JP6361730B2 - 電子装置、電子装置の製造方法、一体型モジュール、情報処理システム - Google Patents
電子装置、電子装置の製造方法、一体型モジュール、情報処理システム Download PDFInfo
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Description
本願の開示する技術の第一実施形態を説明する。
次に、本願の開示する技術の第二実施形態を説明する。
次に、本願の開示する技術の第三実施形態を説明する。
次に、本願の開示する技術の第四実施形態を説明する。
次に、本願の開示する技術の第五実施形態を説明する。
次に、本願の開示する技術の第六実施形態を説明する。
次に、本願の開示する技術の第七実施形態を説明する。
次に、本願の開示する技術の第八実施形態を説明する。
図42に示される第一適用例において、情報処理システム170は、マンホール176の構造体(蓋178やコンクリート管179)の劣化を把握するために利用される。センサ163は、マンホール176内の温度、湿度、及び、マンホール176の構造体に作用する振動(加速度)等を検出し、センサ163で検出されたデータは、メモリ165に蓄積される。
次に、第八実施形態の第二適用例を説明する。
次に、第八実施形態の第三適用例を説明する。
次に、第八実施形態の第四適用例を説明する。
次に、第八実施形態の第五適用例を説明する。
Claims (13)
- 電子部品と、
樹脂で形成され、前記電子部品を封止する本体部と、
前記樹脂よりも熱伝導率が高い材料で形成されて前記本体部を覆う放熱シートと、
を備え、
前記放熱シートは、フィンと、被接続部とを有し、
前記被接続部は、前記本体部に封止された接続部材を介して前記電子部品と熱的に接続されている、
電子装置。 - 前記樹脂で形成され、前記フィンの頂部の少なくとも一部を覆う保護部をさらに備える、
請求項1に記載の電子装置。 - 前記保護部は、前記フィンにおける頂部側に設けられ、
前記フィンの側面部において、前記保護部よりも前記フィンの基端部側の部分は、露出されている、
請求項2に記載の電子装置。 - 前記放熱シートは、更に、前記フィンの頂部と異なる位置同士で熱的に接続された他のフィンを有し、
前記フィン及び前記他のフィンは、それぞれ前記フィンと前記他のフィンとが並ぶ方向と交差する方向を長手方向として延び、
前記フィンの頂部には、連通口が形成され、
前記本体部と前記保護部とは、前記連通口に形成された連結部を介して一体に形成されている、
請求項2又は請求項3に記載の電子装置。 - 前記放熱シートは、更に、前記フィンの頂部と異なる位置同士で熱的に接続された他のフィンを有し、
前記樹脂で形成され、前記フィンと前記他のフィンとの間に形成された溝の底部における少なくとも一部を覆う被覆部をさらに備える、
請求項2〜請求項4のいずれか一項に記載の電子装置。 - 前記被覆部は、前記溝における底部側に設けられ、
前記フィンの側面部において前記被覆部と前記保護部との間の部分は、露出されている、
請求項5に記載の電子装置。 - 前記フィンは、前記フィンと前記他のフィンが並ぶ方向と交差する方向を長手方向として延び、
前記フィンと前記他のフィンとの間の溝は、開口を有し、
前記放熱シートの前記長手方向の長さは、前記本体部の前記長手方向の長さよりも短い、
請求項5又は請求項6に記載の電子装置。 - 前記底部は、前記溝の深さ方向において前記被接続部よりも低い位置にある、
請求項7に記載の電子装置。 - 前記樹脂で形成され前記本体部を含む樹脂部の表面における少なくとも一部には、防汚処理が施されている、
請求項1〜請求項8のいずれか一項に記載の電子装置。 - 前記電子部品は、前記電子部品を挟み前記放熱シートの反対側に設けた設置対象物と熱的に接続される熱電素子である、
請求項1〜請求項9のいずれか一項に記載の電子装置。 - 金型内に電子部品及び接続部材を収容すると共に、電子装置の本体部を形成する樹脂よりも熱伝導率が高い材料で形成され、フィンと、被接続部とを有する放熱シートを前記金型内に収容して、前記接続部材を介して前記被接続部を前記電子部品と熱的に接続し、
前記金型内に前記樹脂を充填して、前記電子部品及び前記接続部材を封止する前記本体部を形成すると共に、前記本体部と前記本体部を覆う前記放熱シートとを一体化する、
ことを含む電子装置の製造方法。 - 設置対象物と熱的に接続する熱電素子を含む電力供給部と、
樹脂で形成され、前記熱電素子を封止する本体部と、
前記樹脂よりも熱伝導率が高い材料で形成されて前記本体部を覆う放熱シートと、
前記電力供給部の電力を利用して作動する検出部と、
前記電力供給部の電力を利用して作動し、前記検出部によって検出されたデータを送信する通信部と、
を備え、
前記放熱シートは、フィンと、被接続部とを有し、
前記被接続部は、前記本体部に封止された接続部材を介して前記熱電素子と熱的に接続されている、
一体型モジュール。 - 一体型モジュールと、
前記一体型モジュールから送信されたデータを受信するサーバと、
を備え、
前記一体型モジュールは、
設置対象物と熱的に接続する熱電素子を含む電力供給部と、
樹脂で形成され、前記熱電素子を封止する本体部と、
前記樹脂よりも熱伝導率が高い材料で形成されて前記本体部を覆う放熱シートと、
前記電力供給部の電力を利用して作動する検出部と、
前記電力供給部の電力を利用して作動し、前記検出部によって検出されたデータを送信する通信部と、
を備え、
前記放熱シートは、フィンと、被接続部とを有し、
前記被接続部は、前記本体部に封止された接続部材を介して前記熱電素子と熱的に接続されている、
情報処理システム。
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PCT/JP2014/068498 WO2016006089A1 (ja) | 2014-07-10 | 2014-07-10 | 放熱部品、放熱部品の製造方法、電子装置、電子装置の製造方法、一体型モジュール、情報処理システム |
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EP (1) | EP3168867B1 (ja) |
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WO2022210553A1 (ja) * | 2021-03-29 | 2022-10-06 | 株式会社AmaterZ | 通信装置及び電源装置 |
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US10159165B2 (en) | 2017-02-02 | 2018-12-18 | Qualcomm Incorporated | Evaporative cooling solution for handheld electronic devices |
KR102072577B1 (ko) * | 2017-12-07 | 2020-02-03 | 엘지이노텍 주식회사 | 열전 모듈 |
CN109445537A (zh) * | 2018-11-05 | 2019-03-08 | 英业达科技有限公司 | 服务器及其防震结构 |
CN112261836B (zh) * | 2020-10-15 | 2023-03-28 | 甘肃尔美科技有限公司 | 一种消防物联网数据采集模块装置 |
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JP2012174767A (ja) * | 2011-02-18 | 2012-09-10 | Kyoshin Kogyo Co Ltd | ヒートシンク及びヒートシンクの製造方法 |
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WO2013103009A1 (ja) * | 2012-01-05 | 2013-07-11 | 富士通株式会社 | 発電装置 |
US20150047821A1 (en) * | 2013-08-14 | 2015-02-19 | Atomic Energy Council - Institute Of Nuclear Energy Research | Heating device structure |
WO2015111242A1 (ja) * | 2014-01-21 | 2015-07-30 | 富士通株式会社 | 放熱部品、放熱部品の製造方法、電子装置、電子装置の製造方法、一体型モジュール、情報処理システム |
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WO2022210553A1 (ja) * | 2021-03-29 | 2022-10-06 | 株式会社AmaterZ | 通信装置及び電源装置 |
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WO2016006089A1 (ja) | 2016-01-14 |
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