JP6223426B2 - ヒートパイプをパネルに搭載するための装置および方法 - Google Patents
ヒートパイプをパネルに搭載するための装置および方法 Download PDFInfo
- Publication number
- JP6223426B2 JP6223426B2 JP2015509371A JP2015509371A JP6223426B2 JP 6223426 B2 JP6223426 B2 JP 6223426B2 JP 2015509371 A JP2015509371 A JP 2015509371A JP 2015509371 A JP2015509371 A JP 2015509371A JP 6223426 B2 JP6223426 B2 JP 6223426B2
- Authority
- JP
- Japan
- Prior art keywords
- panel
- heat pipe
- adhesive
- cfrp
- bolt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/506—Heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/20—Fastening; Joining with threaded elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Environmental Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Remote Sensing (AREA)
- Biodiversity & Conservation Biology (AREA)
- Laminated Bodies (AREA)
- Building Environments (AREA)
- Thermal Insulation (AREA)
- Connection Of Plates (AREA)
- Body Structure For Vehicles (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP12275055.7A EP2660155B1 (en) | 2012-04-30 | 2012-04-30 | Apparatus and method for mounting heat pipes to panels |
| EP12275055.7 | 2012-04-30 | ||
| PCT/EP2013/058404 WO2013164226A1 (en) | 2012-04-30 | 2013-04-23 | Apparatus and method for mounting heat pipes to panels |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015522459A JP2015522459A (ja) | 2015-08-06 |
| JP2015522459A5 JP2015522459A5 (cg-RX-API-DMAC7.html) | 2016-04-21 |
| JP6223426B2 true JP6223426B2 (ja) | 2017-11-01 |
Family
ID=48444338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015509371A Expired - Fee Related JP6223426B2 (ja) | 2012-04-30 | 2013-04-23 | ヒートパイプをパネルに搭載するための装置および方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10539372B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2660155B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6223426B2 (cg-RX-API-DMAC7.html) |
| CA (1) | CA2871521A1 (cg-RX-API-DMAC7.html) |
| ES (1) | ES2565009T3 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2013164226A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10225953B2 (en) | 2014-10-31 | 2019-03-05 | Thermal Corp. | Vehicle thermal management system |
| RU2610850C1 (ru) * | 2015-10-08 | 2017-02-16 | Федеральное государственное унитарное предприятие "Российский Федеральный ядерный центр - Всероссийский научно-исследовательский институт экспериментальной физики" (ФГУП "РФЯЦ-ВНИИЭФ") | Приборный отсек космического аппарата |
| WO2017169080A1 (ja) * | 2016-03-31 | 2017-10-05 | 三菱電機株式会社 | ヒートパイプパネルを用いた放熱装置 |
| FR3089854B1 (fr) * | 2018-12-18 | 2022-02-04 | Saint Gobain Performance Plastics France | Procede de preparation d’un materiau composite sous forme de sandwich |
| FR3089957B1 (fr) * | 2018-12-18 | 2020-12-18 | Airbus Defence & Space Sas | Procédé de fixation d’un équipement dissipatif, mur de véhicule spatial et véhicule spatial |
| CN112249370B (zh) * | 2020-10-29 | 2022-10-28 | 上海卫星装备研究所 | 卫星热管调水平装置与卫星 |
| EP4138525A1 (de) * | 2021-08-17 | 2023-02-22 | Airbus S.A.S. | Verfahren zur herstellung eines paneels mit integrierter elektronik |
| DE102022106067B4 (de) * | 2022-03-16 | 2024-08-08 | Burger Automation Technology GmbH | Klebevorrichtung und Verfahren zum Ankleben einer Rohrleitung auf einem plattenförmigen Bauteil |
