JP6334235B2 - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
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- JP6334235B2 JP6334235B2 JP2014078505A JP2014078505A JP6334235B2 JP 6334235 B2 JP6334235 B2 JP 6334235B2 JP 2014078505 A JP2014078505 A JP 2014078505A JP 2014078505 A JP2014078505 A JP 2014078505A JP 6334235 B2 JP6334235 B2 JP 6334235B2
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- 239000007789 gas Substances 0.000 claims description 47
- 239000004065 semiconductor Substances 0.000 claims description 33
- 239000000155 melt Substances 0.000 claims description 32
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 238000010128 melt processing Methods 0.000 claims description 16
- 230000001678 irradiating effect Effects 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 10
- 230000010355 oscillation Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229910009372 YVO4 Inorganic materials 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
Description
該集光器のレーザー光線照射方向下流側に配設されレーザー加工によって生成される溶融物を処理するための溶融物処理手段を備え、
該溶融物処理手段は、該集光器から照射されるレーザー光線の通過を許容する開口を有し該開口から半導体ウエーハ、又は光デバイスウエーハに向けて高速の空気を噴射するガス噴射部と、該ガス噴射部の該開口を囲繞して設けられ該開口から噴射される高速の空気によって飛散せしめられる溶融物を吸引する吸引口と、該吸引口を始端とし、該吸引口に連通する複数のガス吸引通路を備えた溶融物吸引部とを具備し、該ガス噴射部が高圧ガス供給手段に接続され、該溶融物吸引部の該複数のガス吸引通路がそれぞれ吸引作用を生じさせる溶融物吸引手段に接続されている、
ことを特徴とするレーザー加工装置が提供される。
図示の実施形態における集光器53は、上端が閉塞された筒状の集光器ハウジング531を具備しており、この集光器ハウジング531の上部には、上記レーザー光線照射手段52を構成するケーシング521の先端部が挿入する開口531aが設けられている。集光器ハウジング531内には、上記パルスレーザー光線発振手段522から発振されたパルスレーザー光線を下方に向けて方向変換する方向変換ミラー532と、該方向変換ミラー532によって下方に向けて方向変換されたパルスレーザー光線を集光してチャックテーブル36に保持された被加工物Wに照射する集光レンズ533が配設されている。
図4には、上述したレーザー加工装置によって加工される被加工物としての半導体ウエーハ10が環状のフレームFに装着されたダイシングテープTの表面に貼着された状態の斜視図が示されている。半導体ウエーハ10は、表面10aに格子状の分割予定ライン101が形成され、格子状の分割予定ライン101によって区画された複数の領域にIC、LSI等のデバイス102が形成されている。このように構成された半導体ウエーハ10に分割予定ライン101に沿ってレーザー加工溝を形成するには、図1に示すレーザー加工装置のチャックテーブル36上に半導体ウエーハ10のダイシングテープT側を載置する。そして、図示しない吸引手段を作動することにより、半導体ウエーハ10はダイシングテープTを介してチャックテーブル36上に吸引保持する(ウエーハ保持工程)。なお、半導体ウエーハ10をダイシングテープTを介して環状のフレームFは、チャックテーブル36に配設されたクランプ362によって固定される。
〈加工条件:1〉
レーザー光線の光源 :YVO4レーザーまたはYAGレーザー
波長 :355nm
繰り返し周波数 :800kHz
平均出力 :8W
集光スポット径 :φ10μm
加工送り速度 :400mm/秒
〈加工条件:2〉
レーザー光線の光源 :CO2レーザー
繰り返し周波数 :20kHz
平均出力 :20W
集光スポット径 :φ100μm
加工送り速度 :600mm/秒
3:チャックテーブル機構
36:チャックテーブル
37:加工送り手段
38:第1の割り出し送り手段
4:レーザー光線照射ユニット支持機構
42:可動支持基台
43:第2の割り出し送り手段
5:レーザー光線照射ユニット
51:ユニットホルダ
52:レーザー光線照射手段
53:集光器
531:集光器ハウジング
532:方向変換ミラー
533:集光レンズ
6:撮像手段
7:溶融物処理手段
71:ガス噴射部
711:開口
72:溶融物吸引部
721:吸引口
73:高圧ガス供給手段
74:溶融物吸引手段
10:半導体ウエーハ
Claims (2)
- 半導体ウエーハ、又は光デバイスウエーハを保持するためのチャックテーブルと、該チャックテーブルに保持された半導体ウエーハ、又は光デバイスウエーハにレーザー光線を照射するレーザー光線照射手段とを具備し、該レーザー光線照射手段はレーザー光線を発振するレーザー光線発振手段と、該レーザー光線発振手段から発振されたレーザー光線を集光する集光レンズを備えた集光器とを具備しているレーザー加工装置であって、
