JP6341666B2 - レーザー加工方法 - Google Patents
レーザー加工方法 Download PDFInfo
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- JP6341666B2 JP6341666B2 JP2014004229A JP2014004229A JP6341666B2 JP 6341666 B2 JP6341666 B2 JP 6341666B2 JP 2014004229 A JP2014004229 A JP 2014004229A JP 2014004229 A JP2014004229 A JP 2014004229A JP 6341666 B2 JP6341666 B2 JP 6341666B2
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Images
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- Laser Beam Processing (AREA)
- Dicing (AREA)
Description
L レーザー光線
Ra 保護膜
W 被加工物
Claims (2)
- 被加工物にレーザー光線を照射してアブレーション加工を施すレーザー加工方法であって、
被加工物に照射するレーザー光線の散乱を抑制するレーザー光散乱抑制剤を含有した保護膜を被加工物の表面に形成する保護膜形成工程と、
該保護膜形成工程を実施した後、被加工物に対してレーザー光線を該保護膜を介して被加工物に照射して、被加工物の表面にアブレーション加工を施す加工工程と、を備え、
該レーザー光散乱抑制剤は、レーザー光線の波長の1/20〜1/5倍の粒子径に形成されたレーザー加工方法。 - 前記保護膜は、有機溶媒に該レーザー光散乱抑制剤が分散含有して形成されており、
該レーザー光散乱抑制剤は、該被加工物に照射するレーザー光線の波長に対して吸収性を有する微粒子であって、ケイ素、金属単体、シリカ、金属酸化物、金属窒化物又は金属硫化物の少なくとも1つからなる、請求項1に記載のレーザー加工方法。
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JP2014004229A JP6341666B2 (ja) | 2014-01-14 | 2014-01-14 | レーザー加工方法 |
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JP2014004229A JP6341666B2 (ja) | 2014-01-14 | 2014-01-14 | レーザー加工方法 |
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JP2015131320A JP2015131320A (ja) | 2015-07-23 |
JP6341666B2 true JP6341666B2 (ja) | 2018-06-13 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6585422B2 (ja) * | 2015-08-24 | 2019-10-02 | 株式会社ディスコ | レーザー加工方法 |
JP6595857B2 (ja) * | 2015-09-09 | 2019-10-23 | 株式会社ディスコ | ウエーハの加工方法 |
EP3296054B1 (de) * | 2016-09-19 | 2020-12-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur herstellung eines mikrobearbeiteten werkstücks mittels laserabtrag |
JP7258416B2 (ja) * | 2018-12-06 | 2023-04-17 | 株式会社ディスコ | 被加工物の加工方法、デバイスチップの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4471632B2 (ja) * | 2003-11-18 | 2010-06-02 | 株式会社ディスコ | ウエーハの加工方法 |
JP4781635B2 (ja) * | 2004-03-30 | 2011-09-28 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用保護シート |
JP2008013809A (ja) * | 2006-07-05 | 2008-01-24 | Az Electronic Materials Kk | レーザーアブレーションによる機能膜の製造法およびそれに用いるレーザーアブレーション加工用組成物 |
JP2013081947A (ja) * | 2011-10-06 | 2013-05-09 | Disco Corp | 半導体基板のアブレーション加工方法 |
JP5839390B2 (ja) * | 2011-10-06 | 2016-01-06 | 株式会社ディスコ | アブレーション加工方法 |
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