JP6349036B2 - 発光素子の製造方法 - Google Patents

発光素子の製造方法 Download PDF

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Publication number
JP6349036B2
JP6349036B2 JP2017530935A JP2017530935A JP6349036B2 JP 6349036 B2 JP6349036 B2 JP 6349036B2 JP 2017530935 A JP2017530935 A JP 2017530935A JP 2017530935 A JP2017530935 A JP 2017530935A JP 6349036 B2 JP6349036 B2 JP 6349036B2
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Japan
Prior art keywords
light emitting
emitting element
resin layer
layer
light
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JP2017530935A
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Japanese (ja)
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JPWO2017018507A1 (ja
Inventor
英樹 浅野
英樹 浅野
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Nikkiso Co Ltd
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Nikkiso Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
JP2017530935A 2015-07-29 2016-07-29 発光素子の製造方法 Active JP6349036B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015149795 2015-07-29
JP2015149795 2015-07-29
PCT/JP2016/072326 WO2017018507A1 (ja) 2015-07-29 2016-07-29 発光素子の製造方法

Publications (2)

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JPWO2017018507A1 JPWO2017018507A1 (ja) 2017-11-16
JP6349036B2 true JP6349036B2 (ja) 2018-06-27

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JP2017530935A Active JP6349036B2 (ja) 2015-07-29 2016-07-29 発光素子の製造方法

Country Status (5)

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JP (1) JP6349036B2 (zh)
KR (1) KR20180018700A (zh)
CN (1) CN108886075B (zh)
TW (1) TW201712890A (zh)
WO (1) WO2017018507A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020256191A1 (ko) * 2019-06-21 2020-12-24 엘지전자 주식회사 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법
CN114023856A (zh) * 2021-09-30 2022-02-08 厦门士兰明镓化合物半导体有限公司 发光二极管及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228538B1 (en) * 1998-08-28 2001-05-08 Micron Technology, Inc. Mask forming methods and field emission display emitter mask forming methods
JP2007019318A (ja) * 2005-07-08 2007-01-25 Sumitomo Chemical Co Ltd 半導体発光素子、半導体発光素子用基板の製造方法及び半導体発光素子の製造方法
KR101159438B1 (ko) * 2007-11-16 2012-06-22 가부시키가이샤 아루박 기판 처리 방법, 및 이 방법에 의해 처리된 기판
KR101062282B1 (ko) * 2009-03-05 2011-09-05 우리엘에스티 주식회사 질화물계 발광소자 및 그 제조방법
JP5446387B2 (ja) * 2009-03-31 2014-03-19 ソニー株式会社 反射防止構造体の製造方法および固体撮像装置の製造方法
JP5767796B2 (ja) * 2010-09-28 2015-08-19 林純薬工業株式会社 エッチング液組成物およびエッチング方法
KR20120100193A (ko) * 2011-03-03 2012-09-12 서울옵토디바이스주식회사 발광 다이오드 칩
KR101969334B1 (ko) * 2011-11-16 2019-04-17 엘지이노텍 주식회사 발광 소자 및 이를 구비한 발광 장치
EP2889922B1 (en) * 2012-08-21 2018-03-07 Oji Holdings Corporation Method for producing substrate for semiconductor light emitting element and method for manufacturing semiconductor light emitting element
JP6153734B2 (ja) * 2013-01-23 2017-06-28 スタンレー電気株式会社 光源装置
TWI543395B (zh) * 2013-04-01 2016-07-21 中國砂輪企業股份有限公司 圖案化光電基板及其製作方法

Also Published As

Publication number Publication date
JPWO2017018507A1 (ja) 2017-11-16
KR20180018700A (ko) 2018-02-21
CN108886075B (zh) 2021-07-13
TW201712890A (zh) 2017-04-01
CN108886075A (zh) 2018-11-23
WO2017018507A1 (ja) 2017-02-02

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