JP6232762B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP6232762B2
JP6232762B2 JP2013122641A JP2013122641A JP6232762B2 JP 6232762 B2 JP6232762 B2 JP 6232762B2 JP 2013122641 A JP2013122641 A JP 2013122641A JP 2013122641 A JP2013122641 A JP 2013122641A JP 6232762 B2 JP6232762 B2 JP 6232762B2
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
resin
curing agent
minutes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013122641A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014015608A (ja
Inventor
中村　茂雄
茂雄 中村
賢司 川合
賢司 川合
嘉生 西村
嘉生 西村
ちひろ 三宅
ちひろ 三宅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2013122641A priority Critical patent/JP6232762B2/ja
Publication of JP2014015608A publication Critical patent/JP2014015608A/ja
Application granted granted Critical
Publication of JP6232762B2 publication Critical patent/JP6232762B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2013122641A 2012-06-12 2013-06-11 樹脂組成物 Active JP6232762B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013122641A JP6232762B2 (ja) 2012-06-12 2013-06-11 樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012132816 2012-06-12
JP2012132816 2012-06-12
JP2013122641A JP6232762B2 (ja) 2012-06-12 2013-06-11 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2014015608A JP2014015608A (ja) 2014-01-30
JP6232762B2 true JP6232762B2 (ja) 2017-11-22

Family

ID=49984560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013122641A Active JP6232762B2 (ja) 2012-06-12 2013-06-11 樹脂組成物

Country Status (3)

Country Link
JP (1) JP6232762B2 (ko)
KR (1) KR102078522B1 (ko)
TW (1) TWI601756B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015151483A (ja) * 2014-02-17 2015-08-24 三菱瓦斯化学株式会社 レジンシート、金属箔張積層板及びプリント配線板
TWI653312B (zh) * 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
JP6485728B2 (ja) * 2014-05-23 2019-03-20 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、それを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
JP6848950B2 (ja) * 2018-10-30 2021-03-24 味の素株式会社 樹脂組成物
KR102376880B1 (ko) * 2019-07-04 2022-03-21 (주)이녹스첨단소재 인쇄배선판용 층간 절연재, 이를 포함하는 층간 절연필름 및 이의 제조방법
CN112852104B (zh) * 2021-01-11 2023-02-28 广东生益科技股份有限公司 一种热固性树脂组合物及其应用
CN113462128B (zh) * 2021-06-30 2022-10-21 湖北三选科技有限公司 一种树脂组合物、功能膜及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227992A (ja) * 2008-02-29 2009-10-08 Sekisui Chem Co Ltd フィルム及びプリント配線板
WO2010061980A1 (ja) * 2008-11-28 2010-06-03 味の素株式会社 樹脂組成物
JP5249903B2 (ja) * 2009-10-22 2013-07-31 味の素株式会社 樹脂組成物
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
WO2011111847A1 (ja) * 2010-03-08 2011-09-15 味の素株式会社 樹脂組成物
JP5303524B2 (ja) 2010-08-11 2013-10-02 積水化学工業株式会社 エポキシ樹脂材料、積層フィルム及び多層基板

Also Published As

Publication number Publication date
JP2014015608A (ja) 2014-01-30
TW201412808A (zh) 2014-04-01
KR20130139175A (ko) 2013-12-20
TWI601756B (zh) 2017-10-11
KR102078522B1 (ko) 2020-02-18

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