JP6330818B2 - 導電性基板、導電性基板の製造方法 - Google Patents
導電性基板、導電性基板の製造方法 Download PDFInfo
- Publication number
- JP6330818B2 JP6330818B2 JP2015545281A JP2015545281A JP6330818B2 JP 6330818 B2 JP6330818 B2 JP 6330818B2 JP 2015545281 A JP2015545281 A JP 2015545281A JP 2015545281 A JP2015545281 A JP 2015545281A JP 6330818 B2 JP6330818 B2 JP 6330818B2
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- Prior art keywords
- layer
- conductive substrate
- blackened
- copper
- blackening
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- 239000000758 substrate Substances 0.000 title claims description 203
- 238000000034 method Methods 0.000 title claims description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000010949 copper Substances 0.000 claims description 184
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 182
- 229910052802 copper Inorganic materials 0.000 claims description 182
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 134
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 73
- 239000001301 oxygen Substances 0.000 claims description 73
- 229910052760 oxygen Inorganic materials 0.000 claims description 73
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 68
- 229910052757 nitrogen Inorganic materials 0.000 claims description 67
- 238000005530 etching Methods 0.000 claims description 52
- 238000004544 sputter deposition Methods 0.000 claims description 46
- 229910052721 tungsten Inorganic materials 0.000 claims description 39
- 239000010937 tungsten Substances 0.000 claims description 39
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 37
- 229910052759 nickel Inorganic materials 0.000 claims description 33
- 229910001080 W alloy Inorganic materials 0.000 claims description 22
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 46
- 239000000463 material Substances 0.000 description 46
- 239000000523 sample Substances 0.000 description 37
- 239000007789 gas Substances 0.000 description 28
- 238000007747 plating Methods 0.000 description 26
- 239000010409 thin film Substances 0.000 description 26
- 238000005259 measurement Methods 0.000 description 25
- 229910052786 argon Inorganic materials 0.000 description 23
- 239000010408 film Substances 0.000 description 21
- 239000000243 solution Substances 0.000 description 20
- 238000007922 dissolution test Methods 0.000 description 19
- 238000011156 evaluation Methods 0.000 description 19
- -1 polyethylene terephthalate Polymers 0.000 description 19
- 238000002441 X-ray diffraction Methods 0.000 description 17
- 229920000139 polyethylene terephthalate Polymers 0.000 description 14
- 239000005020 polyethylene terephthalate Substances 0.000 description 14
- 230000009257 reactivity Effects 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 8
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 7
- 229910000480 nickel oxide Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 4
- 239000002932 luster Substances 0.000 description 4
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 4
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 4
- 229910001930 tungsten oxide Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229940063746 oxygen 20 % Drugs 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/085—Oxides of iron group metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013227517 | 2013-10-31 | ||
