JP6230777B2 - 配線基板、配線基板の製造方法、及び発光装置 - Google Patents

配線基板、配線基板の製造方法、及び発光装置 Download PDF

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Publication number
JP6230777B2
JP6230777B2 JP2012016710A JP2012016710A JP6230777B2 JP 6230777 B2 JP6230777 B2 JP 6230777B2 JP 2012016710 A JP2012016710 A JP 2012016710A JP 2012016710 A JP2012016710 A JP 2012016710A JP 6230777 B2 JP6230777 B2 JP 6230777B2
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Prior art keywords
wiring
layer
wiring pattern
substrate
heat conducting
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JP2012016710A
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English (en)
Japanese (ja)
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JP2013157441A5 (cg-RX-API-DMAC7.html
JP2013157441A (ja
Inventor
元 中西
元 中西
中村　敦
敦 中村
松本　隆幸
隆幸 松本
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
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Priority to JP2012016710A priority Critical patent/JP6230777B2/ja
Priority to US13/742,669 priority patent/US9101048B2/en
Priority to EP13152287.2A priority patent/EP2621249B1/en
Priority to CN201310024378.0A priority patent/CN103227263B/zh
Publication of JP2013157441A publication Critical patent/JP2013157441A/ja
Publication of JP2013157441A5 publication Critical patent/JP2013157441A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2012016710A 2012-01-30 2012-01-30 配線基板、配線基板の製造方法、及び発光装置 Active JP6230777B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012016710A JP6230777B2 (ja) 2012-01-30 2012-01-30 配線基板、配線基板の製造方法、及び発光装置
US13/742,669 US9101048B2 (en) 2012-01-30 2013-01-16 Printed wiring board and method of manufacturing printed wiring board
EP13152287.2A EP2621249B1 (en) 2012-01-30 2013-01-23 Printed wiring board and method of manufacturing printed wiring board.
CN201310024378.0A CN103227263B (zh) 2012-01-30 2013-01-23 配线基板及配线基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012016710A JP6230777B2 (ja) 2012-01-30 2012-01-30 配線基板、配線基板の製造方法、及び発光装置

Publications (3)

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JP2013157441A JP2013157441A (ja) 2013-08-15
JP2013157441A5 JP2013157441A5 (cg-RX-API-DMAC7.html) 2015-02-19
JP6230777B2 true JP6230777B2 (ja) 2017-11-15

