JP6284797B2 - インダクタ、コイル基板及びコイル基板の製造方法 - Google Patents
インダクタ、コイル基板及びコイル基板の製造方法 Download PDFInfo
- Publication number
- JP6284797B2 JP6284797B2 JP2014058650A JP2014058650A JP6284797B2 JP 6284797 B2 JP6284797 B2 JP 6284797B2 JP 2014058650 A JP2014058650 A JP 2014058650A JP 2014058650 A JP2014058650 A JP 2014058650A JP 6284797 B2 JP6284797 B2 JP 6284797B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- substrate
- layer
- coil
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014058650A JP6284797B2 (ja) | 2014-03-20 | 2014-03-20 | インダクタ、コイル基板及びコイル基板の製造方法 |
| CN201510119783.XA CN104934298B (zh) | 2014-03-20 | 2015-03-18 | 电感器、线圈基板以及线圈基板的制造方法 |
| US14/661,535 US9147518B1 (en) | 2014-03-20 | 2015-03-18 | Inductor and coil substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014058650A JP6284797B2 (ja) | 2014-03-20 | 2014-03-20 | インダクタ、コイル基板及びコイル基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015185589A JP2015185589A (ja) | 2015-10-22 |
| JP2015185589A5 JP2015185589A5 (OSRAM) | 2017-02-09 |
| JP6284797B2 true JP6284797B2 (ja) | 2018-02-28 |
Family
ID=54121414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014058650A Active JP6284797B2 (ja) | 2014-03-20 | 2014-03-20 | インダクタ、コイル基板及びコイル基板の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9147518B1 (OSRAM) |
| JP (1) | JP6284797B2 (OSRAM) |
| CN (1) | CN104934298B (OSRAM) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6312997B2 (ja) * | 2013-07-31 | 2018-04-18 | 新光電気工業株式会社 | コイル基板及びその製造方法、インダクタ |
| KR101751117B1 (ko) | 2015-07-31 | 2017-06-26 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
| US10249580B2 (en) | 2016-06-22 | 2019-04-02 | Qualcomm Incorporated | Stacked substrate inductor |
| JP6593262B2 (ja) * | 2016-07-06 | 2019-10-23 | 株式会社村田製作所 | 電子部品 |
| JP6558329B2 (ja) * | 2016-09-01 | 2019-08-14 | 株式会社村田製作所 | 電子部品 |
| JP6296407B1 (ja) * | 2017-02-02 | 2018-03-20 | 株式会社伸光製作所 | 多列型プリント基板とその製造方法 |
| JP6261104B1 (ja) * | 2017-03-30 | 2018-01-17 | 株式会社伸光製作所 | プリント基板の製造方法 |
| JP7464352B2 (ja) * | 2018-03-09 | 2024-04-09 | 日東電工株式会社 | 配線基板およびその製造方法 |
| JP7147714B2 (ja) * | 2019-08-05 | 2022-10-05 | 株式会社村田製作所 | コイル部品 |
| CN110658426B (zh) * | 2019-10-09 | 2021-06-29 | 深圳华络电子有限公司 | 一种电感器失效模式及耐压值的测试方法 |
| CN113012902B (zh) * | 2021-02-25 | 2023-03-14 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | 一种平面电感器及其制造方法 |
| CN113284734B (zh) * | 2021-05-24 | 2022-08-19 | 深圳市信维通信股份有限公司 | 摄像头用vcm线圈模组的制造工艺 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752114A (en) * | 1980-09-16 | 1982-03-27 | Asahi Chem Ind Co Ltd | Fine coil |
| JPS5753916A (ja) * | 1980-09-17 | 1982-03-31 | Asahi Chem Ind Co Ltd | Maikurotoransu |
| JPS61124117A (ja) * | 1984-11-20 | 1986-06-11 | Matsushita Electric Ind Co Ltd | プリントコイルの製造方法 |
| US4959631A (en) * | 1987-09-29 | 1990-09-25 | Kabushiki Kaisha Toshiba | Planar inductor |
| JPH04352305A (ja) * | 1991-05-29 | 1992-12-07 | Murata Mfg Co Ltd | 三層構造スパイラルインダクタのインダクタンスの調整方法 |
| US5363080A (en) * | 1991-12-27 | 1994-11-08 | Avx Corporation | High accuracy surface mount inductor |
| JP3173941B2 (ja) * | 1993-12-27 | 2001-06-04 | 太陽誘電株式会社 | コイル導体内蔵部品の製造方法 |
| EP1325545A4 (en) * | 2000-09-22 | 2004-11-24 | Flex Multi Fineline Electronix | ELECTRONIC TRANSMITTER / INDUCTIVITY COMPONENTS AND METHOD FOR THEIR PRODUCTION |
| JP2003168610A (ja) | 2001-11-29 | 2003-06-13 | Toko Inc | インダクタンス素子 |
| EP2051264A1 (en) * | 2006-08-01 | 2009-04-22 | NEC Corporation | Inductor element, inductor element manufacturing method, and semiconductor device with inductor element mounted thereon |
| KR101162154B1 (ko) * | 2008-04-28 | 2012-07-04 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 코일 부품 및 그 제조 방법 |
| JP4692574B2 (ja) * | 2008-05-26 | 2011-06-01 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| WO2012020590A1 (ja) * | 2010-08-11 | 2012-02-16 | 株式会社村田製作所 | 電子部品 |
| US9236171B2 (en) * | 2010-10-21 | 2016-01-12 | Tdk Corporation | Coil component and method for producing same |
| JP2012119384A (ja) * | 2010-11-29 | 2012-06-21 | Tdk Corp | 積層インダクタ部品の製造方法 |
| JP5873316B2 (ja) * | 2011-12-14 | 2016-03-01 | 旭化成エレクトロニクス株式会社 | 平面コイル、平面コイルの製造方法 |
| JP5451791B2 (ja) * | 2012-02-08 | 2014-03-26 | 太陽誘電株式会社 | 積層インダクタ |
| JP6293995B2 (ja) * | 2012-03-23 | 2018-03-14 | 新光電気工業株式会社 | 発光素子搭載用パッケージ及びその製造方法、並びに発光素子パッケージ |
| JP6001921B2 (ja) * | 2012-05-25 | 2016-10-05 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| KR101792281B1 (ko) * | 2012-12-14 | 2017-11-01 | 삼성전기주식회사 | 파워 인덕터 및 그 제조 방법 |
| JP5614479B2 (ja) * | 2013-08-09 | 2014-10-29 | Tdk株式会社 | コイル部品の製造方法 |
-
2014
- 2014-03-20 JP JP2014058650A patent/JP6284797B2/ja active Active
-
2015
- 2015-03-18 CN CN201510119783.XA patent/CN104934298B/zh active Active
- 2015-03-18 US US14/661,535 patent/US9147518B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104934298B (zh) | 2019-06-28 |
| US20150270055A1 (en) | 2015-09-24 |
| JP2015185589A (ja) | 2015-10-22 |
| US9147518B1 (en) | 2015-09-29 |
| CN104934298A (zh) | 2015-09-23 |
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