JP6307093B2 - 電子制御装置、電子制御装置の製造方法 - Google Patents
電子制御装置、電子制御装置の製造方法 Download PDFInfo
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- JP6307093B2 JP6307093B2 JP2015549040A JP2015549040A JP6307093B2 JP 6307093 B2 JP6307093 B2 JP 6307093B2 JP 2015549040 A JP2015549040 A JP 2015549040A JP 2015549040 A JP2015549040 A JP 2015549040A JP 6307093 B2 JP6307093 B2 JP 6307093B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000853 adhesive Substances 0.000 claims description 64
- 230000001070 adhesive effect Effects 0.000 claims description 64
- 239000003990 capacitor Substances 0.000 claims description 58
- 230000017525 heat dissipation Effects 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 230000005855 radiation Effects 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 11
- 239000013464 silicone adhesive Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000011231 conductive filler Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 18
- 230000005540 biological transmission Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920006332 epoxy adhesive Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000013016 damping Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Description
200 コネクタ
200a コネクタ端子
300 ケース
400 防水シール材
1 配線基板
1a 配線基板第一面
1b 配線基板第二面
10a、10b パッド
11 貫通孔
2 金属ベース(放熱部材)
2a 突起部
20 電解コンデンサ
20a、20b リード端子
20c 曲げ部
21 台座
210 挿入孔
21a、21b 隙間部
21 曲げ部
22 封口ゴム
23 金属キャップ
24 防爆弁
25 素子
26 電解液
30 空間部
5 放熱接着材
40 はんだ
41 マイクロコンピュータ
42 FET
43 IC
44 セラミックコンデンサ
45 チップ抵抗
9 充填材
Claims (8)
- 少なくとも1つの貫通孔が設けられた配線基板と、
前記配線基板の第1面に搭載され、前記配線基板と電気的に接続されるリード端子が一方向に突出した電子部品と、
前記配線基板の第1面と対向する第2面に搭載され、前記電子部品と前記貫通孔に対して対向する状態で取り付けられる放熱部材と、
を備える電子制御装置であって、
前記電子部品は電解コンデンサであって、電気的に外部と接続するリード端子が一方向に突出した電解コンデンサ本体と、前記電解コンデンサと当接されるように配置され、かつ、前記リード端子が挿入される挿入孔を備えた台座とを備え、前記リード端子の先端部は台座の外表面に沿って折り曲げられた電解コンデンサであり、
前記電解コンデンサ本体は発熱素子を有し、前記リード端子は前記発熱素子と直接接続されており、
前記電子制御装置はさらに、前記電子部品の前記リード端子を覆う放熱接着材と、前記貫通孔内部を充填する高熱伝導性の充填材とを具備し、
前記放熱接着材は前記充填材と接触しており、
前記台座の前記挿入孔に前記放熱接着材が充填されており、
前記放熱接着材は、前記放熱部材へ熱的に接触して配置されていることにより、前記リード端子から前記放熱部材に対する放熱経路を形成している
ことを特徴とする電子制御装置。 - 請求項1記載の電子制御装置において、前記充填材は前記放熱接着材であることを特徴とする電子制御装置。
- 請求項2記載の電子制御装置の実装構造において、前記放熱接着材は前記電子部品の外形を投影した面積からはみでるように、塗布されていることを特徴とする電子制御装置。
- 請求項1記載の電子制御装置において、前記リード端子が接続する前記配線基板のパッドの直下に前記貫通孔を設けたことを特徴とする電子制御装置。
- 請求項1記載の電子制御装置において、前記放熱部材はアルミダイカスト、もしくは、アルミ、鉄、それら合金からなる板金のいずれかであることを特徴とする電子制御装置。
- 請求項1記載の電子制御装置において、前記放熱接着材は、絶縁性かつ熱伝導性のある無機物フィラーを含有したシリコーン接着材であることを特徴とする電子制御装置。
- 請求項1記載の電子制御装置の製造方法であって、
前記配線基板の第1面に前記電子部品を搭載する第1の工程と、
前記放熱部材に前記放熱接着材を塗布する第2の工程と、
前記放熱部材の前記放熱接着材塗布面に前記配線基板の第2面を機械的に押しあてる第3の工程と、
を有し、
前記第3の工程において前記第2面を押し当てることにより、前記配線基板の前記貫通孔を通して、前記放熱接着材を前記配線基板の第1面に突出させ、前記電子部品の前記リード端子を覆うように、前記第2の工程において前記放熱接着材を塗布する
ことを特徴とする電子制御装置の製造方法。 - 請求項7記載の電子制御装置の製造方法であって、前記電子部品のはんだ接続工程と、前記放熱接着材の硬化工程を、はんだリフローにより同時に実施することを特徴とする電子制御装置の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013239457 | 2013-11-20 | ||
JP2013239457 | 2013-11-20 | ||
PCT/JP2014/078010 WO2015076050A1 (ja) | 2013-11-20 | 2014-10-22 | 電子制御装置の実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015076050A1 JPWO2015076050A1 (ja) | 2017-03-16 |
JP6307093B2 true JP6307093B2 (ja) | 2018-04-04 |
Family
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JP2015549040A Expired - Fee Related JP6307093B2 (ja) | 2013-11-20 | 2014-10-22 | 電子制御装置、電子制御装置の製造方法 |
Country Status (2)
Country | Link |
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JP (1) | JP6307093B2 (ja) |
WO (1) | WO2015076050A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018014415A (ja) * | 2016-07-21 | 2018-01-25 | Kyb株式会社 | 放熱構造 |
WO2018124288A1 (ja) | 2016-12-28 | 2018-07-05 | 三菱電機株式会社 | 電源装置及び電源装置の製造方法 |
US11234343B2 (en) | 2018-05-03 | 2022-01-25 | Intel Corporation | Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices |
WO2020003423A1 (ja) | 2018-06-27 | 2020-01-02 | 三菱電機株式会社 | 電源装置 |
KR102163763B1 (ko) * | 2019-07-31 | 2020-10-08 | 현대오트론 주식회사 | 하우징과 pcb의 조립구조 |
KR20210058074A (ko) * | 2019-11-13 | 2021-05-24 | 엘지이노텍 주식회사 | 컨버터 |
JP7365295B2 (ja) * | 2020-06-05 | 2023-10-19 | 日立Astemo株式会社 | 車載電子制御装置 |
WO2022068337A1 (zh) * | 2020-09-30 | 2022-04-07 | 东莞市趣电智能科技有限公司 | 一种散热模块及包括其的充电枪和充电座 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
JPH03128965U (ja) * | 1990-04-11 | 1991-12-25 | ||
JP5668621B2 (ja) * | 2011-06-30 | 2015-02-12 | 株式会社デンソー | 電子部品の実装構造 |
-
2014
- 2014-10-22 JP JP2015549040A patent/JP6307093B2/ja not_active Expired - Fee Related
- 2014-10-22 WO PCT/JP2014/078010 patent/WO2015076050A1/ja active Application Filing
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WO2015076050A1 (ja) | 2015-05-28 |
JPWO2015076050A1 (ja) | 2017-03-16 |
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