JP6227755B2 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
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- JP6227755B2 JP6227755B2 JP2016509791A JP2016509791A JP6227755B2 JP 6227755 B2 JP6227755 B2 JP 6227755B2 JP 2016509791 A JP2016509791 A JP 2016509791A JP 2016509791 A JP2016509791 A JP 2016509791A JP 6227755 B2 JP6227755 B2 JP 6227755B2
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Geometry (AREA)
- Ceramic Engineering (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Power Conversion In General (AREA)
Description
図4に示されるように、回路体11は、IGBTやダイオードなどのパワー半導体素子100と、パワー半導体素子100のコレクタ電極と電気的に接続される配線層104Aと、パワー半導体素子100のエミッタ電極と電気的に接続される配線層104Bと、をそれぞれ有する。
配線層104Aおよび配線層104Bは、それぞれIGBTのコレクタ側電極面とエミッタ側電極面に平行に対向して電気的に接続されており、磁界を打ち消すことでインダクタンスを低減した構造となっている。
また、楔31〜34は、AA’(紙面)方向に沿って平行に同一形状を為している。後述するが、これにより、第2凹部41〜44の傾斜角度に対する製造ばらつきが生じても、第2壁側楔面と第1壁側楔面が第2壁と第1壁に一致でき、第1壁302を回路体11〜13に圧縮する面圧の均一性を高めることが可能となる。
Claims (10)
- スイッチング素子を有する回路体と、
第1凹部及び冷却面を形成するベース部材と、
前記ベース部材の前記第1凹部に挿入される楔と、を備え、
前記ベース部材の前記第1凹部は、前記冷却面を形成する基台部と、前記冷却面とは反対側の面に配置された第1壁と、当該第1壁と当該基台部を繋げる中間部と、により形成され、
前記第1壁は、前記楔を挿入させるための挿入空間と、前記回路体の放熱面と伝熱経路を形成する伝熱面と、を形成し、
前記中間部は、前記楔が前記挿入空間に挿入されることにより、前記第1壁が前記回路体の配置方向に向かって変位するように塑性変形し、
前記ベース部材は、引き抜き工法又は押し出し工法によって、前記基台部と前記第1壁と前記中間部とが同一材料で一体に形成され、
前記中間部は、引き抜き方向又は押し出し方向に沿って前記第1壁の一端から他端まで連続で形成される電力変換装置。 - 請求項1に記載の電力変換装置であって、
前記楔は、第1楔と、第2楔と、により構成され、
前記第2楔と対向する第1楔の面を第1面と、前記第1楔と対向する前記第2楔の面を第2面と定義し、
前記第1楔及び前記第2楔は、前記第1面の前記回路体の放熱面に対する傾斜角度が前記第2面の前記回路体の放熱面に対する傾斜角度に対して反転するように形成される電力変換装置。 - 請求項1に記載の電力変換装置であって、
前記楔は、第1楔と、第2楔と、当該第1楔及び当該第2楔との間に配置される第3楔と、により構成され、
前記第3楔が挿入されることにより、前記第1楔と前記第2楔が前記挿入空間を形成する内壁に向かって押圧される電力変換装置。 - 請求項1ないし3に記載のいずれかの電力変換装置であって、
前記ベース部材は、前記回路体を挟んで前記第1壁と対向して配置される第2壁を有し、
前記第2壁には、前記楔を挿入する前記挿入空間を形成しない電力変換装置。 - 請求項1ないし4に記載のいずれかの電力変換装置であって、
前記基台部の前記冷却面と熱的に接続する冷却体を備え、
前記基台部は、前記冷却面と平行に形成されるとともに前記冷却体に固定される第3壁を有する電力変換装置。 - 請求項1ないし4に記載のいずれかの電力変換装置であって、
前記冷却面を形成する前記基台部に対し、空冷フィンが同一材料で一体に形成される電力変換装置。 - 請求項1ないし4に記載のいずれかの電力変換装置であって、
前記基台部には、冷却冷媒を流す流路が形成される電力変換装置。 - 請求項1ないし4に記載のいずれかの電力変換装置であって、
前記第1壁には、冷却冷媒を流す流路が形成される電力変換装置。 - 請求項1ないし8に記載のいずれかの電力変換装置であって、
前記回路体に電流を伝達するバスバーと、
前記ベース部材に支持される樹脂製の支柱部と、を備え、
前記バスバーは、前記支柱部によって支持される電力変換装置。 - 請求項1から9に記載のいずれかの電力変換装置であって、
前記楔及び前記第1壁を覆うゲル材を備える電力変換装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2014/059071 WO2015145711A1 (ja) | 2014-03-28 | 2014-03-28 | 電力変換装置 |
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JPWO2015145711A1 JPWO2015145711A1 (ja) | 2017-04-13 |
