JP6308864B2 - 撮像装置 - Google Patents

撮像装置 Download PDF

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Publication number
JP6308864B2
JP6308864B2 JP2014101472A JP2014101472A JP6308864B2 JP 6308864 B2 JP6308864 B2 JP 6308864B2 JP 2014101472 A JP2014101472 A JP 2014101472A JP 2014101472 A JP2014101472 A JP 2014101472A JP 6308864 B2 JP6308864 B2 JP 6308864B2
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Japan
Prior art keywords
photoelectric conversion
conversion unit
semiconductor region
charge
unit
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JP2014101472A
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English (en)
Japanese (ja)
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JP2015220279A5 (enExample
JP2015220279A (ja
Inventor
聡子 飯田
聡子 飯田
潤 伊庭
潤 伊庭
一拓 佐野
一拓 佐野
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014101472A priority Critical patent/JP6308864B2/ja
Priority to US14/709,338 priority patent/US9386249B2/en
Publication of JP2015220279A publication Critical patent/JP2015220279A/ja
Publication of JP2015220279A5 publication Critical patent/JP2015220279A5/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/767—Horizontal readout lines, multiplexers or registers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
    • H04N25/621—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
    • H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8027—Geometry of the photosensitive area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033—Photosensitive area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/807—Pixel isolation structures

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2014101472A 2014-05-15 2014-05-15 撮像装置 Active JP6308864B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014101472A JP6308864B2 (ja) 2014-05-15 2014-05-15 撮像装置
US14/709,338 US9386249B2 (en) 2014-05-15 2015-05-11 Image pickup apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014101472A JP6308864B2 (ja) 2014-05-15 2014-05-15 撮像装置

Publications (3)

Publication Number Publication Date
JP2015220279A JP2015220279A (ja) 2015-12-07
JP2015220279A5 JP2015220279A5 (enExample) 2017-05-18
JP6308864B2 true JP6308864B2 (ja) 2018-04-11

Family

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Family Applications (1)

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JP2014101472A Active JP6308864B2 (ja) 2014-05-15 2014-05-15 撮像装置

Country Status (2)

Country Link
US (1) US9386249B2 (enExample)
JP (1) JP6308864B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016046420A (ja) * 2014-08-25 2016-04-04 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2017037907A (ja) * 2015-08-07 2017-02-16 ルネサスエレクトロニクス株式会社 撮像装置およびその製造方法
CN111741200B (zh) 2016-04-08 2021-12-21 佳能株式会社 图像传感器和摄像设备
JP6774207B2 (ja) * 2016-04-08 2020-10-21 キヤノン株式会社 撮像素子及び撮像装置
JP6738200B2 (ja) * 2016-05-26 2020-08-12 キヤノン株式会社 撮像装置
JP6987562B2 (ja) * 2017-07-28 2022-01-05 キヤノン株式会社 固体撮像素子
JP2019102494A (ja) * 2017-11-28 2019-06-24 キヤノン株式会社 光電変換装置およびその製造方法、機器
WO2020008801A1 (ja) * 2018-07-03 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像素子及び固体撮像装置
JP7504630B2 (ja) 2020-03-09 2024-06-24 キヤノン株式会社 撮像素子、撮像装置、コンピュータプログラム及び記憶媒体
JP2020188267A (ja) * 2020-07-14 2020-11-19 キヤノン株式会社 撮像装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831988B2 (ja) * 1983-05-16 1996-03-27 富士写真フイルム株式会社 固体撮像デバイス
JP3988023B2 (ja) * 2001-10-04 2007-10-10 ソニー株式会社 固体撮像素子の製造方法
JP3840203B2 (ja) * 2002-06-27 2006-11-01 キヤノン株式会社 固体撮像装置及び固体撮像装置を用いたカメラシステム
JP5224633B2 (ja) * 2004-03-30 2013-07-03 キヤノン株式会社 半導体装置の製造方法
US7271430B2 (en) * 2004-06-04 2007-09-18 Samsung Electronics Co., Ltd. Image sensors for reducing dark current and methods of fabricating the same
US7432121B2 (en) * 2005-05-24 2008-10-07 Micron Technology, Inc. Isolation process and structure for CMOS imagers
JP4764682B2 (ja) * 2005-09-07 2011-09-07 パナソニック株式会社 固体撮像装置の製造方法
JP5110831B2 (ja) * 2006-08-31 2012-12-26 キヤノン株式会社 光電変換装置及び撮像システム
JP5076528B2 (ja) * 2007-02-06 2012-11-21 株式会社ニコン 光電変換部の連結／分離構造、固体撮像素子及び撮像装置
JP2011044887A (ja) * 2009-08-20 2011-03-03 Canon Inc 固体撮像装置
JP2011071437A (ja) * 2009-09-28 2011-04-07 Sony Corp 固体撮像装置とその製造方法、及び電子機器
JP5546198B2 (ja) * 2009-10-09 2014-07-09 キヤノン株式会社 固体撮像装置
JP5723094B2 (ja) * 2009-12-11 2015-05-27 キヤノン株式会社 固体撮像装置およびカメラ
JP5671830B2 (ja) * 2010-03-31 2015-02-18 ソニー株式会社 固体撮像素子、固体撮像素子の製造方法、および電子機器
JP2011216673A (ja) * 2010-03-31 2011-10-27 Sony Corp 固体撮像装置、固体撮像装置の製造方法、および電子機器
WO2013021577A1 (ja) * 2011-08-08 2013-02-14 パナソニック株式会社 固体撮像装置及び固体撮像装置の駆動方法
JP6039165B2 (ja) * 2011-08-11 2016-12-07 キヤノン株式会社 撮像素子及び撮像装置

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US9386249B2 (en) 2016-07-05
US20150334328A1 (en) 2015-11-19
JP2015220279A (ja) 2015-12-07

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