該集光器のレーザー光線照射方向下流側に配設されレーザー加工によって生成される溶融物を処理するための溶融物処理手段を備え、
該溶融物処理手段は、該集光器から照射されるレーザー光線の通過を許容する開口を有し該開口から半導体ウエーハ、又は光デバイスウエーハに向けて高速の空気を噴射するガス噴射部と、該ガス噴射部の該開口を囲繞して設けられ該開口から噴射される高速の空気によって飛散せしめられる溶融物を吸引する吸引口と、該吸引口を始端とし、該吸引口に連通する複数のガス吸引通路を備えた溶融物吸引部とを具備し、該ガス噴射部が高圧ガス供給手段に接続され、該溶融物吸引部の該複数のガス吸引通路がそれぞれ吸引作用を生じさせる溶融物吸引手段に接続されている、
ことを特徴とするレーザー加工装置。 - 該高圧ガス供給手段は、該ガス噴射部の該開口から噴射する流量が30〜200リットル/分・mm2)となるように空気を供給する、請求項1記載のレーザー加工装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014078505A JP6334235B2 (ja) | 2014-04-07 | 2014-04-07 | レーザー加工装置 |
TW104106993A TWI640383B (zh) | 2014-04-07 | 2015-03-05 | Laser processing device |
KR1020150044297A KR102272964B1 (ko) | 2014-04-07 | 2015-03-30 | 레이저 가공 장치 |
US14/678,328 US10276413B2 (en) | 2014-04-07 | 2015-04-03 | Laser processing apparatus |
CN201510160741.0A CN104972225A (zh) | 2014-04-07 | 2015-04-07 | 激光加工装置 |
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JP2014078505A JP6334235B2 (ja) | 2014-04-07 | 2014-04-07 | レーザー加工装置 |
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JP2015199080A JP2015199080A (ja) | 2015-11-12 |
JP6334235B2 true JP6334235B2 (ja) | 2018-05-30 |
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US (1) | US10276413B2 (ja) |
JP (1) | JP6334235B2 (ja) |
KR (1) | KR102272964B1 (ja) |
CN (1) | CN104972225A (ja) |
TW (1) | TWI640383B (ja) |
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JP6647829B2 (ja) * | 2015-10-20 | 2020-02-14 | 株式会社ディスコ | レーザ加工装置 |
DE102016202043A1 (de) * | 2016-02-11 | 2017-08-17 | Robert Bosch Gmbh | Vorrichtung für eine Bearbeitungsanlage, insbesondere für eine Laserbearbeitungsanlage und Laserbearbeitungsanlage |
CN106102986B (zh) * | 2016-06-08 | 2018-06-12 | 大族激光科技产业集团股份有限公司 | 用于切割蓝宝石的方法及其装置 |
KR20180064605A (ko) * | 2016-12-05 | 2018-06-15 | 삼성디스플레이 주식회사 | 레이저 가공용 워크 테이블 및 이의 동작 방법 |
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US10898932B2 (en) * | 2018-02-12 | 2021-01-26 | Suss Micro Tec Photomask Equipment Gmbh & Co Kg | Method and apparatus for cleaning a substrate and computer program product |
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JP5511697B2 (ja) * | 2011-01-18 | 2014-06-04 | Towa株式会社 | レーザ加工装置 |
US8900688B2 (en) * | 2011-05-27 | 2014-12-02 | Nippon Steel & Sumitomo Metal Corporation | Grain oriented electrical steel sheet and method of producing grain oriented electrical steel sheet |
US9410244B2 (en) * | 2012-09-04 | 2016-08-09 | Asm Ip Holding B.V. | Semiconductor processing apparatus including a plurality of reactors, and method for providing the same with process gas |
JP6104025B2 (ja) * | 2013-04-11 | 2017-03-29 | 株式会社ディスコ | レーザー加工装置及びレーザー加工方法 |
JP6017373B2 (ja) * | 2013-05-21 | 2016-11-02 | Towa株式会社 | 半導体デバイスの製造方法 |
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