JP2013227517 | 2013-10-31 | ||
JP2014074591 | 2014-03-31 | ||
JP2014074591 | 2014-03-31 | ||
PCT/JP2014/078817 WO2015064664A1 (ja) | 2013-10-31 | 2014-10-29 | 導電性基板、導電性基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015064664A1 JPWO2015064664A1 (ja) | 2017-03-09 |
JP6330818B2 true JP6330818B2 (ja) | 2018-05-30 |
Family
ID=53004263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015545281A Active JP6330818B2 (ja) | 2013-10-31 | 2014-10-29 | 導電性基板、導電性基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6330818B2 (ko) |
KR (1) | KR102170097B1 (ko) |
CN (1) | CN105706182B (ko) |
TW (1) | TWI646870B (ko) |
WO (1) | WO2015064664A1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6164145B2 (ja) * | 2014-03-31 | 2017-07-19 | 住友金属鉱山株式会社 | 導電性基板、導電性基板の製造方法 |
TWI595507B (zh) * | 2014-06-18 | 2017-08-11 | Geomatec Co Ltd | Laminates, methods of making the same, and electronic machines |
JP6369393B2 (ja) * | 2015-05-25 | 2018-08-08 | 住友金属鉱山株式会社 | 導電性基板、及び導電性基板の製造方法 |
JPWO2016190224A1 (ja) * | 2015-05-25 | 2018-03-29 | 住友金属鉱山株式会社 | 黒化めっき液、導電性基板 |
JP6365422B2 (ja) * | 2015-06-04 | 2018-08-01 | 住友金属鉱山株式会社 | 導電性基板の製造方法 |
JP2017008405A (ja) * | 2015-06-25 | 2017-01-12 | 住友金属鉱山株式会社 | 導電性基板の製造方法 |
JP6973076B2 (ja) * | 2015-07-31 | 2021-11-24 | 住友金属鉱山株式会社 | 導電性基板 |
CN107850965B (zh) * | 2015-07-31 | 2021-01-29 | 住友金属矿山股份有限公司 | 导电性基板、导电性基板的制造方法 |
WO2017033740A1 (ja) * | 2015-08-26 | 2017-03-02 | 住友金属鉱山株式会社 | 導電性基板 |
JP6439628B2 (ja) * | 2015-08-26 | 2018-12-19 | 住友金属鉱山株式会社 | 導電性基板の製造方法 |
JP6687033B2 (ja) * | 2015-09-30 | 2020-04-22 | 住友金属鉱山株式会社 | 導電性基板 |
JP6531699B2 (ja) * | 2016-04-05 | 2019-06-19 | 住友金属鉱山株式会社 | 導電性基板 |
JP7049759B2 (ja) * | 2016-07-12 | 2022-04-07 | 住友金属鉱山株式会社 | 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法 |
CN106445225A (zh) * | 2016-08-03 | 2017-02-22 | 深圳市骏达光电股份有限公司 | 一种触摸屏及其加工方法 |
CN109375815A (zh) * | 2018-11-16 | 2019-02-22 | 信利光电股份有限公司 | 一种金属网格触摸屏的黑化方法及金属网格触摸屏 |
CN109857276A (zh) * | 2019-01-31 | 2019-06-07 | 信利光电股份有限公司 | 一种降低金属网格触摸屏线条可见性结构和方法 |
KR102704936B1 (ko) * | 2022-09-23 | 2024-09-09 | 주식회사 나노코어 | 디스플레이 배면 플레이트, 디스플레이 장치 및 디스플레이 배면 플레이트 제조방법 |
KR102704937B1 (ko) * | 2022-09-23 | 2024-09-09 | 주식회사 나노코어 | 디스플레이 배면 플레이트, 디스플레이 장치 및 이들의 제조 방법. |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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TW445303B (en) * | 1996-02-26 | 2001-07-11 | Kuramoto Seisakusho Co Ltd | Low reflection film substrate |
JP2002050892A (ja) * | 2000-07-31 | 2002-02-15 | Mitsubishi Rayon Co Ltd | 網目構造物、電磁波シールドフィルタ及びその製法 |
JP4086132B2 (ja) | 2001-11-16 | 2008-05-14 | 株式会社ブリヂストン | 透明導電性フィルムおよびタッチパネル |
KR100780283B1 (ko) * | 2004-09-01 | 2007-11-28 | 삼성코닝 주식회사 | 전자파 차폐 필름 및 이의 제조방법 |
JP2008311565A (ja) * | 2007-06-18 | 2008-12-25 | Dainippon Printing Co Ltd | ディスプレイ用複合フィルタ |
JP5361579B2 (ja) | 2009-07-09 | 2013-12-04 | 信越ポリマー株式会社 | 大型ディスプレイ用のセンサパネル及びその製造方法 |
JP2013069261A (ja) | 2011-09-08 | 2013-04-18 | Dainippon Printing Co Ltd | タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置 |
JP5985812B2 (ja) * | 2011-11-04 | 2016-09-06 | Jx金属株式会社 | 印刷回路用銅箔 |
JP6099875B2 (ja) | 2011-11-22 | 2017-03-22 | 東レ株式会社 | 積層体の製造方法 |
US9766652B2 (en) * | 2012-08-31 | 2017-09-19 | Lg Chem, Ltd. | Conductive structure and method for manufacturing same |
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