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Country Link
US (1) US9101048B2 (cg-RX-API-DMAC7.html)
EP (1) EP2621249B1 (cg-RX-API-DMAC7.html)
JP (1) JP6230777B2 (cg-RX-API-DMAC7.html)
CN (1) CN103227263B (cg-RX-API-DMAC7.html)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
US9087777B2 (en) * 2013-03-14 2015-07-21 United Test And Assembly Center Ltd. Semiconductor packages and methods of packaging semiconductor devices
JP6316731B2 (ja) * 2014-01-14 2018-04-25 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体パッケージ
JP6335619B2 (ja) 2014-01-14 2018-05-30 新光電気工業株式会社 配線基板及び半導体パッケージ
JP6279921B2 (ja) 2014-02-12 2018-02-14 新光電気工業株式会社 配線基板及び半導体パッケージ
JP6420966B2 (ja) 2014-04-30 2018-11-07 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP2016062916A (ja) * 2014-09-12 2016-04-25 イビデン株式会社 電子部品搭載用基板及び電子部品搭載用基板の製造方法
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
WO2017147151A1 (en) 2016-02-22 2017-08-31 The Charles Stark Draper Laboratory, Inc. Method of manufacturing an implantable neural electrode interface platform
CN109156080B (zh) * 2016-05-16 2021-10-08 株式会社村田制作所 陶瓷电子部件
JP6185114B2 (ja) * 2016-06-08 2017-08-23 新光電気工業株式会社 配線基板、及び、発光装置
US10283688B2 (en) * 2016-08-22 2019-05-07 Nichia Corporation Light emitting device
US10820455B2 (en) 2016-11-22 2020-10-27 Samsung Display Co., Ltd. Display device
JP7027129B2 (ja) * 2017-11-09 2022-03-01 シチズン電子株式会社 発光装置
CN108401371B (zh) * 2018-04-25 2019-11-26 维沃移动通信有限公司 一种散热结构加工方法及散热结构
JP7083736B2 (ja) * 2018-10-26 2022-06-13 株式会社ジャパンディスプレイ 表示装置
TWI672711B (zh) * 2019-01-10 2019-09-21 健策精密工業股份有限公司 絕緣金屬基板及其製造方法
JP7051725B2 (ja) * 2019-01-24 2022-04-11 大日本印刷株式会社 動植物育成用のｌｅｄ照明シート、動植物育成用のｌｅｄ照明モジュール、動植物の育成棚用の棚板、動植物の育成棚、及び動植物育成工場
DK3915360T3 (da) 2019-01-24 2024-04-29 Dainippon Printing Co Ltd Led-belysningsenhed til dyre- og plantevækst, led-belysningsmodul til dyre- og plantevækst, hylde til et dyre- og plantevækstsstativ, dyre- og plantevækstsstativ, dyre- og plantevækstsfabrik
JP7051732B2 (ja) 2019-02-01 2022-04-11 大日本印刷株式会社 動植物育成用のｌｅｄ照明モジュール、動植物の育成棚、及び動植物育成工場
JP6969657B2 (ja) * 2019-02-01 2021-11-24 大日本印刷株式会社 動植物育成用のｌｅｄ照明シート、動植物育成用のｌｅｄ照明モジュール、動植物の育成棚用の棚板、動植物の育成棚、及び動植物育成工場
JP6953461B2 (ja) * 2019-02-01 2021-10-27 大日本印刷株式会社 動植物育成用のｌｅｄ照明シート、動植物育成用のｌｅｄ照明モジュール、動植物の育成棚用の棚板、動植物の育成棚、及び動植物育成工場
CN112490344A (zh) 2019-09-11 2021-03-12 光宝光电(常州)有限公司 发光封装结构及其制造方法及复合基板
JP7562843B2 (ja) * 2020-08-25 2024-10-07 エルジー イノテック カンパニー リミテッド 半導体パッケージ用樹脂組成物及びこれを含む銅箔付樹脂
JP7385832B2 (ja) * 2020-11-20 2023-11-24 大日本印刷株式会社 動植物育成用のｌｅｄ照明シート、動植物育成用のｌｅｄ照明モジュール、動植物の育成棚用の棚板、動植物の育成棚、及び動植物育成工場
JP7248002B2 (ja) * 2020-11-24 2023-03-29 大日本印刷株式会社 動植物育成用のｌｅｄ照明モジュール、動植物の育成棚、及び動植物育成工場
JP7288610B2 (ja) * 2020-11-24 2023-06-08 大日本印刷株式会社 動植物育成用のｌｅｄ照明シート、動植物育成用のｌｅｄ照明モジュール、動植物の育成棚用の棚板、動植物の育成棚、及び動植物育成工場
US11293627B1 (en) * 2021-02-02 2022-04-05 Gary Lagasse Miniature LED lightbulb mounting device
CN119855335A (zh) * 2021-12-30 2025-04-18 芜湖聚飞光电科技有限公司 一种显示模组
CN121040212A (zh) * 2023-04-20 2025-11-28 株式会社村田制作所 电路基板以及电路基板的制造方法
TWI886947B (zh) * 2024-05-10 2025-06-11 同欣電子工業股份有限公司 高可靠性陶瓷電路板及其製造方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8114325U1 (de) 1981-05-14 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Wärmeableitungsvorrichtung
JP2828358B2 (ja) * 1991-09-20 1998-11-25 沖電気工業株式会社 半導体放熱構造
US6045240A (en) 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
JPH1140901A (ja) * 1997-07-23 1999-02-12 Sharp Corp 回路基板
US6156980A (en) * 1998-06-04 2000-12-05 Delco Electronics Corp. Flip chip on circuit board with enhanced heat dissipation and method therefor
JP2001251040A (ja) * 2000-03-06 2001-09-14 Stanley Electric Co Ltd 高周波用回路基板及びその製造方法
US6710433B2 (en) * 2000-11-15 2004-03-23 Skyworks Solutions, Inc. Leadless chip carrier with embedded inductor
JP3815239B2 (ja) * 2001-03-13 2006-08-30 日本電気株式会社 半導体素子の実装構造及びプリント配線基板
US6411516B1 (en) * 2001-06-15 2002-06-25 Hughes Electronics Corporation Copper slug pedestal for a printed circuit board
JP4067802B2 (ja) 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
JP2003188307A (ja) * 2001-12-19 2003-07-04 Tdk Corp 電力増幅モジュール及び電力増幅モジュール用基板
US6671176B1 (en) * 2002-06-27 2003-12-30 Eastman Kodak Company Method of cooling heat-generating electrical components
JP3996049B2 (ja) * 2002-12-11 2007-10-24 住友ベークライト株式会社 配線板およびその製造方法、並びに、多層配線板
TWI227099B (en) * 2003-03-31 2005-01-21 Siliconware Precision Industries Co Ltd Chip carrier for testing electric performance of passive components and method for testing same
CN100411204C (zh) 2003-06-30 2008-08-13 皇家飞利浦电子股份有限公司 发光二极管热管理系统
US7321098B2 (en) * 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor
US7201497B2 (en) * 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
US7269017B2 (en) * 2004-11-19 2007-09-11 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
US7148554B2 (en) * 2004-12-16 2006-12-12 Delphi Technologies, Inc. Discrete electronic component arrangement including anchoring, thermally conductive pad
US7284882B2 (en) 2005-02-17 2007-10-23 Federal-Mogul World Wide, Inc. LED light module assembly
JP4892241B2 (ja) * 2006-01-11 2012-03-07 ニューパラダイムテクノロジー株式会社 発光素子組込み発光フィルム
US7806574B2 (en) 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
JP2007324330A (ja) * 2006-05-31 2007-12-13 Sanyo Electric Co Ltd 回路基板
JP2008085089A (ja) * 2006-09-28 2008-04-10 Matsushita Electric Ind Co Ltd 樹脂配線基板および半導体装置
US7808013B2 (en) 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
KR101119172B1 (ko) 2007-02-05 2012-03-21 삼성전자주식회사 발광 다이오드 모듈 및 이를 구비한 표시 장치
TWI343233B (en) * 2007-10-19 2011-06-01 Au Optronics Corp Circuit board assembly and backlight module comprising the same
CN101448364A (zh) * 2007-11-26 2009-06-03 同欣电子工业股份有限公司 在陶瓷基板制作小孔径镀铜贯穿孔的方法
JP5545848B2 (ja) * 2010-06-24 2014-07-09 シチズン電子株式会社 半導体発光装置
JP2012019104A (ja) * 2010-07-08 2012-01-26 Mitsubishi Chemicals Corp 発光装置
CN102300397A (zh) * 2011-06-30 2011-12-28 深南电路有限公司 金属基电路板及其制造方法

Also Published As

Publication number Publication date
CN103227263A (zh) 2013-07-31
US20130192880A1 (en) 2013-08-01
EP2621249B1 (en) 2018-12-19
JP2013157441A (ja) 2013-08-15
US9101048B2 (en) 2015-08-04
CN103227263B (zh) 2018-01-12
EP2621249A1 (en) 2013-07-31

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