JP6227755B2 true JP6227755B2 (ja) | 2017-11-08 |
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JP2016509791A Expired - Fee Related JP6227755B2 (ja) | 2014-03-28 | 2014-03-28 | 電力変換装置 |
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US (1) | US9870974B2 (ja) |
JP (1) | JP6227755B2 (ja) |
WO (1) | WO2015145711A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11827043B2 (en) | 2018-05-11 | 2023-11-28 | Hewlett-Packard Development Company, L.P. | Knockdown for compiling recording media in finisher |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016189674A1 (ja) * | 2015-05-27 | 2016-12-01 | 株式会社日立製作所 | 電力変換装置 |
FR3043880B1 (fr) * | 2015-11-13 | 2017-12-29 | Valeo Systemes De Controle Moteur | Boitier pour un equipement electrique |
JP6696837B2 (ja) * | 2016-06-10 | 2020-05-20 | 古河電気工業株式会社 | 発熱部品の放熱構造 |
KR102164795B1 (ko) * | 2018-09-06 | 2020-10-13 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
US10685900B2 (en) * | 2018-10-22 | 2020-06-16 | Deere & Company | Packaging of a semiconductor device with phase-change material for thermal performance |
JP7156105B2 (ja) * | 2019-03-11 | 2022-10-19 | 株式会社デンソー | 半導体モジュール |
CN113314481B (zh) * | 2020-02-27 | 2023-01-24 | 光宝电子(广州)有限公司 | 晶体管散热模块及其组装方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05166963A (ja) | 1991-12-19 | 1993-07-02 | Fuji Electric Co Ltd | 半導体装置 |
JP2000091485A (ja) * | 1998-07-14 | 2000-03-31 | Denso Corp | 半導体装置 |
JP4039339B2 (ja) * | 2003-08-07 | 2008-01-30 | トヨタ自動車株式会社 | 浸漬式両面放熱パワーモジュール |
JP4667817B2 (ja) | 2004-10-04 | 2011-04-13 | 古河電気工業株式会社 | 発熱体の冷却構造 |
JP4979909B2 (ja) * | 2005-08-19 | 2012-07-18 | 株式会社日立製作所 | 電力変換装置 |
JP2012248700A (ja) | 2011-05-27 | 2012-12-13 | Aisin Aw Co Ltd | 半導体装置 |
-
2014
- 2014-03-28 WO PCT/JP2014/059071 patent/WO2015145711A1/ja active Application Filing
- 2014-03-28 US US15/123,355 patent/US9870974B2/en active Active
- 2014-03-28 JP JP2016509791A patent/JP6227755B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11827043B2 (en) | 2018-05-11 | 2023-11-28 | Hewlett-Packard Development Company, L.P. | Knockdown for compiling recording media in finisher |
Also Published As
Publication number | Publication date |
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JPWO2015145711A1 (ja) | 2017-04-13 |
WO2015145711A1 (ja) | 2015-10-01 |
US9870974B2 (en) | 2018-01-16 |
US20170069562A1 (en) | 2017-03-09 |
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