JP6269660B2 - 基板処理装置、デバイス製造方法及び円筒マスク - Google Patents

基板処理装置、デバイス製造方法及び円筒マスク Download PDF

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Publication number
JP6269660B2
JP6269660B2 JP2015514784A JP2015514784A JP6269660B2 JP 6269660 B2 JP6269660 B2 JP 6269660B2 JP 2015514784 A JP2015514784 A JP 2015514784A JP 2015514784 A JP2015514784 A JP 2015514784A JP 6269660 B2 JP6269660 B2 JP 6269660B2
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Japan
Prior art keywords
mask
substrate
cylindrical
pattern
projection
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Japanese (ja)
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JPWO2014178244A1 (ja
Inventor
加藤　正紀
正紀 加藤
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2015514784A 2013-04-30 2014-03-26 基板処理装置、デバイス製造方法及び円筒マスク Active JP6269660B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013095647 2013-04-30
JP2013095647 2013-04-30
PCT/JP2014/058590 WO2014178244A1 (ja) 2013-04-30 2014-03-26 基板処理装置、デバイス製造方法及び円筒マスク

Related Child Applications (1)

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JP2017250253A Division JP6485535B2 (ja) 2013-04-30 2017-12-26 円筒マスク

Publications (2)

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JPWO2014178244A1 JPWO2014178244A1 (ja) 2017-02-23
JP6269660B2 true JP6269660B2 (ja) 2018-01-31

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JP2015514784A Active JP6269660B2 (ja) 2013-04-30 2014-03-26 基板処理装置、デバイス製造方法及び円筒マスク
JP2017250253A Active JP6485535B2 (ja) 2013-04-30 2017-12-26 円筒マスク
JP2019002306A Active JP6662473B2 (ja) 2013-04-30 2019-01-10 露光方法
JP2019028053A Active JP6638835B2 (ja) 2013-04-30 2019-02-20 基板処理装置
JP2019234590A Active JP6816814B2 (ja) 2013-04-30 2019-12-25 走査露光方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2017250253A Active JP6485535B2 (ja) 2013-04-30 2017-12-26 円筒マスク
JP2019002306A Active JP6662473B2 (ja) 2013-04-30 2019-01-10 露光方法
JP2019028053A Active JP6638835B2 (ja) 2013-04-30 2019-02-20 基板処理装置
JP2019234590A Active JP6816814B2 (ja) 2013-04-30 2019-12-25 走査露光方法

Country Status (6)

Country Link
JP (5) JP6269660B2 (zh)
KR (5) KR102079793B1 (zh)
CN (4) CN107255910B (zh)
HK (3) HK1246405B (zh)
TW (5) TWI717946B (zh)
WO (1) WO2014178244A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018081320A (ja) * 2013-04-30 2018-05-24 株式会社ニコン 円筒マスク及び露光方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6743884B2 (ja) * 2016-03-30 2020-08-19 株式会社ニコン パターン描画装置、パターン描画方法
JP7114459B2 (ja) * 2016-05-19 2022-08-08 株式会社ニコン パターニング装置
CN114096797B (zh) * 2020-01-31 2024-03-22 日本精工株式会社 旋转角度传感器、电动助力转向装置以及旋转角度传感器的制造方法