| CN116573162B (zh) * | 2023-05-29 | 2025-08-22 | 上海宇航系统工程研究所 | 适用于空间站大型对日定向装置的复合材料平面圆盘法兰结构 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5082405A (en) * | 1989-09-13 | 1992-01-21 | Witten Donald W | Potted insert for honeycomb panels |
| JPH0563385A (ja) * | 1991-08-30 | 1993-03-12 | Hitachi Ltd | ヒートパイプ付き電子機器及び計算機 |
| JPH0579969U (ja) | 1992-04-01 | 1993-10-29 | 古河電気工業株式会社 | ヒートパイプ付き回路基板 |
| JP2518140B2 (ja) | 1993-07-12 | 1996-07-24 | 日本電気株式会社 | 人工衛星搭載機器の放熱装置 |
| JPH0853100A (ja) * | 1994-08-10 | 1996-02-27 | Mitsubishi Electric Corp | ヒートパイプ埋め込みハニカムサンドイッチパネル |
| US5806803A (en) * | 1995-11-30 | 1998-09-15 | Hughes Electronics Corporation | Spacecraft radiator cooling system |
| JP3807074B2 (ja) | 1998-01-27 | 2006-08-09 | 石川島播磨重工業株式会社 | Cfrp補強長尺構造物 |
| JP2000039272A (ja) | 1998-07-24 | 2000-02-08 | Fujikura Ltd | ヒートパイプの固定構造 |
| US6938679B1 (en) * | 1998-09-15 | 2005-09-06 | The Boeing Company | Heat transport apparatus |
| US6776220B1 (en) * | 1999-08-19 | 2004-08-17 | Space Systems/Loral, Inc | Spacecraft radiator system using crossing heat pipes |
| JP3726152B2 (ja) | 2000-10-13 | 2005-12-14 | 富士重工業株式会社 | 複合材表皮熱輸送パネルおよびそれを適用したハニカムパネル |
| US6535386B2 (en) * | 2000-12-05 | 2003-03-18 | Intel Corporation | Electronic assembly having a heat pipe that conducts heat from a semiconductor die |
| US20020102384A1 (en) * | 2001-01-29 | 2002-08-01 | Peck Scott O. | Embedded heat pipe sandwich panel constructed using dissimilar materials |
| TW591363B (en) | 2001-10-10 | 2004-06-11 | Aavid Thermalloy Llc | Heat collector with mounting plate |
| JP3952737B2 (ja) | 2001-10-29 | 2007-08-01 | 株式会社日立製作所 | 炭素繊維強化樹脂を用いた構造物 |
| US7117930B2 (en) * | 2002-06-14 | 2006-10-10 | Thermal Corp. | Heat pipe fin stack with extruded base |
| CN1922075B (zh) * | 2004-02-19 | 2012-11-28 | 阿斯特里姆有限公司 | 有效载荷模块 |
| FR2896443B1 (fr) * | 2006-01-25 | 2008-02-29 | Alcatel Sa | Procede de fabrication de panneaux a caloducs et/ou inserts integres maintenus par des languettes |
| US7405937B1 (en) * | 2007-02-16 | 2008-07-29 | Inventec Corporation | Heat sink module for dual heat sources |
| US20100188811A1 (en) * | 2007-07-05 | 2010-07-29 | Aeon Lighting Technology Inc. | Memory cooling device |
| CN101776941B (zh) * | 2009-01-08 | 2013-03-13 | 富准精密工业(深圳)有限公司 | 散热装置 |
| FR2960218B1 (fr) * | 2010-05-21 | 2012-08-03 | Thales Sa | Dispositif de dissipation thermique pour equipement spatial, notamment pour satellite |
| US20130020055A1 (en) * | 2011-07-19 | 2013-01-24 | Asia Vital Components Co., Ltd. | Thermal module structure and manufacturing method thereof |
| JP3171055U (ja) | 2011-07-29 | 2011-10-13 | 崇賢 ▲黄▼ | 排熱器 |
-
2012
- 2012-04-30 ES ES12275055.7T patent/ES2565009T3/es active Active
- 2012-04-30 EP EP12275055.7A patent/EP2660155B1/en not_active Not-in-force
-
2013
- 2013-04-23 WO PCT/EP2013/058404 patent/WO2013164226A1/en not_active Ceased
- 2013-04-23 CA CA2871521A patent/CA2871521A1/en not_active Abandoned
- 2013-04-23 US US14/397,960 patent/US10539372B2/en active Active
- 2013-04-23 JP JP2015509371A patent/JP6223426B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013164226A1 (en) | 2013-11-07 |
| EP2660155B1 (en) | 2015-12-09 |
| CA2871521A1 (en) | 2013-11-07 |
| US10539372B2 (en) | 2020-01-21 |
| EP2660155A1 (en) | 2013-11-06 |
| JP2015522459A (ja) | 2015-08-06 |
| ES2565009T3 (es) | 2016-03-30 |
| US20150122454A1 (en) | 2015-05-07 |
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