JP6239576B2 - ワイヤグリッド偏光子の製造方法 - Google Patents
ワイヤグリッド偏光子の製造方法 Download PDFInfo
- Publication number
- JP6239576B2 JP6239576B2 JP2015243451A JP2015243451A JP6239576B2 JP 6239576 B2 JP6239576 B2 JP 6239576B2 JP 2015243451 A JP2015243451 A JP 2015243451A JP 2015243451 A JP2015243451 A JP 2015243451A JP 6239576 B2 JP6239576 B2 JP 6239576B2
- Authority
- JP
- Japan
- Prior art keywords
- mask layer
- layer
- metal film
- wire grid
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 85
- 239000010410 layer Substances 0.000 claims description 360
- 229910052751 metal Inorganic materials 0.000 claims description 213
- 239000002184 metal Substances 0.000 claims description 213
- 238000005530 etching Methods 0.000 claims description 65
- 239000000463 material Substances 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 39
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000002086 nanomaterial Substances 0.000 claims description 19
- 238000001771 vacuum deposition Methods 0.000 claims description 17
- 238000000059 patterning Methods 0.000 claims description 16
- 229910010272 inorganic material Inorganic materials 0.000 claims description 15
- 239000011147 inorganic material Substances 0.000 claims description 15
- 238000001312 dry etching Methods 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 9
- 239000002346 layers by function Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010408 film Substances 0.000 description 106
- 238000007740 vapor deposition Methods 0.000 description 12
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 230000001965 increasing effect Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 7
- 230000009257 reactivity Effects 0.000 description 6
- 238000010924 continuous production Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 238000000992 sputter etching Methods 0.000 description 3
- 238000005019 vapor deposition process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007687 exposure technique Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910003471 inorganic composite material Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002094 self assembled monolayer Substances 0.000 description 1
- 239000013545 self-assembled monolayer Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
- G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
- G02B5/3058—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state comprising electrically conductive elements, e.g. wire grids, conductive particles
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Polarising Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0131007 | 2015-09-16 | ||
| KR1020150131007A KR101729683B1 (ko) | 2015-09-16 | 2015-09-16 | 선격자 편광자의 제조 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017058653A JP2017058653A (ja) | 2017-03-23 |
| JP6239576B2 true JP6239576B2 (ja) | 2017-11-29 |
Family
ID=55262632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015243451A Active JP6239576B2 (ja) | 2015-09-16 | 2015-12-14 | ワイヤグリッド偏光子の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9638851B2 (zh) |