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JPS6019037U (ja) * 1983-07-18 1985-02-08 株式会社リコー 露光装置
JPH01128069A (ja) * 1987-11-12 1989-05-19 Dainippon Screen Mfg Co Ltd スリット走査露光式複写カメラの試写像露光装置
JPH01175730A (ja) * 1987-12-29 1989-07-12 Matsushita Electric Ind Co Ltd 露光装置
US5640227A (en) 1993-12-06 1997-06-17 Nikon Corporation Exposure apparatus and exposure method for minimizing defocusing of the transferred pattern
US6018383A (en) * 1997-08-20 2000-01-25 Anvik Corporation Very large area patterning system for flexible substrates
JP2000035677A (ja) * 1998-07-17 2000-02-02 Adtec Engineeng:Kk 露光装置
US6411362B2 (en) * 1999-01-04 2002-06-25 International Business Machines Corporation Rotational mask scanning exposure method and apparatus
CN100396945C (zh) * 2002-02-28 2008-06-25 富士通株式会社 动压轴承的制造方法、动压轴承及动压轴承制造装置
JP2007227438A (ja) * 2006-02-21 2007-09-06 Nikon Corp 露光装置及び方法並びに光露光用マスク
JP4984631B2 (ja) 2006-04-28 2012-07-25 株式会社ニコン 露光装置及び方法、露光用マスク、並びにデバイス製造方法
TWI481968B (zh) * 2006-09-08 2015-04-21 尼康股份有限公司 A mask, an exposure device, and an element manufacturing method
JP2009026933A (ja) * 2007-07-19 2009-02-05 Konica Minolta Holdings Inc 電磁波遮蔽フィルムの製造方法及び電磁波遮蔽フィルム
JP2009237305A (ja) * 2008-03-27 2009-10-15 Mitsubishi Paper Mills Ltd マスクパターンフィルムの巻き付け機構及び露光装置
JPWO2011129369A1 (ja) * 2010-04-13 2013-07-18 株式会社ニコン 露光装置、基板処理装置及びデバイス製造方法
JP5724564B2 (ja) * 2010-04-13 2015-05-27 株式会社ニコン マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法
JP2011221536A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスク移動装置、露光装置、基板処理装置及びデバイス製造方法
JP2012252076A (ja) * 2011-06-01 2012-12-20 Nikon Corp 露光装置
JP6056756B2 (ja) * 2011-09-06 2017-01-11 株式会社ニコン 基板処理装置およびパターン露光方法
CN103477286A (zh) * 2011-09-07 2013-12-25 株式会社尼康 基板处理装置
CN103958379B (zh) * 2011-11-04 2016-12-28 株式会社尼康 基板处理装置及基板处理方法
TWI641915B (zh) * 2012-01-12 2018-11-21 尼康股份有限公司 基板處理裝置、基板處理方法、及圓筒狀光罩
JP5594328B2 (ja) * 2012-07-19 2014-09-24 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法。
KR101405251B1 (ko) * 2012-09-10 2014-06-17 경북대학교 산학협력단 노광 장치 및 이를 사용한 기판 처리 장치
CN107255910B (zh) * 2013-04-30 2019-04-02 株式会社尼康 圆筒光罩

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018081320A (ja) * 2013-04-30 2018-05-24 株式会社ニコン 円筒マスク及び露光方法
JP2019070840A (ja) * 2013-04-30 2019-05-09 株式会社ニコン 露光方法

Also Published As

Publication number Publication date
CN107390480A (zh) 2017-11-24
TW201809909A (zh) 2018-03-16
KR20190104256A (ko) 2019-09-06
JP2020064317A (ja) 2020-04-23
CN105359040B (zh) 2018-01-19
JP2019074769A (ja) 2019-05-16
KR102096961B1 (ko) 2020-04-03
JP6485535B2 (ja) 2019-03-20
JP2019070840A (ja) 2019-05-09
TWI610143B (zh) 2018-01-01
KR102019620B1 (ko) 2019-09-06
HK1215308A1 (zh) 2016-08-19
CN107255910B (zh) 2019-04-02
JP6816814B2 (ja) 2021-01-20
JP6662473B2 (ja) 2020-03-11
KR101924255B1 (ko) 2018-11-30
KR20180128520A (ko) 2018-12-03
CN105359040A (zh) 2016-02-24
TWI677767B (zh) 2019-11-21
HK1245419B (zh) 2019-11-29
HK1246405B (zh) 2020-05-15
TW201445262A (zh) 2014-12-01
JPWO2014178244A1 (ja) 2017-02-23
KR20160003181A (ko) 2016-01-08
JP2018081320A (ja) 2018-05-24
CN108227408B (zh) 2020-02-14
TW201907244A (zh) 2019-02-16
CN107255910A (zh) 2017-10-17
KR20200019782A (ko) 2020-02-24
KR20180128521A (ko) 2018-12-03
TWI646407B (zh) 2019-01-01
KR101979562B1 (ko) 2019-05-16
TWI717946B (zh) 2021-02-01
CN107390480B (zh) 2019-08-13
WO2014178244A1 (ja) 2014-11-06
TW201908880A (zh) 2019-03-01
CN108227408A (zh) 2018-06-29
KR102079793B1 (ko) 2020-02-21
TW202014807A (zh) 2020-04-16
JP6638835B2 (ja) 2020-01-29
TWI681263B (zh) 2020-01-01

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