JP6278451B2 - マーキング装置およびパターン生成装置 - Google Patents

マーキング装置およびパターン生成装置 Download PDF

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Publication number
JP6278451B2
JP6278451B2 JP2014037194A JP2014037194A JP6278451B2 JP 6278451 B2 JP6278451 B2 JP 6278451B2 JP 2014037194 A JP2014037194 A JP 2014037194A JP 2014037194 A JP2014037194 A JP 2014037194A JP 6278451 B2 JP6278451 B2 JP 6278451B2
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JP
Japan
Prior art keywords
marking
drawing pattern
unit
pattern
reference mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014037194A
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English (en)
Japanese (ja)
Other versions
JP2015160235A (ja
Inventor
正則 田尾
正則 田尾
岡部　均
均 岡部
友哉 中谷
友哉 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP2014037194A priority Critical patent/JP6278451B2/ja
Priority to KR1020167023118A priority patent/KR102192600B1/ko
Priority to CN201580009197.8A priority patent/CN106029288A/zh
Priority to PCT/JP2015/050866 priority patent/WO2015129316A1/ja
Priority to TW104103071A priority patent/TWI627006B/zh
Publication of JP2015160235A publication Critical patent/JP2015160235A/ja
Application granted granted Critical
Publication of JP6278451B2 publication Critical patent/JP6278451B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2014037194A 2014-02-27 2014-02-27 マーキング装置およびパターン生成装置 Expired - Fee Related JP6278451B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014037194A JP6278451B2 (ja) 2014-02-27 2014-02-27 マーキング装置およびパターン生成装置
KR1020167023118A KR102192600B1 (ko) 2014-02-27 2015-01-15 마킹 장치 및 패턴 생성 장치
CN201580009197.8A CN106029288A (zh) 2014-02-27 2015-01-15 标印装置和图案生成装置
PCT/JP2015/050866 WO2015129316A1 (ja) 2014-02-27 2015-01-15 マーキング装置およびパターン生成装置
TW104103071A TWI627006B (zh) 2014-02-27 2015-01-29 Marking device and pattern generating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014037194A JP6278451B2 (ja) 2014-02-27 2014-02-27 マーキング装置およびパターン生成装置

Publications (2)

Publication Number Publication Date
JP2015160235A JP2015160235A (ja) 2015-09-07
JP6278451B2 true JP6278451B2 (ja) 2018-02-14

Family

ID=54008645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014037194A Expired - Fee Related JP6278451B2 (ja) 2014-02-27 2014-02-27 マーキング装置およびパターン生成装置

Country Status (5)

Country Link
JP (1) JP6278451B2 (ko)
KR (1) KR102192600B1 (ko)
CN (1) CN106029288A (ko)
TW (1) TWI627006B (ko)
WO (1) WO2015129316A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4083569A1 (en) 2021-02-26 2022-11-02 Ricoh Company, Ltd. Laser irradiation apparatus, laser irradiation method, container, and containment body

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017043030A1 (ja) 2015-09-07 2017-03-16 凸版印刷株式会社 レーザー加工装置
JP6079844B1 (ja) * 2015-09-07 2017-02-15 凸版印刷株式会社 フィルムへのレーザー加工方法
JP6608236B2 (ja) * 2015-10-09 2019-11-20 東レエンジニアリング株式会社 マーキング装置
EP3421225A1 (de) 2017-06-26 2019-01-02 Raylase GmbH Automatisierte kalibrierung einer vorrichtung zur vollparallelisierten additiven fertigung eines bauteils mit kombinierten arbeitsfeldern
CN111263678A (zh) * 2017-10-25 2020-06-09 株式会社尼康 加工装置、加工系统、及移动体的制造方法
JP6740293B2 (ja) 2018-08-03 2020-08-12 ファナック株式会社 レーザ加工装置の制御装置及びレーザ加工装置
CN109014595B (zh) * 2018-09-12 2024-07-05 昆山卓研智能科技有限公司 离线全自动标识设备
JP7252769B2 (ja) * 2019-02-01 2023-04-05 株式会社ディスコ アライメント方法
JP2022129829A (ja) 2021-02-25 2022-09-06 株式会社リコー マーキング装置、媒体、収容体及びマーキング方法
CN114260588B (zh) * 2022-01-10 2022-12-09 中国科学院力学研究所 一种振镜式大幅面激光飞行打标方法
CN116851929A (zh) * 2023-09-04 2023-10-10 武汉华工激光工程有限责任公司 一种运动状态下的物体视觉定位激光打标方法及系统
CN117260002B (zh) * 2023-11-20 2024-02-09 西安精谐科技有限责任公司 基于激光加工的半球谐振陀螺电极及加工方法、系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11509781A (ja) * 1996-04-26 1999-08-31 セルビシオ インダストリアル ド マルカジェ イコディフィカシオン，エス．エイ． マーキングまたはパーフォレーションのための装置と方法
JP4461740B2 (ja) 2003-08-21 2010-05-12 オムロン株式会社 レーザマーキング装置
JP3872462B2 (ja) 2003-09-01 2007-01-24 住友重機械工業株式会社 レーザ加工装置、及びレーザ加工方法
JP2006095931A (ja) * 2004-09-30 2006-04-13 Dainippon Screen Mfg Co Ltd 印刷版の製版方法および印刷版の製版装置
JP2006224481A (ja) * 2005-02-18 2006-08-31 Dainippon Screen Mfg Co Ltd 印刷版の製版装置
JP5248205B2 (ja) 2008-05-29 2013-07-31 パナソニック デバイスＳｕｎｘ株式会社 レーザマーキング装置
JP4734437B2 (ja) * 2009-04-17 2011-07-27 沓名 宗春 繊維強化複合材料のレーザ加工方法
JP5896459B2 (ja) * 2012-03-06 2016-03-30 東レエンジニアリング株式会社 マーキング装置及び方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4083569A1 (en) 2021-02-26 2022-11-02 Ricoh Company, Ltd. Laser irradiation apparatus, laser irradiation method, container, and containment body
EP4083569B1 (en) * 2021-02-26 2024-07-24 Ricoh Company, Ltd. Laser irradiation apparatus and method

Also Published As

Publication number Publication date
CN106029288A (zh) 2016-10-12
JP2015160235A (ja) 2015-09-07
TWI627006B (zh) 2018-06-21
KR20160125971A (ko) 2016-11-01
TW201532720A (zh) 2015-09-01
KR102192600B1 (ko) 2020-12-17
WO2015129316A1 (ja) 2015-09-03

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