| EP (1) | EP3144708B1 (zh) |
| JP (1) | JP6239576B2 (zh) |
| KR (1) | KR101729683B1 (zh) |
| CN (1) | CN106547043B (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108351603A (zh) * | 2016-01-27 | 2018-07-31 | 株式会社Lg化学 | 膜掩模、其制备方法和使用膜掩模的图案形成方法 |
| WO2017131499A1 (ko) | 2016-01-27 | 2017-08-03 | 주식회사 엘지화학 | 필름 마스크, 이의 제조방법, 이를 이용한 패턴 형성 방법 및 이를 이용하여 형성된 패턴 |
| US11029596B2 (en) | 2016-01-27 | 2021-06-08 | Lg Chem, Ltd. | Film mask, method for manufacturing same, and method for forming pattern using film mask and pattern formed thereby |
| KR102567008B1 (ko) * | 2016-03-18 | 2023-08-14 | 삼성디스플레이 주식회사 | 금속선 편광자를 포함하는 표시 장치 및 그 제조 방법 |
| CN109031498B (zh) * | 2018-08-20 | 2020-10-13 | 武汉华星光电半导体显示技术有限公司 | 自组装法制备超薄偏光片的方法、超薄偏光片及显示面板 |
| CN109270620B (zh) * | 2018-11-16 | 2022-07-19 | 京东方科技集团股份有限公司 | 金属线栅偏振片的制作方法及显示面板 |
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| JPH04298382A (ja) * | 1991-03-27 | 1992-10-22 | Toppan Printing Co Ltd | 外装用転写シート |
| JPH04296382A (ja) | 1991-03-27 | 1992-10-20 | Nippon Valqua Ind Ltd | 膨張黒鉛製パッキン及びその製造方法 |
| DE19834367A1 (de) * | 1998-07-30 | 2000-02-03 | Meto International Gmbh | Bandmaterial, Sicherungselement und Verfahren zur Herstellung eines Sicherungselements für die elektronische Artikelsicherung |
| US7229847B2 (en) * | 2002-03-15 | 2007-06-12 | Lucent Technologies Inc. | Forming electrical contacts to a molecular layer |
| US6946332B2 (en) * | 2002-03-15 | 2005-09-20 | Lucent Technologies Inc. | Forming nanoscale patterned thin film metal layers |
| US7161168B2 (en) * | 2002-07-30 | 2007-01-09 | The Regents Of The University Of California | Superlattice nanopatterning of wires and complex patterns |
| US7964439B2 (en) | 2002-12-20 | 2011-06-21 | The Trustees Of Princeton University | Methods of fabricating devices by transfer of organic material |
| US8222072B2 (en) * | 2002-12-20 | 2012-07-17 | The Trustees Of Princeton University | Methods of fabricating devices by low pressure cold welding |
| KR100609167B1 (ko) | 2003-10-21 | 2006-08-02 | 엘지전자 주식회사 | 선격자 편광판 제조 방법 |
| US7534633B2 (en) * | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
| US20060056024A1 (en) | 2004-09-15 | 2006-03-16 | Ahn Seh W | Wire grid polarizer and manufacturing method thereof |
| JP2006084776A (ja) | 2004-09-16 | 2006-03-30 | Lg Electronics Inc | ワイヤーグリッド偏光子及びその製造方法 |
| WO2007044028A2 (en) | 2004-11-30 | 2007-04-19 | Agoura Technologies, Inc. | Applications and fabrication techniques for large scale wire grid polarizers |
| US7351346B2 (en) | 2004-11-30 | 2008-04-01 | Agoura Technologies, Inc. | Non-photolithographic method for forming a wire grid polarizer for optical and infrared wavelengths |
| KR20070027083A (ko) | 2005-08-29 | 2007-03-09 | 엘지전자 주식회사 | 선 격자 편광자 제조 방법 |
| US20070183025A1 (en) * | 2005-10-31 | 2007-08-09 | Koji Asakawa | Short-wavelength polarizing elements and the manufacture and use thereof |
| JP5193454B2 (ja) * | 2005-10-31 | 2013-05-08 | 株式会社東芝 | 短波長用偏光素子及び偏光素子製造方法 |
