JP6290179B2 - 金属基材上にプラチナ系金属基層をめっきするための電解質の浴を製造する方法 - Google Patents

金属基材上にプラチナ系金属基層をめっきするための電解質の浴を製造する方法 Download PDF

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JP6290179B2
JP6290179B2 JP2015506292A JP2015506292A JP6290179B2 JP 6290179 B2 JP6290179 B2 JP 6290179B2 JP 2015506292 A JP2015506292 A JP 2015506292A JP 2015506292 A JP2015506292 A JP 2015506292A JP 6290179 B2 JP6290179 B2 JP 6290179B2
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platinum
solution
hpo
salt
bath
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JP2015514873A5 (https=
JP2015514873A (ja
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ユゴー，ジュリエット
ラグランジュ，フレデリック
モレ，エルベ
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サフラン・エアクラフト・エンジンズ
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2015506292A 2012-04-19 2013-04-18 金属基材上にプラチナ系金属基層をめっきするための電解質の浴を製造する方法 Active JP6290179B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1253599 2012-04-19
FR1253599A FR2989694B1 (fr) 2012-04-19 2012-04-19 Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique
PCT/FR2013/050855 WO2013156737A1 (fr) 2012-04-19 2013-04-18 Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique

Publications (3)

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JP2015514873A JP2015514873A (ja) 2015-05-21
JP2015514873A5 JP2015514873A5 (https=) 2017-06-15
JP6290179B2 true JP6290179B2 (ja) 2018-03-07

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JP2015506292A Active JP6290179B2 (ja) 2012-04-19 2013-04-18 金属基材上にプラチナ系金属基層をめっきするための電解質の浴を製造する方法

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Country Link
US (1) US9752243B2 (https=)
EP (1) EP2839059B1 (https=)
JP (1) JP6290179B2 (https=)
CN (1) CN104271811B (https=)
BR (1) BR112014026033B1 (https=)
CA (1) CA2870760C (https=)
FR (1) FR2989694B1 (https=)
IN (1) IN2014DN08735A (https=)
RU (1) RU2625923C2 (https=)
WO (1) WO2013156737A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104975312A (zh) * 2015-07-30 2015-10-14 江苏金曼科技有限责任公司 一种延长镀液使用寿命的电镀方法
FR3058165B1 (fr) 2016-10-27 2018-12-14 Safran Aircraft Engines Procede et dispositif de regeneration de bain de platine
FR3066505B1 (fr) 2017-05-16 2021-04-09 Safran Aircraft Engines Procede et dispositif ameliores de filtration de bain de platine par electrodialyse
CN110894617A (zh) * 2018-09-13 2020-03-20 深圳市永达锐国际科技有限公司 3d铂金电铸工艺方法
CN114214685A (zh) * 2021-09-22 2022-03-22 湘潭大学 高温防护涂层及其制备方法与应用

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL124423C (https=) * 1963-03-20
US3285839A (en) * 1963-12-16 1966-11-15 American Chem & Refining Co Method and bath for electroplating rhenium
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US4182724A (en) * 1976-04-06 1980-01-08 Rustenburg Platinum Mines Limited Compositions containing platinum
SU707382A1 (ru) * 1978-05-30 2000-06-20 Р.В. Джагацпанян Электролит платинирования
SU954527A1 (ru) * 1980-12-30 1982-08-30 Предприятие П/Я В-2287 Электролит дл платинировани титана
US4427502A (en) * 1981-11-16 1984-01-24 Bell Telephone Laboratories, Incorporated Platinum and platinum alloy electroplating baths and processes
GB8821005D0 (en) * 1988-09-07 1988-10-05 Johnson Matthey Plc Improvements in plating
US5041196A (en) * 1989-12-26 1991-08-20 Olin Corporation Electrochemical method for producing chlorine dioxide solutions
JP2577832B2 (ja) * 1990-06-29 1997-02-05 日本エレクトロプレイテイング・エンジニヤース株式会社 白金電鋳浴
JPH04333589A (ja) * 1990-06-29 1992-11-20 Electroplating Eng Of Japan Co 高硬度白金材料の製造方法及びその高硬度白金材料
AU648316B2 (en) 1990-06-29 1994-04-21 Electroplating Engineers Of Japan, Limited Platinum electoforming and platinum electroplating
US5788823A (en) * 1996-07-23 1998-08-04 Howmet Research Corporation Platinum modified aluminide diffusion coating and method
GB2351089B (en) * 1999-06-15 2001-04-18 Hong Kong Productivity Council Platinum electroforming/electroplating bath and method

Also Published As

Publication number Publication date
RU2625923C2 (ru) 2017-07-19
CA2870760A1 (fr) 2013-10-24
BR112014026033A2 (pt) 2017-06-27
US20150075996A1 (en) 2015-03-19
CN104271811A (zh) 2015-01-07
US9752243B2 (en) 2017-09-05
RU2014146284A (ru) 2016-06-10
BR112014026033B1 (pt) 2020-11-24
JP2015514873A (ja) 2015-05-21
EP2839059B1 (fr) 2016-04-13
CA2870760C (fr) 2021-02-23
IN2014DN08735A (https=) 2015-05-22
FR2989694B1 (fr) 2015-02-27
CN104271811B (zh) 2016-10-12
FR2989694A1 (fr) 2013-10-25
EP2839059A1 (fr) 2015-02-25
WO2013156737A1 (fr) 2013-10-24

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