記載の方法。
- 前記SCCを成形先端部上に配置することが、開口部を形成することを含む、請求項8に記載の方法。
- IVUS画像化システムであって、
長手方向をY方向とする円筒状の細長い部材内に回転自在に配置された超音波エミッタ及びレシーバと、
該超音波エミッタに連結されたアクチュエータであって、該超音波エミッタを弧の少なくとも一部を介して移動させるものと、
該超音波エミッタからの一連のパルスの放出を制御し、かつ、該パルスに関連したレシーバ超音波エコーデータから受信する制御システムであって、該超音波エコーデータを処理して血管の断面画像を生成するものと
を備え、
該超音波エミッタ及びレシーバは、前記細長い部材に配置される超音波トランスデューサを備え、該超音波トランスデューサは、
単結晶複合体(SCC)層と、
前面電極と、
背面電極と
を備え、
該SCC層は、単結晶圧電材料からなるピラーを備え、
該ピラーは、重合体マトリックス中に埋め込まれており、しかも
該SCC層は、凹面及び対向する凸面を有し、
前記凹面及び前記凸面はZ方向に積層されており、
前記凹面の湾曲半径は、前記SCC層のXZ平面内とYZ平面内とにおいて異なる、IVUS画像化システム。 - 前記超音波トランスデューサが前記細長い装置の遠位部分内に配置され、かつ、該細長い装置の本体に対して回転可能である、請求項12に記載のIVUS画像化システム。
- 前記アクチュエータがモータを備え、かつ、ドライブシャフトを介して前記超音波トランスデューサに連結されている、請求項12に記載のIVUS画像化システム。
- 前記超音波トランスデューサの作動を制御して画像化を容易にするように構成された制御システムをさらに備える、請求項12に記載のIVUS画像化システム。
- 前記制御システムと通信状態にあるディスプレイをさらに備える、請求項12に記載のIVUS画像化システム。
- 前記細長い装置がカテーテルである、請求項12に記載のIVUS画像化システム。
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EP2934329B1 (en) | 2018-06-13 |
JP6396319B2 (ja) | 2018-09-26 |
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WO2014099955A1 (en) | 2014-06-26 |
WO2014100690A1 (en) | 2014-06-26 |
US20140180128A1 (en) | 2014-06-26 |
US20140180123A1 (en) | 2014-06-26 |
CA2895821A1 (en) | 2014-06-26 |
JP2016507273A (ja) | 2016-03-10 |
US20220022845A1 (en) | 2022-01-27 |
US20160228094A1 (en) | 2016-08-11 |
CA2896114A1 (en) | 2014-06-26 |
EP2934329A4 (en) | 2016-08-10 |
EP2934337A1 (en) | 2015-10-28 |
US9345450B2 (en) | 2016-05-24 |
US11141134B2 (en) | 2021-10-12 |
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US11998389B2 (en) | 2024-06-04 |
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