JP6222540B2 - 絶縁ゲート型電界効果トランジスタの製造方法 - Google Patents

絶縁ゲート型電界効果トランジスタの製造方法 Download PDF

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JP6222540B2
JP6222540B2 JP2013019159A JP2013019159A JP6222540B2 JP 6222540 B2 JP6222540 B2 JP 6222540B2 JP 2013019159 A JP2013019159 A JP 2013019159A JP 2013019159 A JP2013019159 A JP 2013019159A JP 6222540 B2 JP6222540 B2 JP 6222540B2
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semiconductor layer
layer
substrate
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JP2014150211A5 (enExample
JP2014150211A (ja
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弘治 河合
弘治 河合
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Powdec KK
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/544—Solar cells from Group III-V materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Electrodes Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
JP2013019159A 2013-02-04 2013-02-04 絶縁ゲート型電界効果トランジスタの製造方法 Active JP6222540B2 (ja)

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JP6906427B2 (ja) * 2017-11-09 2021-07-21 株式会社豊田中央研究所 窒化物半導体装置とその製造方法
EP3912184A4 (en) * 2019-01-16 2022-03-02 The Regents of the University of California, A California Corporation Method for removal of devices using a trench
EP4328956A4 (en) * 2021-04-20 2025-03-19 Kyocera Corporation SEMICONDUCTOR SUBSTRATE AND PRODUCTION METHOD AND PRODUCTION DEVICE THEREOF, SEMICONDUCTOR DEVICE AND PRODUCTION METHOD AND PRODUCTION DEVICE FOR SAME, ELECTRONIC APPARATUS
CN119174011A (zh) * 2022-05-24 2024-12-20 株式会社日本显示器 层叠构造体和其制作方法以及包括层叠构造体的半导体装置
US12463033B2 (en) 2022-10-19 2025-11-04 Kyocera Corporation Semiconductor substrate, and manufacturing method and manufacturing apparatus of semiconductor substrate

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* Cited by examiner, † Cited by third party
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JP3036495B2 (ja) * 1997-11-07 2000-04-24 豊田合成株式会社 窒化ガリウム系化合物半導体の製造方法
JP3705142B2 (ja) * 2001-03-27 2005-10-12 ソニー株式会社 窒化物半導体素子及びその作製方法
WO2003012178A1 (fr) * 2001-08-01 2003-02-13 Powdec K.K. Substrat a empilement cristallin, couche cristalline, dispositif et procede de fabrication associe
TWI319893B (en) * 2006-08-31 2010-01-21 Nitride semiconductor substrate, method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate
JP4638958B1 (ja) * 2009-08-20 2011-02-23 株式会社パウデック 半導体素子の製造方法

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