| KR20080015536A (ko) | 2006-08-16 | 2008-02-20 | 삼성전자주식회사 | 와이어 그리드 편광자 제조 시스템 및 제조 방법 |
| JP5026759B2 (ja) | 2006-10-05 | 2012-09-19 | 旭化成イーマテリアルズ株式会社 | ワイヤグリッド偏光板及びその製造方法 |
| EP1978406A1 (en) * | 2007-03-30 | 2008-10-08 | Sony Deutschland Gmbh | A method of preparing a substrate having a layer or pattern of metal on it |
| TWI335490B (en) * | 2007-06-01 | 2011-01-01 | Univ Nat Cheng Kung | Nano-imprinting process |
| JP5045249B2 (ja) | 2007-06-01 | 2012-10-10 | セイコーエプソン株式会社 | 偏光素子の製造方法 |
| JP2009105252A (ja) | 2007-10-24 | 2009-05-14 | Cheil Industries Inc | 微細パターンの製造方法および光学素子 |
| JP2009145742A (ja) | 2007-12-17 | 2009-07-02 | Cheil Industries Inc | ワイヤグリッド偏光子の製造方法 |
| ATE545064T1 (de) * | 2008-02-25 | 2012-02-15 | Sony Corp | Verfahren zur aufbringung einer struktur aus metall, metalloxid und/oder halbleitermaterial auf einem träger |
| US9793481B2 (en) * | 2008-10-01 | 2017-10-17 | The Regents Of The University Of Michigan | Patterning by stamped metal resist |
| KR101022506B1 (ko) | 2008-12-24 | 2011-03-16 | 한국기계연구원 | 쉐도우 증착과 나노전사 프린팅을 이용한 나노임프린트 리소그래피의 패턴전사 방법 |
| KR101437924B1 (ko) * | 2010-01-22 | 2014-09-11 | 한국생명공학연구원 | 경사 증착을 이용한 리소그래피 방법 |
| KR101088359B1 (ko) | 2010-03-24 | 2011-12-01 | 한국기계연구원 | 나노임프린트를 이용한 패턴 형성방법 |
| EP3339052B1 (de) * | 2010-06-28 | 2022-11-02 | Leonhard Kurz Stiftung & Co. KG | Verfahren zur dekoration von oberflächen |
| JP2012108352A (ja) | 2010-11-18 | 2012-06-07 | Asahi Kasei Corp | 光学素子及びその製造方法 |
| US9720330B2 (en) * | 2012-04-17 | 2017-08-01 | The Regents Of The University Of Michigan | Methods for making micro- and nano-scale conductive grids for transparent electrodes and polarizers by roll to roll optical lithography |
| KR20130116978A (ko) | 2012-04-17 | 2013-10-25 | 삼성디스플레이 주식회사 | 포토레지스트 조성물, 이를 이용한 편광자 제조방법 및 표시 기판의 제조방법 |
| KR20130126391A (ko) | 2012-05-11 | 2013-11-20 | 주식회사 엘지화학 | 와이어 그리드 편광자 제조방법 및 그 제조방법을 이용한 와이어 그리드 편광자 |
| CN104755971B (zh) * | 2012-08-29 | 2017-09-29 | Lg化学株式会社 | 偏振紫外线分离元件 |
| JP5929860B2 (ja) * | 2013-09-24 | 2016-06-08 | ウシオ電機株式会社 | グリッド偏光素子製造方法 |
| JP6234764B2 (ja) | 2013-10-16 | 2017-11-22 | 株式会社アルバック | ワイヤーグリッド偏光子の製造方法、および、ワイヤーグリッド偏光子用基材 |
| CN103760681B (zh) * | 2014-01-21 | 2017-08-25 | 国家纳米科学中心 | 一种基于金属纳米光栅的微偏振片阵列的制作方法 |
| CN104459865A (zh) * | 2014-12-30 | 2015-03-25 | 京东方科技集团股份有限公司 | 一种线栅偏振片及其制作方法、显示装置 |
-
2015
- 2015-09-16 KR KR1020150131007A patent/KR101729683B1/ko active IP Right Grant
- 2015-12-04 US US14/958,989 patent/US9638851B2/en active Active
- 2015-12-07 EP EP15198271.7A patent/EP3144708B1/en active Active
- 2015-12-14 JP JP2015243451A patent/JP6239576B2/ja active Active
- 2015-12-21 CN CN201510965053.1A patent/CN106547043B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3144708A1 (en) | 2017-03-22 |
| EP3144708B1 (en) | 2020-04-29 |
| US20170075051A1 (en) | 2017-03-16 |
| KR101729683B1 (ko) | 2017-04-25 |
| CN106547043A (zh) | 2017-03-29 |
| JP2017058653A (ja) | 2017-03-23 |
| KR20170033106A (ko) | 2017-03-24 |
| CN106547043B (zh) | 2019-03-08 |
| US9638851B2 (en) | 2017-05-02 |
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