JP6320172B2 - 電子部品の樹脂封止方法及び樹脂封止装置 - Google Patents

電子部品の樹脂封止方法及び樹脂封止装置 Download PDF

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Publication number
JP6320172B2
JP6320172B2 JP2014111374A JP2014111374A JP6320172B2 JP 6320172 B2 JP6320172 B2 JP 6320172B2 JP 2014111374 A JP2014111374 A JP 2014111374A JP 2014111374 A JP2014111374 A JP 2014111374A JP 6320172 B2 JP6320172 B2 JP 6320172B2
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JP
Japan
Prior art keywords
mold
block
cavity
air vent
fixed
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JP2014111374A
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English (en)
Japanese (ja)
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JP2015226014A5 (enExample
JP2015226014A (ja
Inventor
智則 姫野
智則 姫野
信行 諸橋
信行 諸橋
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Towa Corp
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Towa Corp
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Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2014111374A priority Critical patent/JP6320172B2/ja
Priority to CN201510169123.2A priority patent/CN105280506B/zh
Priority to KR1020150052469A priority patent/KR101667879B1/ko
Priority to TW104112302A priority patent/TWI602680B/zh
Priority to SG10201504081PA priority patent/SG10201504081PA/en
Priority to MYPI2015001389A priority patent/MY172522A/en
Publication of JP2015226014A publication Critical patent/JP2015226014A/ja
Publication of JP2015226014A5 publication Critical patent/JP2015226014A5/ja
Application granted granted Critical
Publication of JP6320172B2 publication Critical patent/JP6320172B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2014111374A 2014-05-29 2014-05-29 電子部品の樹脂封止方法及び樹脂封止装置 Active JP6320172B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014111374A JP6320172B2 (ja) 2014-05-29 2014-05-29 電子部品の樹脂封止方法及び樹脂封止装置
CN201510169123.2A CN105280506B (zh) 2014-05-29 2015-04-10 电子部件的树脂封装方法及树脂封装装置
KR1020150052469A KR101667879B1 (ko) 2014-05-29 2015-04-14 전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치
TW104112302A TWI602680B (zh) 2014-05-29 2015-04-17 Resin sealing method for electronic parts and resin sealing device
SG10201504081PA SG10201504081PA (en) 2014-05-29 2015-05-25 Method and apparatus for resin-sealing electronic components
MYPI2015001389A MY172522A (en) 2014-05-29 2015-05-27 Method and apparatus for resin-sealing electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014111374A JP6320172B2 (ja) 2014-05-29 2014-05-29 電子部品の樹脂封止方法及び樹脂封止装置

Publications (3)

Publication Number Publication Date
JP2015226014A JP2015226014A (ja) 2015-12-14
JP2015226014A5 JP2015226014A5 (enExample) 2016-06-23
JP6320172B2 true JP6320172B2 (ja) 2018-05-09

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JP2014111374A Active JP6320172B2 (ja) 2014-05-29 2014-05-29 電子部品の樹脂封止方法及び樹脂封止装置

Country Status (6)

Country Link
JP (1) JP6320172B2 (enExample)
KR (1) KR101667879B1 (enExample)
CN (1) CN105280506B (enExample)
MY (1) MY172522A (enExample)
SG (1) SG10201504081PA (enExample)
TW (1) TWI602680B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654861B2 (ja) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
EP3188260B1 (en) * 2015-12-31 2020-02-12 Dow Global Technologies Llc Nanostructure material structures and methods
JP6654971B2 (ja) * 2016-06-17 2020-02-26 本田技研工業株式会社 樹脂成形部材の成形方法及び成形システム
JP6436260B1 (ja) * 2018-05-31 2018-12-12 株式会社玉谷製作所 ピン、スリーブ又は入れ子
JP6981935B2 (ja) * 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
BR112021003661B1 (pt) * 2018-08-30 2023-12-19 Husky Injection Molding Systems Ltd Dispensador de fundição, sistema e método de configuração para uma máquina de moldagem de plástico
JP6678973B1 (ja) * 2019-04-09 2020-04-15 アサヒ・エンジニアリング株式会社 樹脂封止装置および樹脂封止方法
CN111531802B (zh) * 2020-04-27 2025-07-22 芜湖鼎联电子科技有限公司 一种用于功率半导体器件封装的无重熔高温高压注塑模具
CN111775392B (zh) * 2020-08-03 2025-02-18 昆山大全凯帆精密模具有限公司 一种bmc&dmc传递压制模具和加工方法
JP7661285B2 (ja) * 2022-07-15 2025-04-14 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
CN115923049A (zh) * 2022-11-04 2023-04-07 神通科技集团股份有限公司 一种用于双色模的一次料头模内切除机构及双色模
WO2025116643A1 (ko) * 2023-12-01 2025-06-05 삼성전자 주식회사 밀봉 부재를 배치하기 위한 수리 키트 장치
CN119408074A (zh) * 2025-01-07 2025-02-11 北京七星华创微电子有限责任公司 一种foplp封装加工用注塑模具结构

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292926A (ja) * 1985-06-21 1986-12-23 Hitachi Hokkai Semiconductor Ltd モ−ルド方法およびモ−ルド装置
JPH06210658A (ja) * 1993-01-19 1994-08-02 Toshiba Corp 樹脂成形用金型装置
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
DE60041789D1 (de) * 1999-12-16 2009-04-23 Dai Ichi Seiko Co Ltd Verfahren zum Versiegeln mit Kunststoff
JP2007152831A (ja) * 2005-12-07 2007-06-21 Sharp Corp 可動エアベントおよびそれを備えたモールド成形装置、並びに電子部品の製造方法
JP5138470B2 (ja) * 2008-06-06 2013-02-06 アピックヤマダ株式会社 トランスファモールド装置とこれを用いたトランスファモールド方法
JP5140517B2 (ja) * 2008-08-07 2013-02-06 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP5744683B2 (ja) * 2011-08-31 2015-07-08 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2013184413A (ja) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5930394B2 (ja) * 2012-07-06 2016-06-08 アピックヤマダ株式会社 樹脂モールド装置
JP6058431B2 (ja) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 樹脂モールド装置、および樹脂モールド方法
JP6259263B2 (ja) * 2013-11-11 2018-01-10 アピックヤマダ株式会社 樹脂モールド金型および樹脂モールド成形方法

Also Published As

Publication number Publication date
TW201603986A (zh) 2016-02-01
SG10201504081PA (en) 2015-12-30
CN105280506A (zh) 2016-01-27
TWI602680B (zh) 2017-10-21
KR20150137992A (ko) 2015-12-09
JP2015226014A (ja) 2015-12-14
KR101667879B1 (ko) 2016-10-19
CN105280506B (zh) 2018-06-08
MY172522A (en) 2019-11-28

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