JP2015522459A5 - - Google Patents

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Publication number
JP2015522459A5
JP2015522459A5 JP2015509371A JP2015509371A JP2015522459A5 JP 2015522459 A5 JP2015522459 A5 JP 2015522459A5 JP 2015509371 A JP2015509371 A JP 2015509371A JP 2015509371 A JP2015509371 A JP 2015509371A JP 2015522459 A5 JP2015522459 A5 JP 2015522459A5
Authority
JP
Japan
Prior art keywords
heat pipe
insert
bolt
present
lower flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015509371A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015522459A (ja
JP6223426B2 (ja
Filing date
Publication date
Priority claimed from EP12275055.7A external-priority patent/EP2660155B1/en
Application filed filed Critical
Publication of JP2015522459A publication Critical patent/JP2015522459A/ja
Publication of JP2015522459A5 publication Critical patent/JP2015522459A5/ja
Application granted granted Critical
Publication of JP6223426B2 publication Critical patent/JP6223426B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015509371A 2012-04-30 2013-04-23 ヒートパイプをパネルに搭載するための装置および方法 Expired - Fee Related JP6223426B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12275055.7A EP2660155B1 (en) 2012-04-30 2012-04-30 Apparatus and method for mounting heat pipes to panels
EP12275055.7 2012-04-30
PCT/EP2013/058404 WO2013164226A1 (en) 2012-04-30 2013-04-23 Apparatus and method for mounting heat pipes to panels

Publications (3)

Publication Number Publication Date
JP2015522459A JP2015522459A (ja) 2015-08-06
JP2015522459A5 true JP2015522459A5 (cg-RX-API-DMAC7.html) 2016-04-21
JP6223426B2 JP6223426B2 (ja) 2017-11-01

Family

ID=48444338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015509371A Expired - Fee Related JP6223426B2 (ja) 2012-04-30 2013-04-23 ヒートパイプをパネルに搭載するための装置および方法

Country Status (6)

Country Link
US (1) US10539372B2 (cg-RX-API-DMAC7.html)
EP (1) EP2660155B1 (cg-RX-API-DMAC7.html)
JP (1) JP6223426B2 (cg-RX-API-DMAC7.html)
CA (1) CA2871521A1 (cg-RX-API-DMAC7.html)
ES (1) ES2565009T3 (cg-RX-API-DMAC7.html)
WO (1) WO2013164226A1 (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10225953B2 (en) 2014-10-31 2019-03-05 Thermal Corp. Vehicle thermal management system
RU2610850C1 (ru) * 2015-10-08 2017-02-16 Федеральное государственное унитарное предприятие "Российский Федеральный ядерный центр - Всероссийский научно-исследовательский институт экспериментальной физики" (ФГУП "РФЯЦ-ВНИИЭФ") Приборный отсек космического аппарата
WO2017169080A1 (ja) * 2016-03-31 2017-10-05 三菱電機株式会社 ヒートパイプパネルを用いた放熱装置
FR3089854B1 (fr) * 2018-12-18 2022-02-04 Saint Gobain Performance Plastics France Procede de preparation d’un materiau composite sous forme de sandwich
FR3089957B1 (fr) * 2018-12-18 2020-12-18 Airbus Defence & Space Sas Procédé de fixation d’un équipement dissipatif, mur de véhicule spatial et véhicule spatial
CN112249370B (zh) * 2020-10-29 2022-10-28 上海卫星装备研究所 卫星热管调水平装置与卫星
EP4138525A1 (de) * 2021-08-17 2023-02-22 Airbus S.A.S. Verfahren zur herstellung eines paneels mit integrierter elektronik
DE102022106067B4 (de) * 2022-03-16 2024-08-08 Burger Automation Technology GmbH Klebevorrichtung und Verfahren zum Ankleben einer Rohrleitung auf einem plattenförmigen Bauteil
CN116573162B (zh) * 2023-05-29 2025-08-22 上海宇航系统工程研究所 适用于空间站大型对日定向装置的复合材料平面圆盘法兰结构

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082405A (en) * 1989-09-13 1992-01-21 Witten Donald W Potted insert for honeycomb panels
JPH0563385A (ja) * 1991-08-30 1993-03-12 Hitachi Ltd ヒートパイプ付き電子機器及び計算機
JPH0579969U (ja) 1992-04-01 1993-10-29 古河電気工業株式会社 ヒートパイプ付き回路基板
JP2518140B2 (ja) 1993-07-12 1996-07-24 日本電気株式会社 人工衛星搭載機器の放熱装置
JPH0853100A (ja) * 1994-08-10 1996-02-27 Mitsubishi Electric Corp ヒートパイプ埋め込みハニカムサンドイッチパネル
US5806803A (en) * 1995-11-30 1998-09-15 Hughes Electronics Corporation Spacecraft radiator cooling system
JP3807074B2 (ja) 1998-01-27 2006-08-09 石川島播磨重工業株式会社 Ｃｆｒｐ補強長尺構造物
JP2000039272A (ja) 1998-07-24 2000-02-08 Fujikura Ltd ヒートパイプの固定構造
US6938679B1 (en) * 1998-09-15 2005-09-06 The Boeing Company Heat transport apparatus
US6776220B1 (en) * 1999-08-19 2004-08-17 Space Systems/Loral, Inc Spacecraft radiator system using crossing heat pipes
JP3726152B2 (ja) 2000-10-13 2005-12-14 富士重工業株式会社 複合材表皮熱輸送パネルおよびそれを適用したハニカムパネル
US6535386B2 (en) * 2000-12-05 2003-03-18 Intel Corporation Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US20020102384A1 (en) * 2001-01-29 2002-08-01 Peck Scott O. Embedded heat pipe sandwich panel constructed using dissimilar materials
TW591363B (en) 2001-10-10 2004-06-11 Aavid Thermalloy Llc Heat collector with mounting plate
JP3952737B2 (ja) 2001-10-29 2007-08-01 株式会社日立製作所 炭素繊維強化樹脂を用いた構造物
US7117930B2 (en) * 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base
CN1922075B (zh) * 2004-02-19 2012-11-28 阿斯特里姆有限公司 有效载荷模块
FR2896443B1 (fr) * 2006-01-25 2008-02-29 Alcatel Sa Procede de fabrication de panneaux a caloducs et/ou inserts integres maintenus par des languettes
US7405937B1 (en) * 2007-02-16 2008-07-29 Inventec Corporation Heat sink module for dual heat sources
US20100188811A1 (en) * 2007-07-05 2010-07-29 Aeon Lighting Technology Inc. Memory cooling device
CN101776941B (zh) * 2009-01-08 2013-03-13 富准精密工业(深圳)有限公司 散热装置
FR2960218B1 (fr) * 2010-05-21 2012-08-03 Thales Sa Dispositif de dissipation thermique pour equipement spatial, notamment pour satellite
US20130020055A1 (en) * 2011-07-19 2013-01-24 Asia Vital Components Co., Ltd. Thermal module structure and manufacturing method thereof
JP3171055U (ja) 2011-07-29 2011-10-13 崇賢 ▲黄▼ 排熱器

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