JP6330818B2 - 導電性基板、導電性基板の製造方法 - Google Patents

導電性基板、導電性基板の製造方法 Download PDF

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Publication number
JP6330818B2
JP6330818B2 JP2015545281A JP2015545281A JP6330818B2 JP 6330818 B2 JP6330818 B2 JP 6330818B2 JP 2015545281 A JP2015545281 A JP 2015545281A JP 2015545281 A JP2015545281 A JP 2015545281A JP 6330818 B2 JP6330818 B2 JP 6330818B2
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Prior art keywords
layer
conductive substrate
blackened
copper
blackening
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Japanese (ja)
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JPWO2015064664A1 (ja
Inventor
渡辺 宏幸
宏幸 渡辺
山岸 浩一
浩一 山岸
永田 純一
純一 永田
高塚 裕二
裕二 高塚
貞之 横林
貞之 横林
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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Publication of JPWO2015064664A1 publication Critical patent/JPWO2015064664A1/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/085Oxides of iron group metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/06Coating on the layer surface on metal layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/20Inorganic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/416Reflective
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208Touch screens
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2015545281A 2013-10-31 2014-10-29 導電性基板、導電性基板の製造方法 Active JP6330818B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013227517 2013-10-31
JP2013227517 2013-10-31
JP2014074591 2014-03-31
JP2014074591 2014-03-31
PCT/JP2014/078817 WO2015064664A1 (ja) 2013-10-31 2014-10-29 導電性基板、導電性基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2015064664A1 JPWO2015064664A1 (ja) 2017-03-09
JP6330818B2 true JP6330818B2 (ja) 2018-05-30

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JP2015545281A Active JP6330818B2 (ja) 2013-10-31 2014-10-29 導電性基板、導電性基板の製造方法

Country Status (5)

Country Link
JP (1) JP6330818B2 (ko)
KR (1) KR102170097B1 (ko)
CN (1) CN105706182B (ko)
TW (1) TWI646870B (ko)
WO (1) WO2015064664A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6164145B2 (ja) * 2014-03-31 2017-07-19 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
TWI595507B (zh) * 2014-06-18 2017-08-11 Geomatec Co Ltd Laminates, methods of making the same, and electronic machines
JP6369393B2 (ja) * 2015-05-25 2018-08-08 住友金属鉱山株式会社 導電性基板、及び導電性基板の製造方法
JPWO2016190224A1 (ja) * 2015-05-25 2018-03-29 住友金属鉱山株式会社 黒化めっき液、導電性基板
JP6365422B2 (ja) * 2015-06-04 2018-08-01 住友金属鉱山株式会社 導電性基板の製造方法
JP2017008405A (ja) * 2015-06-25 2017-01-12 住友金属鉱山株式会社 導電性基板の製造方法
JP6973076B2 (ja) * 2015-07-31 2021-11-24 住友金属鉱山株式会社 導電性基板
CN107850965B (zh) * 2015-07-31 2021-01-29 住友金属矿山股份有限公司 导电性基板、导电性基板的制造方法
WO2017033740A1 (ja) * 2015-08-26 2017-03-02 住友金属鉱山株式会社 導電性基板
JP6439628B2 (ja) * 2015-08-26 2018-12-19 住友金属鉱山株式会社 導電性基板の製造方法
JP6687033B2 (ja) * 2015-09-30 2020-04-22 住友金属鉱山株式会社 導電性基板
JP6531699B2 (ja) * 2016-04-05 2019-06-19 住友金属鉱山株式会社 導電性基板
JP7049759B2 (ja) * 2016-07-12 2022-04-07 住友金属鉱山株式会社 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
CN106445225A (zh) * 2016-08-03 2017-02-22 深圳市骏达光电股份有限公司 一种触摸屏及其加工方法
CN109375815A (zh) * 2018-11-16 2019-02-22 信利光电股份有限公司 一种金属网格触摸屏的黑化方法及金属网格触摸屏
CN109857276A (zh) * 2019-01-31 2019-06-07 信利光电股份有限公司 一种降低金属网格触摸屏线条可见性结构和方法
KR102704936B1 (ko) * 2022-09-23 2024-09-09 주식회사 나노코어 디스플레이 배면 플레이트, 디스플레이 장치 및 디스플레이 배면 플레이트 제조방법
KR102704937B1 (ko) * 2022-09-23 2024-09-09 주식회사 나노코어 디스플레이 배면 플레이트, 디스플레이 장치 및 이들의 제조 방법.

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TW445303B (en) * 1996-02-26 2001-07-11 Kuramoto Seisakusho Co Ltd Low reflection film substrate
JP2002050892A (ja) * 2000-07-31 2002-02-15 Mitsubishi Rayon Co Ltd 網目構造物、電磁波シールドフィルタ及びその製法
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
KR100780283B1 (ko) * 2004-09-01 2007-11-28 삼성코닝 주식회사 전자파 차폐 필름 및 이의 제조방법
JP2008311565A (ja) * 2007-06-18 2008-12-25 Dainippon Printing Co Ltd ディスプレイ用複合フィルタ
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JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置
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Also Published As

Publication number Publication date
KR102170097B1 (ko) 2020-10-26
TWI646870B (zh) 2019-01-01
TW201540137A (zh) 2015-10-16
CN105706182A (zh) 2016-06-22
KR20160081925A (ko) 2016-07-08
WO2015064664A1 (ja) 2015-05-07
CN105706182B (zh) 2017-07-28
JPWO2015064664A1 (ja) 2017-03-09

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